A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications

Yuan Chiu Huang; Yu Xian Lin; Chien Kang Hsiung; Yu Tao Yang; Tzu Heng Hung; Kuan Neng Chen

doi:10.1109/LED.2024.3352252

A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications

Yuan Chiu Huang, Yu Xian Lin, Chien Kang Hsiung, Yu Tao Yang, Tzu Heng Hung, Kuan Neng Chen^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

To minimize warpage in the multilayer-RDL interposers, a novel approach called hyper RDL (HRDL) is proposed. The HRDL utilizes a low temperature hybrid bonding method to stack RDL layers, reducing the warpage by at least 20X as compared to the conventional semi-additive processes (SAP). The HRDL based on polymer-based hybrid bonding was demonstrated as low as 180 °C under atmosphere with a bonding strength of 47.83 kgf/cm2. Both the thermal cycling of 1000 cycles and the un-biased highly accelerated stress test of 168 hours showed less than 1.5% change in electrical resistance. The HRDL process flow is designed to ensure reasonable running costs without the need for polymer chemical mechanical planarization (CMP). This innovative approach leads to a low-warpage RDL interposer platform for advanced packaging applications.

Original language	English
Pages (from-to)	452-455
Number of pages	4
Journal	Ieee Electron Device Letters
Volume	45
Issue number	3
DOIs	https://doi.org/10.1109/LED.2024.3352252
State	Published - 1 Mar 2024

Keywords

3DIC
RDL interposer
advanced packaging
hybrid bonding
low temperature

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10.1109/LED.2024.3352252

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title = "A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications",

abstract = "To minimize warpage in the multilayer-RDL interposers, a novel approach called hyper RDL (HRDL) is proposed. The HRDL utilizes a low temperature hybrid bonding method to stack RDL layers, reducing the warpage by at least 20X as compared to the conventional semi-additive processes (SAP). The HRDL based on polymer-based hybrid bonding was demonstrated as low as 180 °C under atmosphere with a bonding strength of 47.83 kgf/cm2. Both the thermal cycling of 1000 cycles and the un-biased highly accelerated stress test of 168 hours showed less than 1.5% change in electrical resistance. The HRDL process flow is designed to ensure reasonable running costs without the need for polymer chemical mechanical planarization (CMP). This innovative approach leads to a low-warpage RDL interposer platform for advanced packaging applications.",

keywords = "3DIC, RDL interposer, advanced packaging, hybrid bonding, low temperature",

author = "Huang, {Yuan Chiu} and Lin, {Yu Xian} and Hsiung, {Chien Kang} and Yang, {Yu Tao} and Hung, {Tzu Heng} and Chen, {Kuan Neng}",

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doi = "10.1109/LED.2024.3352252",

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AU - Yang, Yu Tao

AU - Hung, Tzu Heng

AU - Chen, Kuan Neng

PY - 2024/3/1

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N2 - To minimize warpage in the multilayer-RDL interposers, a novel approach called hyper RDL (HRDL) is proposed. The HRDL utilizes a low temperature hybrid bonding method to stack RDL layers, reducing the warpage by at least 20X as compared to the conventional semi-additive processes (SAP). The HRDL based on polymer-based hybrid bonding was demonstrated as low as 180 °C under atmosphere with a bonding strength of 47.83 kgf/cm2. Both the thermal cycling of 1000 cycles and the un-biased highly accelerated stress test of 168 hours showed less than 1.5% change in electrical resistance. The HRDL process flow is designed to ensure reasonable running costs without the need for polymer chemical mechanical planarization (CMP). This innovative approach leads to a low-warpage RDL interposer platform for advanced packaging applications.

AB - To minimize warpage in the multilayer-RDL interposers, a novel approach called hyper RDL (HRDL) is proposed. The HRDL utilizes a low temperature hybrid bonding method to stack RDL layers, reducing the warpage by at least 20X as compared to the conventional semi-additive processes (SAP). The HRDL based on polymer-based hybrid bonding was demonstrated as low as 180 °C under atmosphere with a bonding strength of 47.83 kgf/cm2. Both the thermal cycling of 1000 cycles and the un-biased highly accelerated stress test of 168 hours showed less than 1.5% change in electrical resistance. The HRDL process flow is designed to ensure reasonable running costs without the need for polymer chemical mechanical planarization (CMP). This innovative approach leads to a low-warpage RDL interposer platform for advanced packaging applications.

KW - 3DIC

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A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications

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