A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition

Yu Chieh Huang; Po-Tsang Huang; Yu Chen Hu; Shang Lin Wu; Yan Huei You; Yung Kuei Wang; Jeng-Ren Duann; Tzai-Wen Chiu; Wei Hwang; Kuan-Neng Chen; Ching-Te Chuang; Jin-Chern Chiou

doi:10.1109/TRANSDUCERS.2017.7993979

A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition

Yu Chieh Huang^*, Po-Tsang Huang, Yu Chen Hu, Shang Lin Wu, Yan Huei You, Yung Kuei Wang, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, Jin-Chern Chiou

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

To enhance the signal integrity of high-density neural-sensing signals, this work presents an implantable high spatial resolution μ-probe array with through-silicon via (TSV) 2.5D integration technology that realizes a miniaturized implantable device on flexible printed circuit (FPC) interposer. The proposed microsystem was composed of two 32-channel neural sensing chips and one radio frequency chip for neural signal processing. The μ-probe array can achieve better signal-to-noise ratio with neural-signal acquisition and processing circuit composed of a pseudo-resistor-based analog front-end amplifier. Moreover, a receiving antenna is also implemented on the backside of FPC for wireless data and power transmission. The feasibility of the proposed μ-probe array, Tx and Rx antenna, 32-channel neural sensing circuits in the 64-channel wireless microsystem have been successfully demonstrated for future integration and animal experiments.

Original language	English
Title of host publication	TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	28-31
Number of pages	4
ISBN (Electronic)	9781538627310
DOIs	https://doi.org/10.1109/TRANSDUCERS.2017.7993979
State	Published - 18 Jun 2017
Event	19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 - Kaohsiung, Taiwan Duration: 18 Jun 2017 → 22 Jun 2017

Publication series

Name	TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

Conference

Conference	19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
Country/Territory	Taiwan
City	Kaohsiung
Period	18/06/17 → 22/06/17

Keywords

2.5 D integration
Flexible printed circuit (FPC)
neural signal
through-silicon via (TSV)

Access to Document

10.1109/TRANSDUCERS.2017.7993979

Cite this

Huang, Y. C., Huang, P.-T., Hu, Y. C., Wu, S. L., You, Y. H., Wang, Y. K., Duann, J.-R., Chiu, T.-W., Hwang, W., Chen, K.-N., Chuang, C.-T., & Chiou, J.-C. (2017). A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition. In TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 28-31). Article 7993979 (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TRANSDUCERS.2017.7993979

Huang, Yu Chieh ; Huang, Po-Tsang ; Hu, Yu Chen et al. / A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition. TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 28-31 (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems).

@inproceedings{b0735d7d44894f67a16baf3ac641d6ba,

title = "A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition",

abstract = "To enhance the signal integrity of high-density neural-sensing signals, this work presents an implantable high spatial resolution μ-probe array with through-silicon via (TSV) 2.5D integration technology that realizes a miniaturized implantable device on flexible printed circuit (FPC) interposer. The proposed microsystem was composed of two 32-channel neural sensing chips and one radio frequency chip for neural signal processing. The μ-probe array can achieve better signal-to-noise ratio with neural-signal acquisition and processing circuit composed of a pseudo-resistor-based analog front-end amplifier. Moreover, a receiving antenna is also implemented on the backside of FPC for wireless data and power transmission. The feasibility of the proposed μ-probe array, Tx and Rx antenna, 32-channel neural sensing circuits in the 64-channel wireless microsystem have been successfully demonstrated for future integration and animal experiments.",

keywords = "2.5 D integration, Flexible printed circuit (FPC), neural signal, through-silicon via (TSV)",

author = "Huang, {Yu Chieh} and Po-Tsang Huang and Hu, {Yu Chen} and Wu, {Shang Lin} and You, {Yan Huei} and Wang, {Yung Kuei} and Jeng-Ren Duann and Tzai-Wen Chiu and Wei Hwang and Kuan-Neng Chen and Ching-Te Chuang and Jin-Chern Chiou",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 ; Conference date: 18-06-2017 Through 22-06-2017",

