A liquid-based gravity-driven etching-stop technique and its application to wafer level cantilever thickness control of AFM probes

Wei Chih Lin; Chao Chiun Liang; Ching Hsiang Tsai; Chien-Wen Hsieh; Lung Jieh Yang

doi:10.1109/MEMSYS.2005.1453976

A liquid-based gravity-driven etching-stop technique and its application to wafer level cantilever thickness control of AFM probes

Wei Chih Lin^*, Chao Chiun Liang, Ching Hsiang Tsai, Chien-Wen Hsieh, Lung Jieh Yang

^*Corresponding author for this work

Institute of Lighting and Energy Photonics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

This paper mainly describes a liquid-based gravity-driven etching-stop technique used for cantilever thickness control of Atomic Force Microscope (AFM) probes on the wafer level. The technique makes use of the method of opposite etching trenches or the depth rulers. A pair of opposite trenches surrounds several AFM probes on both sides of the wafer to form probe chips. The trench depth on the cantilever front-side is equal to the designed thickness of cantilevers. In the final step of the fabrication process for AFM probes, the wafer is etched by the KOH etchant to form the probe handles. The probe chips will be separated from the wafer simultaneously with the penetration of wafers at the trenches. The separated probes fall into the Diiodomethane (CH ₂I₂) solution beneath the KOH etchant and the wet-etching stops automatically. The cantilever thickness of the AFM probes can then be wafer-level controlled by the proposed etching-stop technique.

Original language	English
Title of host publication	Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest
Pages	500-503
Number of pages	4
DOIs	https://doi.org/10.1109/MEMSYS.2005.1453976
State	Published - 2005
Event	18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Miami Beach, FL, United States Duration: 30 Jan 2005 → 3 Feb 2005

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Conference

Conference	18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami
Country/Territory	United States
City	Miami Beach, FL
Period	30/01/05 → 3/02/05

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10.1109/MEMSYS.2005.1453976

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Lin, W. C., Liang, C. C., Tsai, C. H., Hsieh, C.-W., & Yang, L. J. (2005). A liquid-based gravity-driven etching-stop technique and its application to wafer level cantilever thickness control of AFM probes. In Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest (pp. 500-503). Article TPb19 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2005.1453976

Lin, Wei Chih ; Liang, Chao Chiun ; Tsai, Ching Hsiang et al. / A liquid-based gravity-driven etching-stop technique and its application to wafer level cantilever thickness control of AFM probes. Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest. 2005. pp. 500-503 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

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title = "A liquid-based gravity-driven etching-stop technique and its application to wafer level cantilever thickness control of AFM probes",

abstract = "This paper mainly describes a liquid-based gravity-driven etching-stop technique used for cantilever thickness control of Atomic Force Microscope (AFM) probes on the wafer level. The technique makes use of the method of opposite etching trenches or the depth rulers. A pair of opposite trenches surrounds several AFM probes on both sides of the wafer to form probe chips. The trench depth on the cantilever front-side is equal to the designed thickness of cantilevers. In the final step of the fabrication process for AFM probes, the wafer is etched by the KOH etchant to form the probe handles. The probe chips will be separated from the wafer simultaneously with the penetration of wafers at the trenches. The separated probes fall into the Diiodomethane (CH 2I2) solution beneath the KOH etchant and the wet-etching stops automatically. The cantilever thickness of the AFM probes can then be wafer-level controlled by the proposed etching-stop technique.",

author = "Lin, {Wei Chih} and Liang, {Chao Chiun} and Tsai, {Ching Hsiang} and Chien-Wen Hsieh and Yang, {Lung Jieh}",

year = "2005",

doi = "10.1109/MEMSYS.2005.1453976",

language = "English",

isbn = "0780387325",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

pages = "500--503",

booktitle = "Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest",

note = "18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami ; Conference date: 30-01-2005 Through 03-02-2005",

}

Lin, WC, Liang, CC, Tsai, CH, Hsieh, C-W & Yang, LJ 2005, A liquid-based gravity-driven etching-stop technique and its application to wafer level cantilever thickness control of AFM probes. in Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest., TPb19, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 500-503, 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami, Miami Beach, FL, United States, 30/01/05. https://doi.org/10.1109/MEMSYS.2005.1453976

A liquid-based gravity-driven etching-stop technique and its application to wafer level cantilever thickness control of AFM probes. / Lin, Wei Chih; Liang, Chao Chiun; Tsai, Ching Hsiang et al.
Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest. 2005. p. 500-503 TPb19 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Lin, Wei Chih

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AU - Tsai, Ching Hsiang

AU - Hsieh, Chien-Wen

AU - Yang, Lung Jieh

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N2 - This paper mainly describes a liquid-based gravity-driven etching-stop technique used for cantilever thickness control of Atomic Force Microscope (AFM) probes on the wafer level. The technique makes use of the method of opposite etching trenches or the depth rulers. A pair of opposite trenches surrounds several AFM probes on both sides of the wafer to form probe chips. The trench depth on the cantilever front-side is equal to the designed thickness of cantilevers. In the final step of the fabrication process for AFM probes, the wafer is etched by the KOH etchant to form the probe handles. The probe chips will be separated from the wafer simultaneously with the penetration of wafers at the trenches. The separated probes fall into the Diiodomethane (CH 2I2) solution beneath the KOH etchant and the wet-etching stops automatically. The cantilever thickness of the AFM probes can then be wafer-level controlled by the proposed etching-stop technique.

AB - This paper mainly describes a liquid-based gravity-driven etching-stop technique used for cantilever thickness control of Atomic Force Microscope (AFM) probes on the wafer level. The technique makes use of the method of opposite etching trenches or the depth rulers. A pair of opposite trenches surrounds several AFM probes on both sides of the wafer to form probe chips. The trench depth on the cantilever front-side is equal to the designed thickness of cantilevers. In the final step of the fabrication process for AFM probes, the wafer is etched by the KOH etchant to form the probe handles. The probe chips will be separated from the wafer simultaneously with the penetration of wafers at the trenches. The separated probes fall into the Diiodomethane (CH 2I2) solution beneath the KOH etchant and the wet-etching stops automatically. The cantilever thickness of the AFM probes can then be wafer-level controlled by the proposed etching-stop technique.

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Lin WC, Liang CC, Tsai CH, Hsieh CW, Yang LJ. A liquid-based gravity-driven etching-stop technique and its application to wafer level cantilever thickness control of AFM probes. In Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest. 2005. p. 500-503. TPb19. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2005.1453976

A liquid-based gravity-driven etching-stop technique and its application to wafer level cantilever thickness control of AFM probes

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