TY - GEN
T1 - A highly integrated biomedical multiprocessor SoC design for a wireless bedside monitoring system
AU - Lin, Kuen Chih
AU - Liao, Jui Chieh
AU - Fang, Wai-Chi
PY - 2014/1/1
Y1 - 2014/1/1
N2 - This paper presents a highly integrated multiprocessor system-on-chip (SoC) design, enabling real-time processing of multi-biomedical signals in a wireless bedside monitoring system. This system includes a real-time online recursive independent component analysis (ORICA) processor to automatically remove brain electroencephalogram (EEG) artifacts signals, a heart rate variability (HRV) analysis processor for monitoring electrocardiogram (ECG) signals, and a basic biomedical signal processor for monitoring common physiological data such as oxygen saturation, blood pressure, or body temperature. The multiprocessor chip is fabricated using TSMC 90 nm CMOS technology, and occupies a core area of 1,600 × 1,600 um2. Simulated power consumption is 15.89 mW under the conditions of 1.0V core supply voltage and 64 MHz clock operation frequency.
AB - This paper presents a highly integrated multiprocessor system-on-chip (SoC) design, enabling real-time processing of multi-biomedical signals in a wireless bedside monitoring system. This system includes a real-time online recursive independent component analysis (ORICA) processor to automatically remove brain electroencephalogram (EEG) artifacts signals, a heart rate variability (HRV) analysis processor for monitoring electrocardiogram (ECG) signals, and a basic biomedical signal processor for monitoring common physiological data such as oxygen saturation, blood pressure, or body temperature. The multiprocessor chip is fabricated using TSMC 90 nm CMOS technology, and occupies a core area of 1,600 × 1,600 um2. Simulated power consumption is 15.89 mW under the conditions of 1.0V core supply voltage and 64 MHz clock operation frequency.
UR - http://www.scopus.com/inward/record.url?scp=84907398718&partnerID=8YFLogxK
U2 - 10.1109/ISCAS.2014.6865404
DO - 10.1109/ISCAS.2014.6865404
M3 - Conference contribution
AN - SCOPUS:84907398718
SN - 9781479934324
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
SP - 1392
EP - 1395
BT - 2014 IEEE International Symposium on Circuits and Systems, ISCAS 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 IEEE International Symposium on Circuits and Systems, ISCAS 2014
Y2 - 1 June 2014 through 5 June 2014
ER -