Abstract
A superior oxide/nitride/oxide (ONO) gate stack was demonstrated. High density plasma chemical vapor deposition was used to deposit the silicon nitride layer instead of the conventional low-pressure chemical vapor deposition for silicon/oxide/nitride/oxide/silicon technology. The densified nitride layer was performed by high-temperature dry oxidation to form a thermally grown blocking oxide layer on the silicon nitride rather than a deposited oxide layer. The ONO gate stack shows large memory window, high breakdown voltage, and reliable endurance characteristics, which is a potential candidate for future nonvolatile memory technology.
Original language | English |
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Pages (from-to) | G138-G140 |
Number of pages | 3 |
Journal | Electrochemical and Solid-State Letters |
Volume | 7 |
Issue number | 7 |
DOIs | |
State | Published - 2004 |