Abstract
This paper presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-package (AiP) built by using commercially available integrated passive device (IPD), printed circuit board (PCB), and flip-chip assembly technologies. An IPD-PCB resonant cavity is formed by flipping an IPD chip on a PCB substrate with surrounding solder bumps to provide radiation through a square slot, which is patterned on one of the IPD metal layers. Moreover, a substrate integrated waveguide (SIW) cavity under the IPD-PCB cavity and a wideband grounded coplanar waveguide (GCPW) are built in the PCB substrate for the transition between a radio-frequency front-end (RFFE) and the IPD-PCB cavity. The fabricated AiP achieves a 3.75-dBi gain at 94.5 GHz (TE210 mode) and a 10-dB impedance bandwidth of 1.9 GHz with a 3.61 mm2 IPD chip area.
| Original language | English |
|---|---|
| Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| DOIs | |
| State | Accepted/In press - 2022 |
Keywords
- Antenna measurements
- Antenna radiation patterns
- antenna-in-package (AiP)
- Antennas
- bumps
- cavity antenna
- flip-chip
- grounded coplanar waveguide (GCPW)
- heterogeneous integration
- integrated passive device (IPD)
- Metals
- millimeter-wave (mmWave)
- Packaging
- printed circuit board (PCB)
- Silicon
- substrate integrated waveguide (SIW)
- Substrates
- W-band