A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications

Keyphrases

• Sensing Applications 100%
• Neural Sensing 100%
• Double-sided 100%
• Through Silicon via 100%
• Integration Scheme 100%
• Single-chip Integration 100%
• Neural Probe 66%
• CMOS Circuits 50%
• Front Surface 33%
• Single chip 33%
• CMOS Technology 16%
• Circuitry 16%
• Readout Circuitry 16%
• Input Noise 16%
• Power Consumption 16%
• CMOS-MEMS 16%
• Analog Front-end 16%
• Differential Amplifier 16%
• Circuit Structure 16%
• 16-channel 16%
• Vrms 16%
• On-chip Devices 16%
• Low Parasitics 16%
• Probe Array 16%
• Monolithic Integration 16%
• Heterogeneous Devices 16%
• MEMS Structure 16%
• Long-term Implantation 16%
• High-speed Recording 16%

Engineering

• Sensing Application 100%
• Single Chip 100%
• Back Side 66%
• Front Side 66%
• Amplifier 33%
• Electric Power Utilization 33%
• Microelectromechanical System 33%
• Analog Front 33%
• Front End 33%
• Three Dimensional Integrated Circuits 33%
• Realization 33%
• Monolithic Integration 33%
• Chip Device 33%
• Term Implantation 33%