Fingerprint
Dive into the research topics of 'A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-Deposited Cu3N'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-Deposited Cu3N
- Tzu Heng Hung
- , Ping Jung Liu
- , Chiao Yen Wang
- , Tsai Fu Chung
- , Kuan Neng Chen*
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
2
Scopus
citations