Project Details
| Status | Finished |
|---|---|
| Effective start/end date | 1/08/22 → 31/07/23 |
Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration
- Chen, Kuan-Neng (PI)
| Status | Finished |
|---|---|
| Effective start/end date | 1/08/22 → 31/07/23 |