A back-to-back micromirror device for optical add/drop multiplexer applications

Y. C. Lin, Jin-Chern Chiou*

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review


In this paper, a back-to-back micromirror device fabricated through surface-micromachining and flip chip packaging technologies is developed for optical add/drop multiplexer applications. Pre-stressed beams were designed to elevate micromirror devices after the release and thermal heat-treatment processes. Torsion flexure structure design provides a reliable rotation degree of freedom for micromirror devices. A mechanical stopper was bonded using flip chip packaging on the top of micromirror devices to constrain the popped-up micromirror to obtain precise deflecting angle. Preliminary experiments had demonstrated the feasibility of the micromirror devices.

Original languageEnglish
Pages (from-to)473-479
Number of pages7
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume5116 II
StatePublished - 19 May 2003
EventSmart Sensors, Actuators, and MEMS - Maspalonas, Gran Canaria, Spain
Duration: 19 May 200321 May 2003


  • Back-to-back
  • Heat-treatment
  • Micromirror
  • Pre-stressed


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