3-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)

Wen Wei Shen, Yu Min Lin, Shang Chun Chen, Hsiang Hung Chang, Tao Chih Chang, Wei Chung Lo, Chien-Chung Lin, Yung Fa Chou, Ding Ming Kwai, Ming Jer Kao, Kuan-Neng Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

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