TY - JOUR
T1 - A Combined Process of Liftoff and Printing for the Fabrication of Scalable Inkjet Printed Microstructures on a Flexible Substrate
AU - Fu, Yu Min
AU - Liang, Yen R.
AU - Cheng, Yu-Ting
AU - Wu, Pu-Wei
PY - 2015/4/1
Y1 - 2015/4/1
N2 - In this paper, a combined process of liftoff and printing (CPLoP) techniques is introduced to realize size-scalable printed silver microstructures with line widths ranging from 5 to 70 μm and resistivities of ∼9.8 μΩ · cm on a flexible polyimide substrate via thermal sintering at 300 °C for 30 min. In addition, a printed interdigitated capacitor with an electrode line width and spacing of 10 μm and a printed spiral square inductor with a 10-μm line width and 5-μm spacing in an area of 1 mm2 have been successfully demonstrated with an area capacitance and inductance of 0.43 pF/mm2 at 10 KHz and 1.054 μH/mm2 up to 100 KHz, respectively, which are the orders of magnitude performance improvement in comparison with the contemporary inkjet-printed capacitors and inductors. Owing to the significant reduction of energy demand in processing tools and waste generation in processing materials, the results have revealed that the CPLoP process can facilitate the advancement of printing manufacture technology for microelectronics applications.
AB - In this paper, a combined process of liftoff and printing (CPLoP) techniques is introduced to realize size-scalable printed silver microstructures with line widths ranging from 5 to 70 μm and resistivities of ∼9.8 μΩ · cm on a flexible polyimide substrate via thermal sintering at 300 °C for 30 min. In addition, a printed interdigitated capacitor with an electrode line width and spacing of 10 μm and a printed spiral square inductor with a 10-μm line width and 5-μm spacing in an area of 1 mm2 have been successfully demonstrated with an area capacitance and inductance of 0.43 pF/mm2 at 10 KHz and 1.054 μH/mm2 up to 100 KHz, respectively, which are the orders of magnitude performance improvement in comparison with the contemporary inkjet-printed capacitors and inductors. Owing to the significant reduction of energy demand in processing tools and waste generation in processing materials, the results have revealed that the CPLoP process can facilitate the advancement of printing manufacture technology for microelectronics applications.
KW - Flexible electronics
KW - flexible inkjet printing
KW - inductor
KW - printed microsystems
UR - http://www.scopus.com/inward/record.url?scp=84961289748&partnerID=8YFLogxK
U2 - 10.1109/TED.2015.2401599
DO - 10.1109/TED.2015.2401599
M3 - Article
AN - SCOPUS:84961289748
SN - 0018-9383
VL - 62
SP - 1248
EP - 1254
JO - IEEE Transactions on Electron Devices
JF - IEEE Transactions on Electron Devices
IS - 4
M1 - 7047690
ER -
