A low noise and robust 3D system-in-package test scheme for highly integrated biomedical systems

Chia Yi Lin; Wai-Chi Fang; Hung-Ming Chen; Zong Han Hsieh; Chiu Kuo Chen

doi:10.1109/LISSA.2011.5754142

A low noise and robust 3D system-in-package test scheme for highly integrated biomedical systems

Chia Yi Lin^*, Wai-Chi Fang, Hung-Ming Chen, Zong Han Hsieh, Chiu Kuo Chen

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

In this paper, a low noise and robust test scheme for 3D stacked integrated circuits based on modified standard IEEE 1149.4 has been proposed. Through the modified standard, this novel test scheme can be more robust to fulfill the microsystem integration requirements. This test scheme also makes the analog pins more observable and testable during and after the integration. The proposed test scheme is validated with preliminary results. This invention provides a useful test method to guide system designers to achieve a low noise and robust test scheme while designing system specifications.

Original language	English
Title of host publication	Proceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011
Pages	9-13
Number of pages	5
DOIs	https://doi.org/10.1109/LISSA.2011.5754142
State	Published - 23 May 2011
Event	2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011 - Bethesda, MD, United States Duration: 7 Apr 2011 → 8 Apr 2011

Publication series

Name	Proceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011

Conference

Conference	2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011
Country/Territory	United States
City	Bethesda, MD
Period	7/04/11 → 8/04/11

Keywords

Low noise
Robust
System-in-Package
Test scheme

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10.1109/LISSA.2011.5754142

Cite this

Lin, C. Y., Fang, W-C., Chen, H-M., Hsieh, Z. H., & Chen, C. K. (2011). A low noise and robust 3D system-in-package test scheme for highly integrated biomedical systems. In Proceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011 (pp. 9-13). Article 5754142 (Proceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011). https://doi.org/10.1109/LISSA.2011.5754142

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title = "A low noise and robust 3D system-in-package test scheme for highly integrated biomedical systems",

abstract = "In this paper, a low noise and robust test scheme for 3D stacked integrated circuits based on modified standard IEEE 1149.4 has been proposed. Through the modified standard, this novel test scheme can be more robust to fulfill the microsystem integration requirements. This test scheme also makes the analog pins more observable and testable during and after the integration. The proposed test scheme is validated with preliminary results. This invention provides a useful test method to guide system designers to achieve a low noise and robust test scheme while designing system specifications.",

keywords = "Low noise, Robust, System-in-Package, Test scheme",

author = "Lin, {Chia Yi} and Wai-Chi Fang and Hung-Ming Chen and Hsieh, {Zong Han} and Chen, {Chiu Kuo}",

year = "2011",

month = may,

day = "23",

doi = "10.1109/LISSA.2011.5754142",

language = "English",

isbn = "9781457704208",

series = "Proceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011",

pages = "9--13",

booktitle = "Proceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011",

note = "2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011 ; Conference date: 07-04-2011 Through 08-04-2011",

}

Lin, CY, Fang, W-C , Chen, H-M, Hsieh, ZH & Chen, CK 2011, A low noise and robust 3D system-in-package test scheme for highly integrated biomedical systems. in Proceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011., 5754142, Proceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011, pp. 9-13, 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011, Bethesda, MD, United States, 7/04/11. https://doi.org/10.1109/LISSA.2011.5754142

A low noise and robust 3D system-in-package test scheme for highly integrated biomedical systems. / Lin, Chia Yi; Fang, Wai-Chi ; Chen, Hung-Ming et al.
Proceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011. 2011. p. 9-13 5754142 (Proceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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Lin CY, Fang W-C , Chen H-M, Hsieh ZH, Chen CK. A low noise and robust 3D system-in-package test scheme for highly integrated biomedical systems. In Proceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011. 2011. p. 9-13. 5754142. (Proceedings of the 2011 IEEE/NIH Life Science Systems and Applications Workshop, LiSSA 2011). doi: 10.1109/LISSA.2011.5754142

A low noise and robust 3D system-in-package test scheme for highly integrated biomedical systems

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