@inproceedings{1040e23233cf4bdcaf6a46fb80486d5d,
title = "A Novel Low-Temperature Cu-Cu Direct Bonding with Cr Wetting Layer and Au Passivation Layer",
abstract = "In this study, Cu-Cu direct bonding at the ultra-low bonding temperature has been successfully demonstrated by using the Cr/Au layer, which can protect Cu from oxidation before the thermocompression bonding (TCB) process and greatly improve the diffusion of Cu atoms into the surface during the thermal process. The bonding quality has been carefully investigated by analyzing Auger depth, observing the SAT, AFM, SEM images, and measuring electrical performance of the samples. In addition, the mechanical test and reliability test have been performed to verify the reliability of the novel structure with the Cr/Au layer in this study.",
keywords = "3D IC, bonding, chip-to-chip, low temperature, wafer-to-wafer",
author = "Demin Liu and Chen, {Po Chih} and Kuan-Neng Chen",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE. Copyright: Copyright 2020 Elsevier B.V., All rights reserved.; 70th IEEE Electronic Components and Technology Conference, ECTC 2020 ; Conference date: 03-06-2020 Through 30-06-2020",
year = "2020",
month = jun,
doi = "10.1109/ECTC32862.2020.00209",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1322--1327",
booktitle = "Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020",
address = "美國",
}