A CMOS micromachined capacitive tactile sensor with integrated readout circuits and compensation of process variations

Tsung Heng Tsai*, Hao Cheng Tsai, Tien Keng Wu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

11 Scopus citations

Abstract

This paper presents a capacitive tactile sensor fabricated in a standard CMOS process. Both of the sensor and readout circuits are integrated on a single chip by a TSMC 0.35 \mu{\rm m} CMOS MEMS technology. In order to improve the sensitivity, a T-shaped protrusion is proposed and implemented. This sensor comprises the metal layer and the dielectric layer without extra thin film deposition, and can be completed with few post-processing steps. By a nano-indenter, the measured spring constant of the T-shaped structure is 2.19 kNewton/m. Fully differential correlated double sampling capacitor-to-voltage converter (CDS-CVC) and reference capacitor correction are utilized to compensate process variations and improve the accuracy of the readout circuits. The measured displacement-to-voltage transductance is 7.15 mV/nm, and the sensitivity is 3.26 {\rm mV}/\mu{\rm Newton}. The overall power dissipation is 132.8 \mu{\rm W}.

Original languageEnglish
Article number6919345
Pages (from-to)608-616
Number of pages9
JournalIEEE Transactions on Biomedical Circuits and Systems
Volume8
Issue number5
DOIs
StatePublished - 1 Oct 2014

Keywords

  • CMOS integrated circuits
  • micromachining
  • tactile sensors

Fingerprint

Dive into the research topics of 'A CMOS micromachined capacitive tactile sensor with integrated readout circuits and compensation of process variations'. Together they form a unique fingerprint.

Cite this