A novel array-based test methodology for local process variation monitoring

Tseng Chin Luo*, Chia-Tso Chao, Michael S.Y. Wu, Kuo Tsai Li, Chin C. Hsia, Huan Chi Tseng, Chuen Uan Huang, Yuan Yao Chang, Samuel C. Pan, Konrad K.L. Young

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    5 Scopus citations


    As process technologies continually advance, local process variation has greatly increased and gradually become one of the most critical factors for IC manufacturing. To monitor local process variation, a large number of DUTs (deviceunder- test) in close proximity must be measured. In this paper, we presents a novel array-based test structure to characterize local process variation with limited area overhead. The proposed test structure can guarantee high measurement accuracy by utilizing the proposed hardware IR compensation and voltage bias elevation. Furthermore, the DUT layout need not be modified for the proposed test structure so that the measured variation exactly reflects the reality in the manufacturing environment. The measured results from the few most advanced process-technology nodes demonstrate the effectiveness and efficiency of the proposed test structure in quantifying local process variation.

    Original languageEnglish
    Title of host publicationInternational Test Conference, ITC 2009 - Proceedings
    StatePublished - 15 Dec 2009
    EventInternational Test Conference, ITC 2009 - Austin, TX, United States
    Duration: 1 Nov 20096 Nov 2009

    Publication series

    NameProceedings - International Test Conference
    ISSN (Print)1089-3539


    ConferenceInternational Test Conference, ITC 2009
    Country/TerritoryUnited States
    CityAustin, TX


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