A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing

Yu Chen Lo; Yi Chung Wu; Chia Hsiang Yang

doi:10.1109/VLSITechnologyandCir46769.2022.9830370

A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing

Yu Chen Lo, Yi Chung Wu, Chia Hsiang Yang

Institute of Electronics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

This work presents the first dedicated processor that supports the entire hyperspectral image (HSI) processing work-flow. Folding and data interleaving are applied to the processing elements (PEs), reducing the area by 57%. The reconfigurable PE datapath enables 92.7% utilization with 38.1% less area. Data sparsity is leveraged for clock gating, saving 32.2% power. The chip dissipates 44.3mW at 175MHz from a 0.68V supply. It delivers a 62.4fps throughput for 256×256×64 HSIs. Compared to a high-end CPU, this work achieves a 544× higher throughput and 82,352× higher energy efficiency.

Original language	English
Title of host publication	2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	74-75
Number of pages	2
ISBN (Electronic)	9781665497725
DOIs	https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830370
State	Published - 2022
Event	2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 - Honolulu, United States Duration: 12 Jun 2022 → 17 Jun 2022

Publication series

Name	Digest of Technical Papers - Symposium on VLSI Technology
Volume	2022-June
ISSN (Print)	0743-1562

Conference

Conference	2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
Country/Territory	United States
City	Honolulu
Period	12/06/22 → 17/06/22

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1109/VLSITechnologyandCir46769.2022.9830370

Cite this

Lo, Y. C., Wu, Y. C., & Yang, C. H. (2022). A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing. In 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 (pp. 74-75). (Digest of Technical Papers - Symposium on VLSI Technology; Vol. 2022-June). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830370

@inproceedings{9eb71b37443c4d9abdaf5863c59e53bb,

title = "A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing",

abstract = "This work presents the first dedicated processor that supports the entire hyperspectral image (HSI) processing work-flow. Folding and data interleaving are applied to the processing elements (PEs), reducing the area by 57%. The reconfigurable PE datapath enables 92.7% utilization with 38.1% less area. Data sparsity is leveraged for clock gating, saving 32.2% power. The chip dissipates 44.3mW at 175MHz from a 0.68V supply. It delivers a 62.4fps throughput for 256×256×64 HSIs. Compared to a high-end CPU, this work achieves a 544× higher throughput and 82,352× higher energy efficiency.",

author = "Lo, {Yu Chen} and Wu, {Yi Chung} and Yang, {Chia Hsiang}",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 ; Conference date: 12-06-2022 Through 17-06-2022",

year = "2022",

doi = "10.1109/VLSITechnologyandCir46769.2022.9830370",

language = "English",

series = "Digest of Technical Papers - Symposium on VLSI Technology",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "74--75",

booktitle = "2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022",

address = "United States",

}

Lo, YC, Wu, YC & Yang, CH 2022, A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing. in 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Digest of Technical Papers - Symposium on VLSI Technology, vol. 2022-June, Institute of Electrical and Electronics Engineers Inc., pp. 74-75, 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022, Honolulu, United States, 12/06/22. https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830370

A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing. / Lo, Yu Chen; Wu, Yi Chung; Yang, Chia Hsiang.
2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Institute of Electrical and Electronics Engineers Inc., 2022. p. 74-75 (Digest of Technical Papers - Symposium on VLSI Technology; Vol. 2022-June).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing

AU - Lo, Yu Chen

AU - Wu, Yi Chung

AU - Yang, Chia Hsiang

PY - 2022

Y1 - 2022

N2 - This work presents the first dedicated processor that supports the entire hyperspectral image (HSI) processing work-flow. Folding and data interleaving are applied to the processing elements (PEs), reducing the area by 57%. The reconfigurable PE datapath enables 92.7% utilization with 38.1% less area. Data sparsity is leveraged for clock gating, saving 32.2% power. The chip dissipates 44.3mW at 175MHz from a 0.68V supply. It delivers a 62.4fps throughput for 256×256×64 HSIs. Compared to a high-end CPU, this work achieves a 544× higher throughput and 82,352× higher energy efficiency.

AB - This work presents the first dedicated processor that supports the entire hyperspectral image (HSI) processing work-flow. Folding and data interleaving are applied to the processing elements (PEs), reducing the area by 57%. The reconfigurable PE datapath enables 92.7% utilization with 38.1% less area. Data sparsity is leveraged for clock gating, saving 32.2% power. The chip dissipates 44.3mW at 175MHz from a 0.68V supply. It delivers a 62.4fps throughput for 256×256×64 HSIs. Compared to a high-end CPU, this work achieves a 544× higher throughput and 82,352× higher energy efficiency.

UR - http://www.scopus.com/inward/record.url?scp=85135236224&partnerID=8YFLogxK

U2 - 10.1109/VLSITechnologyandCir46769.2022.9830370

DO - 10.1109/VLSITechnologyandCir46769.2022.9830370

M3 - Conference contribution

AN - SCOPUS:85135236224

T3 - Digest of Technical Papers - Symposium on VLSI Technology

SP - 74

EP - 75

BT - 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022

Y2 - 12 June 2022 through 17 June 2022

ER -

A 44.3mW 62.4fps Hyperspectral Image Processor for MAV Remote Sensing

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