Abstract
In this work, the effect of Total Ionizing Dose (TID) on the performance of GaN on Si MIS-HEMT power devices with in-situ SiN cap layer is investigated. 13 samples were exposed to different accumulated dose (100 krad and 400 krad) of Co $^{60}~\gamma $ -ray irradiation with two bias conditions (grounded and stressed). The characteristics of the devices after irradiation experiment were evaluated by measuring VTH shift, on-resistance (RON), and dynamic RON. A comprehensive study of TID effects are demonstrated in this article to verify different mechanisms and their interactions. Simulations using PHITs were also carried out to further confirm the damages in the epitaxial structure by the accumulated dose.
Original language | English |
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Pages (from-to) | 276-281 |
Number of pages | 6 |
Journal | IEEE Transactions on Device and Materials Reliability |
Volume | 22 |
Issue number | 2 |
DOIs | |
State | Published - 1 Jun 2022 |
Keywords
- dynamic RON
- GaN on Si
- in-situ SiN
- MISHEMTs
- power device
- simulation
- total ionizing dose
- VTH shifting