A CMOS micromachined capacitive tactile sensor with compensation of process variations

Hao Cheng Tsai; Tien Keng Wu; Tsung Heng Tsai

doi:10.1109/BioCAS.2013.6679709

A CMOS micromachined capacitive tactile sensor with compensation of process variations

Hao Cheng Tsai, Tien Keng Wu, Tsung Heng Tsai

Institute of Pioneer Semiconductor Innovation

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

This paper presents a standard-CMOS-fabricated capacitive tactile sensor with high sensitivity and a sensing circuit with compensation of process variations. Both of the sensor and sensing circuit are fabricated on a single chip by a TSMC 0.35μm CMOS MEMS technology. In order to create high sensitivity of the sensor for sensing circuit, a T-shaped protrusion is proposed. This sensor is constituted by the metal layer and the dielectric layer without extra thin film deposition, and can be completed with few simple post-processing steps. With the fully differential correlated double sampling capacitor-to-voltage converter (CDS-CVC) and reference capacitor correction, process variations are compensated. The measured sensitivity of the sensing circuit is 18mV/fF.

Original language	English
Title of host publication	2013 IEEE Biomedical Circuits and Systems Conference, BioCAS 2013
Pages	342-345
Number of pages	4
DOIs	https://doi.org/10.1109/BioCAS.2013.6679709
State	Published - 2013
Event	2013 IEEE Biomedical Circuits and Systems Conference, BioCAS 2013 - Rotterdam, Netherlands Duration: 31 Oct 2013 → 2 Nov 2013

Publication series

Name	2013 IEEE Biomedical Circuits and Systems Conference, BioCAS 2013

Conference

Conference	2013 IEEE Biomedical Circuits and Systems Conference, BioCAS 2013
Country/Territory	Netherlands
City	Rotterdam
Period	31/10/13 → 2/11/13

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10.1109/BioCAS.2013.6679709

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@inproceedings{9d2d3ad9db9a469f8872aaafe1656ab5,

title = "A CMOS micromachined capacitive tactile sensor with compensation of process variations",

abstract = "This paper presents a standard-CMOS-fabricated capacitive tactile sensor with high sensitivity and a sensing circuit with compensation of process variations. Both of the sensor and sensing circuit are fabricated on a single chip by a TSMC 0.35μm CMOS MEMS technology. In order to create high sensitivity of the sensor for sensing circuit, a T-shaped protrusion is proposed. This sensor is constituted by the metal layer and the dielectric layer without extra thin film deposition, and can be completed with few simple post-processing steps. With the fully differential correlated double sampling capacitor-to-voltage converter (CDS-CVC) and reference capacitor correction, process variations are compensated. The measured sensitivity of the sensing circuit is 18mV/fF.",

author = "Tsai, {Hao Cheng} and Wu, {Tien Keng} and Tsai, {Tsung Heng}",

year = "2013",

doi = "10.1109/BioCAS.2013.6679709",

language = "English",

isbn = "9781479914715",

series = "2013 IEEE Biomedical Circuits and Systems Conference, BioCAS 2013",

pages = "342--345",

booktitle = "2013 IEEE Biomedical Circuits and Systems Conference, BioCAS 2013",

note = "null ; Conference date: 31-10-2013 Through 02-11-2013",

}

Tsai, HC, Wu, TK & Tsai, TH 2013, A CMOS micromachined capacitive tactile sensor with compensation of process variations. in 2013 IEEE Biomedical Circuits and Systems Conference, BioCAS 2013., 6679709, 2013 IEEE Biomedical Circuits and Systems Conference, BioCAS 2013, pp. 342-345, 2013 IEEE Biomedical Circuits and Systems Conference, BioCAS 2013, Rotterdam, Netherlands, 31/10/13. https://doi.org/10.1109/BioCAS.2013.6679709

A CMOS micromachined capacitive tactile sensor with compensation of process variations. / Tsai, Hao Cheng; Wu, Tien Keng; Tsai, Tsung Heng.

2013 IEEE Biomedical Circuits and Systems Conference, BioCAS 2013. 2013. p. 342-345 6679709 (2013 IEEE Biomedical Circuits and Systems Conference, BioCAS 2013).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - A CMOS micromachined capacitive tactile sensor with compensation of process variations

AU - Tsai, Hao Cheng

AU - Wu, Tien Keng

AU - Tsai, Tsung Heng

PY - 2013

Y1 - 2013

N2 - This paper presents a standard-CMOS-fabricated capacitive tactile sensor with high sensitivity and a sensing circuit with compensation of process variations. Both of the sensor and sensing circuit are fabricated on a single chip by a TSMC 0.35μm CMOS MEMS technology. In order to create high sensitivity of the sensor for sensing circuit, a T-shaped protrusion is proposed. This sensor is constituted by the metal layer and the dielectric layer without extra thin film deposition, and can be completed with few simple post-processing steps. With the fully differential correlated double sampling capacitor-to-voltage converter (CDS-CVC) and reference capacitor correction, process variations are compensated. The measured sensitivity of the sensing circuit is 18mV/fF.

AB - This paper presents a standard-CMOS-fabricated capacitive tactile sensor with high sensitivity and a sensing circuit with compensation of process variations. Both of the sensor and sensing circuit are fabricated on a single chip by a TSMC 0.35μm CMOS MEMS technology. In order to create high sensitivity of the sensor for sensing circuit, a T-shaped protrusion is proposed. This sensor is constituted by the metal layer and the dielectric layer without extra thin film deposition, and can be completed with few simple post-processing steps. With the fully differential correlated double sampling capacitor-to-voltage converter (CDS-CVC) and reference capacitor correction, process variations are compensated. The measured sensitivity of the sensing circuit is 18mV/fF.

UR - http://www.scopus.com/inward/record.url?scp=84893572037&partnerID=8YFLogxK

U2 - 10.1109/BioCAS.2013.6679709

DO - 10.1109/BioCAS.2013.6679709

M3 - Conference contribution

AN - SCOPUS:84893572037

SN - 9781479914715

T3 - 2013 IEEE Biomedical Circuits and Systems Conference, BioCAS 2013

SP - 342

EP - 345

BT - 2013 IEEE Biomedical Circuits and Systems Conference, BioCAS 2013

Y2 - 31 October 2013 through 2 November 2013

ER -

A CMOS micromachined capacitive tactile sensor with compensation of process variations

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