year = "2017",

month = jun,

day = "18",

doi = "10.1109/TRANSDUCERS.2017.7993979",

language = "English",

series = "TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "28--31",

booktitle = "TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems",

address = "美國",

}

Huang, YC, Huang, P-T, Hu, YC, Wu, SL, You, YH, Wang, YK, Duann, J-R , Chiu, T-W, Hwang, W, Chen, K-N, Chuang, C-T & Chiou, J-C 2017, A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition. in TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems., 7993979, TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, Institute of Electrical and Electronics Engineers Inc., pp. 28-31, 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017, Kaohsiung, Taiwan, 18/06/17. https://doi.org/10.1109/TRANSDUCERS.2017.7993979

A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition. / Huang, Yu Chieh; Huang, Po-Tsang; Hu, Yu Chen et al.
TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc., 2017. p. 28-31 7993979 (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition

AU - Huang, Yu Chieh

AU - Huang, Po-Tsang

AU - Hu, Yu Chen

AU - Wu, Shang Lin

AU - You, Yan Huei

AU - Wang, Yung Kuei

AU - Duann, Jeng-Ren

AU - Chiu, Tzai-Wen

AU - Hwang, Wei

AU - Chen, Kuan-Neng

AU - Chuang, Ching-Te

AU - Chiou, Jin-Chern

PY - 2017/6/18

Y1 - 2017/6/18

N2 - To enhance the signal integrity of high-density neural-sensing signals, this work presents an implantable high spatial resolution μ-probe array with through-silicon via (TSV) 2.5D integration technology that realizes a miniaturized implantable device on flexible printed circuit (FPC) interposer. The proposed microsystem was composed of two 32-channel neural sensing chips and one radio frequency chip for neural signal processing. The μ-probe array can achieve better signal-to-noise ratio with neural-signal acquisition and processing circuit composed of a pseudo-resistor-based analog front-end amplifier. Moreover, a receiving antenna is also implemented on the backside of FPC for wireless data and power transmission. The feasibility of the proposed μ-probe array, Tx and Rx antenna, 32-channel neural sensing circuits in the 64-channel wireless microsystem have been successfully demonstrated for future integration and animal experiments.

AB - To enhance the signal integrity of high-density neural-sensing signals, this work presents an implantable high spatial resolution μ-probe array with through-silicon via (TSV) 2.5D integration technology that realizes a miniaturized implantable device on flexible printed circuit (FPC) interposer. The proposed microsystem was composed of two 32-channel neural sensing chips and one radio frequency chip for neural signal processing. The μ-probe array can achieve better signal-to-noise ratio with neural-signal acquisition and processing circuit composed of a pseudo-resistor-based analog front-end amplifier. Moreover, a receiving antenna is also implemented on the backside of FPC for wireless data and power transmission. The feasibility of the proposed μ-probe array, Tx and Rx antenna, 32-channel neural sensing circuits in the 64-channel wireless microsystem have been successfully demonstrated for future integration and animal experiments.

KW - 2.5 D integration

KW - Flexible printed circuit (FPC)

KW - neural signal

KW - through-silicon via (TSV)

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U2 - 10.1109/TRANSDUCERS.2017.7993979

DO - 10.1109/TRANSDUCERS.2017.7993979

M3 - Conference contribution

AN - SCOPUS:85029382427

T3 - TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

SP - 28

EP - 31

BT - TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017

Y2 - 18 June 2017 through 22 June 2017

ER -

Huang YC, Huang PT, Hu YC, Wu SL, You YH, Wang YK et al. A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition. In TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc. 2017. p. 28-31. 7993979. (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems). doi: 10.1109/TRANSDUCERS.2017.7993979

A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition

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Keywords

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