A CMOS wireless two-axis digital accelerometer using bondwire inertial sensing

Yu-Te Liao; J. Shi; B. Otis

doi:10.1109/TRANSDUCERS.2011.5969136

A CMOS wireless two-axis digital accelerometer using bondwire inertial sensing

Yu-Te Liao^*, J. Shi, B. Otis

^*Corresponding author for this work

Department of Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

This paper presents a two-axis wireless accelerometer using bondwire inertial sensing without MEMS processing. The bondwire sensors are bonded chip-to-chip to reduce the manufacturing uncertainty. The accelerometer consists of oscillator-based inductance-to-frequency converters, a digital frequency demodulator, and a 400 MHz FSK wireless transmitter. A digitally programmable interface allows the digitalization of acceleration information and control of bandwidth and resolution of the sensor system. The accelerometer has a transducer gain of 7.5 kHz/g and a bandwidth of 1.2 kHz while consuming 63 mW.

Original language	English
Title of host publication	2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
Pages	68-71
Number of pages	4
DOIs	https://doi.org/10.1109/TRANSDUCERS.2011.5969136
State	Published - 2011
Event	2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 - Beijing, China Duration: 5 Jun 2011 → 9 Jun 2011

Publication series

Name	2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

Conference

Conference	2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
Country/Territory	China
City	Beijing
Period	5/06/11 → 9/06/11

Keywords

Inertial sensor
accelerometer
bondwire
inductance sensitivity
oscillator
wireless transmitter

Access to Document

10.1109/TRANSDUCERS.2011.5969136

Cite this

Liao, Y.-T., Shi, J., & Otis, B. (2011). A CMOS wireless two-axis digital accelerometer using bondwire inertial sensing. In 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 (pp. 68-71). Article 5969136 (2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11). https://doi.org/10.1109/TRANSDUCERS.2011.5969136

@inproceedings{3cc6aee0132546f49020b953e9a34223,

title = "A CMOS wireless two-axis digital accelerometer using bondwire inertial sensing",

abstract = "This paper presents a two-axis wireless accelerometer using bondwire inertial sensing without MEMS processing. The bondwire sensors are bonded chip-to-chip to reduce the manufacturing uncertainty. The accelerometer consists of oscillator-based inductance-to-frequency converters, a digital frequency demodulator, and a 400 MHz FSK wireless transmitter. A digitally programmable interface allows the digitalization of acceleration information and control of bandwidth and resolution of the sensor system. The accelerometer has a transducer gain of 7.5 kHz/g and a bandwidth of 1.2 kHz while consuming 63 mW.",

keywords = "Inertial sensor, accelerometer, bondwire, inductance sensitivity, oscillator, wireless transmitter",

author = "Yu-Te Liao and J. Shi and B. Otis",

year = "2011",

doi = "10.1109/TRANSDUCERS.2011.5969136",

language = "English",

isbn = "9781457701573",

series = "2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11",

pages = "68--71",

booktitle = "2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11",

note = "2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 ; Conference date: 05-06-2011 Through 09-06-2011",

}

Liao, Y-T, Shi, J & Otis, B 2011, A CMOS wireless two-axis digital accelerometer using bondwire inertial sensing. in 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11., 5969136, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11, pp. 68-71, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11, Beijing, China, 5/06/11. https://doi.org/10.1109/TRANSDUCERS.2011.5969136

A CMOS wireless two-axis digital accelerometer using bondwire inertial sensing. / Liao, Yu-Te; Shi, J.; Otis, B.
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11. 2011. p. 68-71 5969136 (2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - A CMOS wireless two-axis digital accelerometer using bondwire inertial sensing

AU - Liao, Yu-Te

AU - Shi, J.

AU - Otis, B.

PY - 2011

Y1 - 2011

N2 - This paper presents a two-axis wireless accelerometer using bondwire inertial sensing without MEMS processing. The bondwire sensors are bonded chip-to-chip to reduce the manufacturing uncertainty. The accelerometer consists of oscillator-based inductance-to-frequency converters, a digital frequency demodulator, and a 400 MHz FSK wireless transmitter. A digitally programmable interface allows the digitalization of acceleration information and control of bandwidth and resolution of the sensor system. The accelerometer has a transducer gain of 7.5 kHz/g and a bandwidth of 1.2 kHz while consuming 63 mW.

AB - This paper presents a two-axis wireless accelerometer using bondwire inertial sensing without MEMS processing. The bondwire sensors are bonded chip-to-chip to reduce the manufacturing uncertainty. The accelerometer consists of oscillator-based inductance-to-frequency converters, a digital frequency demodulator, and a 400 MHz FSK wireless transmitter. A digitally programmable interface allows the digitalization of acceleration information and control of bandwidth and resolution of the sensor system. The accelerometer has a transducer gain of 7.5 kHz/g and a bandwidth of 1.2 kHz while consuming 63 mW.

KW - Inertial sensor

KW - accelerometer

KW - bondwire

KW - inductance sensitivity

KW - oscillator

KW - wireless transmitter

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U2 - 10.1109/TRANSDUCERS.2011.5969136

DO - 10.1109/TRANSDUCERS.2011.5969136

M3 - Conference contribution

AN - SCOPUS:80052108700

SN - 9781457701573

T3 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

SP - 68

EP - 71

BT - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

T2 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

Y2 - 5 June 2011 through 9 June 2011

ER -

Liao YT, Shi J, Otis B. A CMOS wireless two-axis digital accelerometer using bondwire inertial sensing. In 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11. 2011. p. 68-71. 5969136. (2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11). doi: 10.1109/TRANSDUCERS.2011.5969136

A CMOS wireless two-axis digital accelerometer using bondwire inertial sensing

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