@inproceedings{6540cf9f516b42a881e6a769c2cc9769,
title = "A Ka- to W-Band Tightly Coupled Array Antenna-in-Package Using Glass IPD for Ultrawideband mmWave Wireless Communication",
abstract = "This paper presents the broadband communication capability of a millimeter-wave (mmWave) ultrawideband tightly coupled array (TCA) antenna based on high-density interconnect (HDI) antenna-in-package (AiP) technology. The essential antenna array elements are crafted using glass-based integrated passive devices (IPDs) and are subsequently flip-chipped on a multilayered HDI printed circuit board (PCB). The antenna features a wide impedance bandwidth from Ka- to W-band, suiting applications that demand a large signal bandwidth.",
keywords = "6G, Tightly coupled array (TCA), antenna-in-package (AiP), beyound 5G (B5G), integrated passive device (IPD), metamaterial (MTM), millimeter-wave (mmWave), ultrawideband, wireless communication",
author = "Chiang, {Ching Wen} and Neda Khiabani and Donglin Gao and Kuo, {Chien Nan} and Kuan, {Yen Cheng} and Wu, {Chung Tse Michael}",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 2024 IEEE International Symposium on Circuits and Systems, ISCAS 2024 ; Conference date: 19-05-2024 Through 22-05-2024",
year = "2024",
doi = "10.1109/ISCAS58744.2024.10558344",
language = "English",
series = "Proceedings - IEEE International Symposium on Circuits and Systems",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "ISCAS 2024 - IEEE International Symposium on Circuits and Systems",
address = "美國",
}