Project Details
| Status | Finished |
|---|---|
| Effective start/end date | 1/08/23 → 31/07/24 |
Ultra-high Bandwidth Memory And Logic Chip Integration System Platform Realized By Ultra-thin Wafer Stacking With Bumpless Structure
- Chen, Kuan-Neng (PI)
| Status | Finished |
|---|---|
| Effective start/end date | 1/08/23 → 31/07/24 |