A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies

Ching Wen Chiang; Chung Tse Michael Wu; Nai Chen Liu; Chia Jen Liang; Yen Cheng Kuan

doi:10.1109/TCPMT.2022.3170499

A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies

Ching Wen Chiang, Chung Tse Michael Wu, Nai Chen Liu, Chia Jen Liang, Yen Cheng Kuan^*

^*Corresponding author for this work

International College of Semiconductor Technology

Research output: Contribution to journal › Article › peer-review

9 Scopus citations

Abstract

This article presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-package (AiP) built using commercially available integrated passive device (IPD), printed circuit board (PCB), and flip-chip assembly technologies. An IPD-PCB resonant cavity is formed by flipping an IPD chip on a PCB substrate with surrounding solder bumps to provide radiation through a square slot, which is patterned on one of the IPD metal layers. Moreover, a substrate-integrated waveguide (SIW) cavity under the IPD-PCB cavity and a wideband-grounded coplanar waveguide (GCPW) are built in the PCB substrate for the transition between a radio frequency front-end (RFFE) and the IPD-PCB cavity. The fabricated AiP achieves a 3.75-dBi gain at 94.5 GHz (TE210 mode) and a 10-dB impedance bandwidth of 1.9 GHz with a 3.61 mm2 IPD chip area.

Original language	English
Pages (from-to)	822-827
Number of pages	6
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	12
Issue number	5
DOIs	https://doi.org/10.1109/TCPMT.2022.3170499
State	Published - 1 May 2022

Keywords

Antenna-in-package (AiP)
W-band
bumps
cavity antenna
flip-chip
grounded coplanar waveguide (GCPW)
heterogeneous integration (HI)
integrated passive device (IPD)
millimeter-wave (mmWave)
printed circuit board (PCB)
substrate-integrated waveguide (SIW)

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title = "A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies",

abstract = "This article presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-package (AiP) built using commercially available integrated passive device (IPD), printed circuit board (PCB), and flip-chip assembly technologies. An IPD-PCB resonant cavity is formed by flipping an IPD chip on a PCB substrate with surrounding solder bumps to provide radiation through a square slot, which is patterned on one of the IPD metal layers. Moreover, a substrate-integrated waveguide (SIW) cavity under the IPD-PCB cavity and a wideband-grounded coplanar waveguide (GCPW) are built in the PCB substrate for the transition between a radio frequency front-end (RFFE) and the IPD-PCB cavity. The fabricated AiP achieves a 3.75-dBi gain at 94.5 GHz (TE210 mode) and a 10-dB impedance bandwidth of 1.9 GHz with a 3.61 mm2 IPD chip area.",

keywords = "Antenna-in-package (AiP), W-band, bumps, cavity antenna, flip-chip, grounded coplanar waveguide (GCPW), heterogeneous integration (HI), integrated passive device (IPD), millimeter-wave (mmWave), printed circuit board (PCB), substrate-integrated waveguide (SIW)",

author = "Chiang, {Ching Wen} and Wu, {Chung Tse Michael} and Liu, {Nai Chen} and Liang, {Chia Jen} and Kuan, {Yen Cheng}",

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AU - Wu, Chung Tse Michael

AU - Liu, Nai Chen

AU - Liang, Chia Jen

AU - Kuan, Yen Cheng

PY - 2022/5/1

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N2 - This article presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-package (AiP) built using commercially available integrated passive device (IPD), printed circuit board (PCB), and flip-chip assembly technologies. An IPD-PCB resonant cavity is formed by flipping an IPD chip on a PCB substrate with surrounding solder bumps to provide radiation through a square slot, which is patterned on one of the IPD metal layers. Moreover, a substrate-integrated waveguide (SIW) cavity under the IPD-PCB cavity and a wideband-grounded coplanar waveguide (GCPW) are built in the PCB substrate for the transition between a radio frequency front-end (RFFE) and the IPD-PCB cavity. The fabricated AiP achieves a 3.75-dBi gain at 94.5 GHz (TE210 mode) and a 10-dB impedance bandwidth of 1.9 GHz with a 3.61 mm2 IPD chip area.

AB - This article presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-package (AiP) built using commercially available integrated passive device (IPD), printed circuit board (PCB), and flip-chip assembly technologies. An IPD-PCB resonant cavity is formed by flipping an IPD chip on a PCB substrate with surrounding solder bumps to provide radiation through a square slot, which is patterned on one of the IPD metal layers. Moreover, a substrate-integrated waveguide (SIW) cavity under the IPD-PCB cavity and a wideband-grounded coplanar waveguide (GCPW) are built in the PCB substrate for the transition between a radio frequency front-end (RFFE) and the IPD-PCB cavity. The fabricated AiP achieves a 3.75-dBi gain at 94.5 GHz (TE210 mode) and a 10-dB impedance bandwidth of 1.9 GHz with a 3.61 mm2 IPD chip area.

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KW - bumps

KW - cavity antenna

KW - flip-chip

KW - grounded coplanar waveguide (GCPW)

KW - heterogeneous integration (HI)

KW - integrated passive device (IPD)

KW - millimeter-wave (mmWave)

KW - printed circuit board (PCB)

KW - substrate-integrated waveguide (SIW)

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A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies

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Keywords

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