3D resistive RAM cell design for high-density storage class memory—a review

Boris Hudec*, Chung Wei Hsu, I. Ting Wang, Wei Li Lai, Che Chia Chang, Taifang Wang, Karol Fröhlich, Chia Hua Ho, Chen Hsi Lin, Tuo-Hung Hou

*Corresponding author for this work

Research output: Contribution to journalReview articlepeer-review

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Engineering & Materials Science