A novel wafer reclaim method for amorphous SiC and carbon doped oxide films

Bing-Yue Tsui*, Kuo Lung Fang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

6 Scopus citations


Amorphous SiC (a-SiC) films are the most promising dielectric diffusion barriers to replace silicon nitride in Cu-interconnect technology. However, reclaim of wafers with a-SiC films is a challenge issue for mass production. In this paper, a novel wafer reclaim method is proposed. It is observed that a-SiC can be oxidized to SiO 2 in both dry O 2 and steam ambients at temperatures as low as 550°C. The oxidation mechanism can be described by the Deal-Grove model that is traditionally used to describe oxidation of Si. Experiments prove that the oxidation process is clean and uniform. It is also observed that carbon doped oxide (CDO) films can be oxidized easily, too. Therefore, oxidation followed by HF etching could be a universal process to reclaim wafers deposited with a-SiC or CDO films. Since the oxidation rate of Si substrates at medium temperatures is much lower than that of a-SiC and CDO films, the oxidation process is virtually self-limiting. Compared with a traditional reclaim method based on wafer polishing, this universal oxidation-etching method exhibits great benefits in terms of low cost, high throughput, and the ability to perform nearly unlimited numbers of reclaim cycles.

Original languageEnglish
Pages (from-to)716-719
Number of pages4
JournalIEEE Transactions on Semiconductor Manufacturing
Issue number4
StatePublished - 1 Nov 2005


  • Amorphous silicon carbide
  • Low dielectric constant
  • Wafer reclaim


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