A hybrid bonding interconnection with a novel low-temperature bonding polymer system

Yu Min Lin*, Po Chih Chang, Ou Hsiang Lee, Wei Lan Chiu, Tao Chih Chang, Hsiang Hung Chang, Chia Hsin Lee, Baron Huang, Mei Dong, Duo Tsai, Chang Chun Lee, Kuan Neng Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

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Chemical Compounds

Engineering & Materials Science