@inproceedings{3374854298b346d28913a676c9ea4c3d,
title = "A low-power wireless bondwire inertial sensor system",
abstract = "This paper presents the design and implementation of a fully-integrated CMOS accelerometer using bondwires as sensing devices without Micro Electro-Mechanical Systems (MEMS) processes. The model and analysis of bondwire inertial sensors are provided for further implementation of low-power and low-noise accelerometers. Finite element method (FEM) simulation is performed to verify the concept and model. This paper also proposes a closed-loop readout interface that suppresses the in-band noise and reduces both design complexity and power consumption. The bondwire accelerometer is fabricated in a 0.18 μm CMOS process, achieves a 33 mV/g linear transducer gain within a 5 kHz bandwidth, and consumes 9 mW.",
keywords = "Accelerometer, Bondwire, CMOS integration, Inertial sensor",
author = "Huang, {Shih Chieh} and Lu, {Shao Yung} and Cheng, {Fu Yuan} and Tsai, {Tsung Heng} and Yu-Te Liao",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 14th IEEE SENSORS ; Conference date: 01-11-2015 Through 04-11-2015",
year = "2015",
month = nov,
day = "1",
doi = "10.1109/ICSENS.2015.7370286",
language = "English",
series = "2015 IEEE SENSORS - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2015 IEEE SENSORS - Proceedings",
address = "美國",
}