A novel array-based test methodology for local process variation monitoring

Tseng Chin Luo; Chia-Tso Chao; Michael S.Y. Wu; Kuo Tsai Li; Chin C. Hsia; Huan Chi Tseng; Chuen Uan Huang; Yuan Yao Chang; Samuel C. Pan; Konrad K.L. Young

doi:10.1109/TEST.2009.5355656

A novel array-based test methodology for local process variation monitoring

Tseng Chin Luo^*, Chia-Tso Chao, Michael S.Y. Wu, Kuo Tsai Li, Chin C. Hsia, Huan Chi Tseng, Chuen Uan Huang, Yuan Yao Chang, Samuel C. Pan, Konrad K.L. Young

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5 Scopus citations

Abstract

As process technologies continually advance, local process variation has greatly increased and gradually become one of the most critical factors for IC manufacturing. To monitor local process variation, a large number of DUTs (deviceunder- test) in close proximity must be measured. In this paper, we presents a novel array-based test structure to characterize local process variation with limited area overhead. The proposed test structure can guarantee high measurement accuracy by utilizing the proposed hardware IR compensation and voltage bias elevation. Furthermore, the DUT layout need not be modified for the proposed test structure so that the measured variation exactly reflects the reality in the manufacturing environment. The measured results from the few most advanced process-technology nodes demonstrate the effectiveness and efficiency of the proposed test structure in quantifying local process variation.

Original language	English
Title of host publication	International Test Conference, ITC 2009 - Proceedings
DOIs	https://doi.org/10.1109/TEST.2009.5355656
State	Published - 15 Dec 2009
Event	International Test Conference, ITC 2009 - Austin, TX, United States Duration: 1 Nov 2009 → 6 Nov 2009

Publication series

Name	Proceedings - International Test Conference
ISSN (Print)	1089-3539

Conference

Conference	International Test Conference, ITC 2009
Country/Territory	United States
City	Austin, TX
Period	1/11/09 → 6/11/09

Access to Document

10.1109/TEST.2009.5355656

Cite this

Luo, T. C., Chao, C.-T., Wu, M. S. Y., Li, K. T., Hsia, C. C., Tseng, H. C., Huang, C. U., Chang, Y. Y., Pan, S. C., & Young, K. K. L. (2009). A novel array-based test methodology for local process variation monitoring. In International Test Conference, ITC 2009 - Proceedings Article 5355656 (Proceedings - International Test Conference). https://doi.org/10.1109/TEST.2009.5355656

@inproceedings{ee4fba7059774c5289425d0008f1aae2,

title = "A novel array-based test methodology for local process variation monitoring",

abstract = "As process technologies continually advance, local process variation has greatly increased and gradually become one of the most critical factors for IC manufacturing. To monitor local process variation, a large number of DUTs (deviceunder- test) in close proximity must be measured. In this paper, we presents a novel array-based test structure to characterize local process variation with limited area overhead. The proposed test structure can guarantee high measurement accuracy by utilizing the proposed hardware IR compensation and voltage bias elevation. Furthermore, the DUT layout need not be modified for the proposed test structure so that the measured variation exactly reflects the reality in the manufacturing environment. The measured results from the few most advanced process-technology nodes demonstrate the effectiveness and efficiency of the proposed test structure in quantifying local process variation.",

author = "Luo, {Tseng Chin} and Chia-Tso Chao and Wu, {Michael S.Y.} and Li, {Kuo Tsai} and Hsia, {Chin C.} and Tseng, {Huan Chi} and Huang, {Chuen Uan} and Chang, {Yuan Yao} and Pan, {Samuel C.} and Young, {Konrad K.L.}",

year = "2009",

month = dec,

day = "15",

doi = "10.1109/TEST.2009.5355656",

language = "English",

isbn = "9781424448678",

series = "Proceedings - International Test Conference",

booktitle = "International Test Conference, ITC 2009 - Proceedings",

note = "International Test Conference, ITC 2009 ; Conference date: 01-11-2009 Through 06-11-2009",

}

Luo, TC, Chao, C-T, Wu, MSY, Li, KT, Hsia, CC, Tseng, HC, Huang, CU, Chang, YY, Pan, SC & Young, KKL 2009, A novel array-based test methodology for local process variation monitoring. in International Test Conference, ITC 2009 - Proceedings., 5355656, Proceedings - International Test Conference, International Test Conference, ITC 2009, Austin, TX, United States, 1/11/09. https://doi.org/10.1109/TEST.2009.5355656

TY - GEN

T1 - A novel array-based test methodology for local process variation monitoring

AU - Luo, Tseng Chin

AU - Chao, Chia-Tso

AU - Wu, Michael S.Y.

AU - Li, Kuo Tsai

AU - Hsia, Chin C.

AU - Tseng, Huan Chi

AU - Huang, Chuen Uan

AU - Chang, Yuan Yao

AU - Pan, Samuel C.

AU - Young, Konrad K.L.

PY - 2009/12/15

Y1 - 2009/12/15

N2 - As process technologies continually advance, local process variation has greatly increased and gradually become one of the most critical factors for IC manufacturing. To monitor local process variation, a large number of DUTs (deviceunder- test) in close proximity must be measured. In this paper, we presents a novel array-based test structure to characterize local process variation with limited area overhead. The proposed test structure can guarantee high measurement accuracy by utilizing the proposed hardware IR compensation and voltage bias elevation. Furthermore, the DUT layout need not be modified for the proposed test structure so that the measured variation exactly reflects the reality in the manufacturing environment. The measured results from the few most advanced process-technology nodes demonstrate the effectiveness and efficiency of the proposed test structure in quantifying local process variation.

AB - As process technologies continually advance, local process variation has greatly increased and gradually become one of the most critical factors for IC manufacturing. To monitor local process variation, a large number of DUTs (deviceunder- test) in close proximity must be measured. In this paper, we presents a novel array-based test structure to characterize local process variation with limited area overhead. The proposed test structure can guarantee high measurement accuracy by utilizing the proposed hardware IR compensation and voltage bias elevation. Furthermore, the DUT layout need not be modified for the proposed test structure so that the measured variation exactly reflects the reality in the manufacturing environment. The measured results from the few most advanced process-technology nodes demonstrate the effectiveness and efficiency of the proposed test structure in quantifying local process variation.

UR - http://www.scopus.com/inward/record.url?scp=76549089933&partnerID=8YFLogxK

U2 - 10.1109/TEST.2009.5355656

DO - 10.1109/TEST.2009.5355656

M3 - Conference contribution

AN - SCOPUS:76549089933

SN - 9781424448678

T3 - Proceedings - International Test Conference

BT - International Test Conference, ITC 2009 - Proceedings

T2 - International Test Conference, ITC 2009

Y2 - 1 November 2009 through 6 November 2009

ER -

A novel array-based test methodology for local process variation monitoring

Abstract

Publication series

Conference

Access to Document

Other files and links

Fingerprint

Cite this