A 4K-400K Wide Operating-Temperature-Range MRAM Technology with Ultrathin Composite Free Layer and Magnesium Spacer

Ming Chun Hong, Yao Jen Chang, Yu Chen Hsin, Liang Ming Liu, Kuan Ming Chen, Yi Hui Su, Guan Long Chen, Shan Yi Yang, I. Jung Wang, Sk Ziaur Rahaman, Hsin Han Lee, Shih Ching Chiu, Chen Yi Shih, Chih Yao Wang, Fang Ming Chen, Jeng Hua Wei, Shyh Shyuan Sheu, Wei Chung Lo, Minn Tsong Lin, Chih I. WuTuo Hung Hou*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

A universal MRAM technology is proposed to fulfill versatile applications ranging from quantum computing to automotive electronics across a wide operating temperature range of 4K to 400K. An ultrathin (1.4 nm) CoFeB composite free layer with an Mg spacer is designed to enlarge breakdown voltage and write margin, decrease switching current, and maintain thermal stability and magnetoresistance ratio at all temperatures. High endurance (>1011) and excellent reliability (write margin > 0.4 V) are achieved from 4K to 400K without compromising speed (10 ns) and retention (10 years at 300K).

Original languageEnglish
Title of host publication2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages379-380
Number of pages2
ISBN (Electronic)9781665497725
DOIs
StatePublished - 2022
Event2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 - Honolulu, United States
Duration: 12 Jun 202217 Jun 2022

Publication series

NameDigest of Technical Papers - Symposium on VLSI Technology
Volume2022-June
ISSN (Print)0743-1562

Conference

Conference2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
Country/TerritoryUnited States
CityHonolulu
Period12/06/2217/06/22

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