A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies

Ching Wen Chiang, Chung Tse Michael Wu, Nai Chen Liu, Chia Jen Liang, Yen Cheng Kuan

Research output: Contribution to journalArticlepeer-review


This paper presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-package (AiP) built by using commercially available integrated passive device (IPD), printed circuit board (PCB), and flip-chip assembly technologies. An IPD-PCB resonant cavity is formed by flipping an IPD chip on a PCB substrate with surrounding solder bumps to provide radiation through a square slot, which is patterned on one of the IPD metal layers. Moreover, a substrate integrated waveguide (SIW) cavity under the IPD-PCB cavity and a wideband grounded coplanar waveguide (GCPW) are built in the PCB substrate for the transition between a radio-frequency front-end (RFFE) and the IPD-PCB cavity. The fabricated AiP achieves a 3.75-dBi gain at 94.5 GHz (TE210 mode) and a 10-dB impedance bandwidth of 1.9 GHz with a 3.61 mm2 IPD chip area.


  • Antenna measurements
  • Antenna radiation patterns
  • antenna-in-package (AiP)
  • Antennas
  • bumps
  • cavity antenna
  • flip-chip
  • grounded coplanar waveguide (GCPW)
  • heterogeneous integration
  • integrated passive device (IPD)
  • Metals
  • millimeter-wave (mmWave)
  • Packaging
  • printed circuit board (PCB)
  • Silicon
  • substrate integrated waveguide (SIW)
  • Substrates
  • W-band


Dive into the research topics of 'A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies'. Together they form a unique fingerprint.

Cite this