晶圓次微米接合方法及其接合層

@misc{eaff1d528efe4be1af5b88cf513dbc24,

title = "晶圓次微米接合方法及其接合層",

author = "Kuan-Neng Chen",

year = "2015",

month = mar,

day = "11",

language = "???core.languages.zh_TW???",

type = "Patent",

note = "I476839",

}

晶圓次微米接合方法及其接合層. / Chen, Kuan-Neng (Inventor).
Patent No.: I476839. Mar 11, 2015.

Research output: Patent

TY - PAT

T1 - 晶圓次微米接合方法及其接合層

AU - Chen, Kuan-Neng

PY - 2015/3/11

Y1 - 2015/3/11

M3 - Patent

M1 - I476839

ER -

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