A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications

Yuan Chiu Huang, Yu Xian Lin, Chien Kang Hsiung, Yu Tao Yang, Tzu Heng Hung, Kuan Neng Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

To minimize warpage in the multilayer-RDL interposers, a novel approach called hyper RDL (HRDL) is proposed. The HRDL utilizes a low temperature hybrid bonding method to stack RDL layers, reducing the warpage by at least 20X as compared to the conventional semi-additive processes (SAP). The HRDL based on polymer-based hybrid bonding was demonstrated as low as 180 °C under atmosphere with a bonding strength of 47.83 kgf/cm2. Both the thermal cycling of 1000 cycles and the un-biased highly accelerated stress test of 168 hours showed less than 1.5% change in electrical resistance. The HRDL process flow is designed to ensure reasonable running costs without the need for polymer chemical mechanical planarization (CMP). This innovative approach leads to a low-warpage RDL interposer platform for advanced packaging applications.

Original languageEnglish
Pages (from-to)452-455
Number of pages4
JournalIeee Electron Device Letters
Volume45
Issue number3
DOIs
StatePublished - 1 Mar 2024

Keywords

  • 3DIC
  • RDL interposer
  • advanced packaging
  • hybrid bonding
  • low temperature

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