Abstract
This article presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-package (AiP) built using commercially available integrated passive device (IPD), printed circuit board (PCB), and flip-chip assembly technologies. An IPD-PCB resonant cavity is formed by flipping an IPD chip on a PCB substrate with surrounding solder bumps to provide radiation through a square slot, which is patterned on one of the IPD metal layers. Moreover, a substrate-integrated waveguide (SIW) cavity under the IPD-PCB cavity and a wideband-grounded coplanar waveguide (GCPW) are built in the PCB substrate for the transition between a radio frequency front-end (RFFE) and the IPD-PCB cavity. The fabricated AiP achieves a 3.75-dBi gain at 94.5 GHz (TE210 mode) and a 10-dB impedance bandwidth of 1.9 GHz with a 3.61 mm2 IPD chip area.
Original language | English |
---|---|
Pages (from-to) | 822-827 |
Number of pages | 6 |
Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
Volume | 12 |
Issue number | 5 |
DOIs | |
State | Published - 1 May 2022 |
Keywords
- Antenna-in-package (AiP)
- W-band
- bumps
- cavity antenna
- flip-chip
- grounded coplanar waveguide (GCPW)
- heterogeneous integration (HI)
- integrated passive device (IPD)
- millimeter-wave (mmWave)
- printed circuit board (PCB)
- substrate-integrated waveguide (SIW)