A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition

Yu Chieh Huang; Po-Tsang Huang; Yu Chen Hu; Shang Lin Wu; Yan Huei You; Yung Kuei Wang; Jeng-Ren  Duann; Tzai-Wen Chiu; Wei  Hwang; Kuan-Neng Chen; Ching Te Chuang; Jin-Chern  Chiou

doi:10.1109/TRANSDUCERS.2017.7993979

A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition

Yu Chieh Huang, Po-Tsang Huang, Yu Chen Hu, Shang Lin Wu, Yan Huei You, Yung Kuei Wang, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching Te Chuang, Jin-Chern Chiou

Research output: Contribution to conference › Paper › peer-review

Abstract

To enhance the signal integrity of high-density neural-sensing signals, this work presents an implantable high spatial resolution μ-probe array with through-silicon via (TSV) 2.5D integration technology that realizes a miniaturized implantable device on flexible printed circuit (FPC) interposer. The proposed microsystem was composed of two 32-channel neural sensing chips and one radio frequency chip for neural signal processing. The μ-probe array can achieve better signal-to-noise ratio with neural-signal acquisition and processing circuit composed of a pseudo-resistor-based analog front-end amplifier. Moreover, a receiving antenna is also implemented on the backside of FPC for wireless data and power transmission. The feasibility of the proposed μ-probe array, Tx and Rx antenna, 32-channel neural sensing circuits in the 64-channel wireless microsystem have been successfully demonstrated for future integration and animal experiments.

Original language	American English
DOIs	https://doi.org/10.1109/TRANSDUCERS.2017.7993979
State	Published - Jul 2017
Event	19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 - Kaohsiung, Taiwan Duration: 18 Jun 2017 → 22 Jun 2017

Conference

Conference	19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
Country/Territory	Taiwan
City	Kaohsiung
Period	18/06/17 → 22/06/17

Access to Document

10.1109/TRANSDUCERS.2017.7993979

Cite this

Huang, Y. C., Huang, P.-T., Hu, Y. C., Wu, S. L., You, Y. H., Wang, Y. K., Duann, J.-R., Chiu, T.-W., Hwang, W., Chen, K.-N., Chuang, C. T., & Chiou, J.-C. (2017). A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition. Paper presented at 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017, Kaohsiung, Taiwan. https://doi.org/10.1109/TRANSDUCERS.2017.7993979

@conference{a8ac0dfbd5564077b16adaaeff302464,

title = "A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition",

abstract = "To enhance the signal integrity of high-density neural-sensing signals, this work presents an implantable high spatial resolution μ-probe array with through-silicon via (TSV) 2.5D integration technology that realizes a miniaturized implantable device on flexible printed circuit (FPC) interposer. The proposed microsystem was composed of two 32-channel neural sensing chips and one radio frequency chip for neural signal processing. The μ-probe array can achieve better signal-to-noise ratio with neural-signal acquisition and processing circuit composed of a pseudo-resistor-based analog front-end amplifier. Moreover, a receiving antenna is also implemented on the backside of FPC for wireless data and power transmission. The feasibility of the proposed μ-probe array, Tx and Rx antenna, 32-channel neural sensing circuits in the 64-channel wireless microsystem have been successfully demonstrated for future integration and animal experiments.",

author = "Huang, {Yu Chieh} and Po-Tsang Huang and Hu, {Yu Chen} and Wu, {Shang Lin} and You, {Yan Huei} and Wang, {Yung Kuei} and Jeng-Ren Duann and Tzai-Wen Chiu and Wei Hwang and Kuan-Neng Chen and Chuang, {Ching Te} and Jin-Chern Chiou",

year = "2017",

month = jul,

doi = "10.1109/TRANSDUCERS.2017.7993979",

language = "American English",

note = "19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 ; Conference date: 18-06-2017 Through 22-06-2017",

}

Huang, YC, Huang, P-T, Hu, YC, Wu, SL, You, YH, Wang, YK, Duann, J-R, Chiu, T-W, Hwang, W, Chen, K-N, Chuang, CT & Chiou, J-C 2017, 'A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition', Paper presented at 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017, Kaohsiung, Taiwan, 18/06/17 - 22/06/17. https://doi.org/10.1109/TRANSDUCERS.2017.7993979

A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition. / Huang, Yu Chieh; Huang, Po-Tsang; Hu, Yu Chen et al.
2017. Paper presented at 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017, Kaohsiung, Taiwan.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition

AU - Huang, Yu Chieh

AU - Huang, Po-Tsang

AU - Hu, Yu Chen

AU - Wu, Shang Lin

AU - You, Yan Huei

AU - Wang, Yung Kuei

AU - Duann, Jeng-Ren

AU - Chiu, Tzai-Wen

AU - Hwang, Wei

AU - Chen, Kuan-Neng

AU - Chuang, Ching Te

AU - Chiou, Jin-Chern

PY - 2017/7

Y1 - 2017/7

N2 - To enhance the signal integrity of high-density neural-sensing signals, this work presents an implantable high spatial resolution μ-probe array with through-silicon via (TSV) 2.5D integration technology that realizes a miniaturized implantable device on flexible printed circuit (FPC) interposer. The proposed microsystem was composed of two 32-channel neural sensing chips and one radio frequency chip for neural signal processing. The μ-probe array can achieve better signal-to-noise ratio with neural-signal acquisition and processing circuit composed of a pseudo-resistor-based analog front-end amplifier. Moreover, a receiving antenna is also implemented on the backside of FPC for wireless data and power transmission. The feasibility of the proposed μ-probe array, Tx and Rx antenna, 32-channel neural sensing circuits in the 64-channel wireless microsystem have been successfully demonstrated for future integration and animal experiments.

AB - To enhance the signal integrity of high-density neural-sensing signals, this work presents an implantable high spatial resolution μ-probe array with through-silicon via (TSV) 2.5D integration technology that realizes a miniaturized implantable device on flexible printed circuit (FPC) interposer. The proposed microsystem was composed of two 32-channel neural sensing chips and one radio frequency chip for neural signal processing. The μ-probe array can achieve better signal-to-noise ratio with neural-signal acquisition and processing circuit composed of a pseudo-resistor-based analog front-end amplifier. Moreover, a receiving antenna is also implemented on the backside of FPC for wireless data and power transmission. The feasibility of the proposed μ-probe array, Tx and Rx antenna, 32-channel neural sensing circuits in the 64-channel wireless microsystem have been successfully demonstrated for future integration and animal experiments.

U2 - 10.1109/TRANSDUCERS.2017.7993979

DO - 10.1109/TRANSDUCERS.2017.7993979

M3 - Paper

T2 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017

Y2 - 18 June 2017 through 22 June 2017

ER -

A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition

Abstract

Conference

Access to Document

Fingerprint

Cite this