Project Details
| Status | Finished |
|---|---|
| Effective start/end date | 1/08/10 → 31/07/11 |
Studies of Three-Dimensional Integrated Circuit (3D IC) with Carbon Nanotube (CNT) and Nickel Nanowire as Through-Silicon Via (TSV)
- Chen, Kuan-Neng (PI)
| Status | Finished |
|---|---|
| Effective start/end date | 1/08/10 → 31/07/11 |