A 60-nm-thick enhancement mode In0.65Ga0.35As/InAs/In0.65Ga0.35As high-electron-mobility transistor fabricated using Au/Pt/Ti non-annealed ohmic technology for low-power logic applications

Faiz Aizad Fatah, Yueh Chin Lin, Ren Xuan Liu, Kai Chun Yang, Tai We Lin, Heng-Tung Hsu, Jung Hsiang Yang, Yasuyuki Miyamoto, Hiroshi Iwai, Chen-Ming Hu, Sayeef Salahuddin, Edward Yi Chang

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Abstract

A 60-nm-thick E-mode In0.65Ga0.35As/InAs/In0.65Ga0.35As high-electron-mobility transistor (HEMT) was successfully fabricated and evaluated by using Au/Pt/Ti-based non-annealed ohmic technology for high-speed and low-power logic applications. The device exhibited a minimal SS of 69mV/decade, a lower DIBL of 30mV/V, an ION/IOFF ratio above 1.2 × 104 at VDS = 0.5V and a high fT of 378GHz and fmax of 214GHz at VDS = 1.0V. These results demonstrate that non-annealed ohmic contacts can be used for fabricating E-mode In0.65Ga0.35As/InAs/In0.65Ga0.35As HEMTs with excellent electrical characteristics. The fabricated HEMTs are likely to find use in future high-speed and low-power logic applications.

Original languageEnglish
Article number026502
JournalApplied Physics Express
Volume9
Issue number2
DOIs
StatePublished - 1 Feb 2016

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