A semi-lumped balun fabricated by low temperature co-fired ceramic

Ching Wen Tang; Chi-Yang Chang

doi:10.1109/MWSYM.2002.1012309

A semi-lumped balun fabricated by low temperature co-fired ceramic

Ching Wen Tang
, Chi-Yang Chang^*

^*Corresponding author for this work

Department of Electrical and Computer Engineering

Research output: Contribution to journal › Conference article › peer-review

51 Scopus citations

Abstract

A new chip-type multi-layer ceramic balun is presented in this paper. This balun is designed in the ISM band and fabricated using low temperature co-fired ceramic (LTCC) technology. It involves the semi-lumped concept and the multi-layer structure to realize the LTCC-MLC balun. The symmetric structure holds the excellent characteristics of phase balance and amplitude balancing. Measured results of the LTCC-MLC balun match well with the computer simulation.

Original language	English
Article number	1012309
Pages (from-to)	2201-2204
Number of pages	4
Journal	IEEE MTT-S International Microwave Symposium Digest
Volume	3
DOIs	https://doi.org/10.1109/MWSYM.2002.1012309
State	Published - 2 Jun 2002
Event	IEEE MTT-S International Microwave Symposium Digest - Seattle, WA, United States Duration: 2 Jun 2002 → 7 Jun 2002

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title = "A semi-lumped balun fabricated by low temperature co-fired ceramic",

abstract = "A new chip-type multi-layer ceramic balun is presented in this paper. This balun is designed in the ISM band and fabricated using low temperature co-fired ceramic (LTCC) technology. It involves the semi-lumped concept and the multi-layer structure to realize the LTCC-MLC balun. The symmetric structure holds the excellent characteristics of phase balance and amplitude balancing. Measured results of the LTCC-MLC balun match well with the computer simulation.",

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journal = "IEEE MTT-S International Microwave Symposium Digest",

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AU - Tang, Ching Wen

AU - Chang, Chi-Yang

PY - 2002/6/2

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N2 - A new chip-type multi-layer ceramic balun is presented in this paper. This balun is designed in the ISM band and fabricated using low temperature co-fired ceramic (LTCC) technology. It involves the semi-lumped concept and the multi-layer structure to realize the LTCC-MLC balun. The symmetric structure holds the excellent characteristics of phase balance and amplitude balancing. Measured results of the LTCC-MLC balun match well with the computer simulation.

AB - A new chip-type multi-layer ceramic balun is presented in this paper. This balun is designed in the ISM band and fabricated using low temperature co-fired ceramic (LTCC) technology. It involves the semi-lumped concept and the multi-layer structure to realize the LTCC-MLC balun. The symmetric structure holds the excellent characteristics of phase balance and amplitude balancing. Measured results of the LTCC-MLC balun match well with the computer simulation.

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U2 - 10.1109/MWSYM.2002.1012309

DO - 10.1109/MWSYM.2002.1012309

M3 - Conference article

AN - SCOPUS:0036069712

SN - 0149-645X

VL - 3

SP - 2201

EP - 2204

JO - IEEE MTT-S International Microwave Symposium Digest

JF - IEEE MTT-S International Microwave Symposium Digest

M1 - 1012309

T2 - IEEE MTT-S International Microwave Symposium Digest

Y2 - 2 June 2002 through 7 June 2002

ER -

A semi-lumped balun fabricated by low temperature co-fired ceramic

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