3D integration technology-introduction and overview

Chuan Seng Tan^*, Steven J. Koester, Kuan Neng Chen

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

Original language	English
Title of host publication	3D Integration for VLSI Systems
Publisher	Pan Stanford Publishing Pte. Ltd.
Pages	2-26
Number of pages	25
ISBN (Electronic)	9789814303828
ISBN (Print)	9789814303811
DOIs	https://doi.org/10.4032/9789814303828
State	Published - 19 Apr 2016

Access to Document

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