TY - GEN
T1 - A 950-pW, 39-pJ/Conversion Leakage-Based Temperature-to-Digital Converter with 43mk Resolution
AU - Shao, Cheng Ze
AU - Liao, Yu Te
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/11/9
Y1 - 2020/11/9
N2 - This paper presents a power-efficient temperature-to-digital convertor using a leakage-based ring oscillator. The reversely-biased transistors are added between the supply rails and the core circuit to limit power consumption and enhance temperature-to-current conversion gain. A design of temperature-insensitive sampling clock signal results in better conversion linearity/accuracy. The design was fabricated in a 180-nm CMOS process with an active chip area of 0.04 mm2. The design can achieve a resolution of 43 mK at 20 °C in 100 measurements and a temperature inaccuracy of -1.6/+2.1 °C over a temperature range of 20-80 °C. At a 0.55 V supply, the power consumption of the whole system is 950 pW, the conversion time is 40.8 ms, and the resulted energy efficiency is 39 pJ/conversion.
AB - This paper presents a power-efficient temperature-to-digital convertor using a leakage-based ring oscillator. The reversely-biased transistors are added between the supply rails and the core circuit to limit power consumption and enhance temperature-to-current conversion gain. A design of temperature-insensitive sampling clock signal results in better conversion linearity/accuracy. The design was fabricated in a 180-nm CMOS process with an active chip area of 0.04 mm2. The design can achieve a resolution of 43 mK at 20 °C in 100 measurements and a temperature inaccuracy of -1.6/+2.1 °C over a temperature range of 20-80 °C. At a 0.55 V supply, the power consumption of the whole system is 950 pW, the conversion time is 40.8 ms, and the resulted energy efficiency is 39 pJ/conversion.
KW - CMOS
KW - Leakage-based oscillator
KW - Temperature sensor
KW - Temperature-insensitive sampling clock signal
UR - http://www.scopus.com/inward/record.url?scp=85100927847&partnerID=8YFLogxK
U2 - 10.1109/A-SSCC48613.2020.9336106
DO - 10.1109/A-SSCC48613.2020.9336106
M3 - Conference contribution
AN - SCOPUS:85100927847
T3 - 2020 IEEE Asian Solid-State Circuits Conference, A-SSCC 2020
BT - 2020 IEEE Asian Solid-State Circuits Conference, A-SSCC 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 16th IEEE Asian Solid-State Circuits Conference, A-SSCC 2020
Y2 - 9 November 2020 through 11 November 2020
ER -