Yu-Min Lee

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Yu-Min Lee

Associate Professor

 https://orcid.org/0000-0002-4009-924X
Calculated based on number of publications stored in Pure and citations from Scopus
Calculated based on number of publications stored in Pure and citations from Scopus
Calculated based on number of publications stored in Pure and citations from Scopus
1993 …2023

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  • 2022

    An Approximated Model of Boltzmann Transport Equation for Nano-Scale Thermal Analysis

    Chang, C. C., Chiou, H. W. & Lee, Y. M., 2022, Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022. IEEE Computer Society, (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2022-May).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2021

    DLAG-TA: Deep Learning-Based Adaptive Grid Builder for System-Level Thermal Analysis

    Lo, W. S., Chiou, H. W., Hsu, S. C. & Lee, Y. M., 2021, Proceedings of the 20th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2021. IEEE Computer Society, p. 477-483 7 p. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2021-June).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Thermal Pad Design Flow for Automotive Electronics

    Chen, G. J., Chiou, H. W., Chang, Y. T. & Lee, Y. M., 2021, 2021 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021. Institute of Electrical and Electronics Engineers Inc., (2021 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2020

    A Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design

    Huang, M. Y., Chen, H-M., Chen, K-N., Wu, S. H., Lee, Y-M. & Su, A. Y., Jun 2020, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2236-2241 6 p. 9159244. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Temperature-to-Power Mapping for Smartphones

    Chiou, H. W., Lee, Y. M., Hsu, S. C., Chen, G. J., Pan, C. W. & Chen, T. Y., Jul 2020, Proceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020. IEEE Computer Society, p. 783-789 7 p. 9190487. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2020-July).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2019

    Learning based mesh generation for thermal simulation in handheld devices with variable power consumption

    Lo, W. S., Chiou, H. W., Hsu, S. C., Lee, Y. M. & Cheng, L. C., May 2019, Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE Computer Society, p. 7-12 6 p. 8757347. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2019-May).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    4 Scopus citations

  • Multi-angle bended heat pipe design using X-architecture routing with dynamic thermal weight on mobile devices

    Hsiao, H. H., Chiou, H. W. & Lee, Y-M., 21 Jan 2019, ASP-DAC 2019 - 24th Asia and South Pacific Design Automation Conference. Institute of Electrical and Electronics Engineers Inc., p. 70-75 6 p. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    2 Scopus citations

  • Phone-nomenon: A system-level thermal simulator for handheld devices

    Chiou, H. W., Lee, Y-M., Shiau, S. Y., Pan, C. W. & Chen, T. Y., 21 Jan 2019, ASP-DAC 2019 - 24th Asia and South Pacific Design Automation Conference. Institute of Electrical and Electronics Engineers Inc., p. 577-584 8 p. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    4 Scopus citations
  • 2018

    A System-Level Thermal Simulator with Automatic Meshing Techniques

    Wang, J. H., Lee, Y-M., Hsiao, H. H. & Cheng, L. C., 24 Jul 2018, Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018. Institute of Electrical and Electronics Engineers Inc., p. 984-991 8 p. 8419468. (Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    2 Scopus citations
  • 2017

    Thermal modeling and design on smartphones with heat pipe cooling technique

    Chiou, H. W., Lee, Y-M., Hsiao, H. H. & Cheng, L. C., 13 Dec 2017, 2017 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2017. Institute of Electrical and Electronics Engineers Inc., p. 482-489 8 p. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD; vol. 2017-November).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    3 Scopus citations

  • Yield-driven redundant power bump assignment for power network robustness

    Lee, Y-M., Lee, C. H. & Zhu, Y. C., 16 Feb 2017, 2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017. Institute of Electrical and Electronics Engineers Inc., p. 269-274 6 p. 7858331. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2016

    ThermPL: Thermal-aware placement based on thermal contribution and locality

    Song, J., Lee, Y-M. & Ho, C. T., 31 May 2016, 2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016. Institute of Electrical and Electronics Engineers Inc., 7482538. (2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    5 Scopus citations
  • 2015

    A TSV noise-aware 3-D placer

    Lee, Y-M., Chen, C., Song, J. & Pan, K. T., 22 Apr 2015, Proceedings of the 2015 Design, Automation and Test in Europe Conference and Exhibition, DATE 2015. Institute of Electrical and Electronics Engineers Inc., p. 1653-1658 6 p. 7092658. (Proceedings -Design, Automation and Test in Europe, DATE; vol. 2015-April).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    1 Scopus citations
  • 2014

    Incremental transient simulation of power grid

    Ho, C. T., Lee, Y-M., Wei, S. H. & Cheng, L. C., 1 Jan 2014, ISPD 2014 - Proceedings of the 2014 ACM International Symposium on Physical Design. Association for Computing Machinery, p. 93-100 8 p. (Proceedings of the International Symposium on Physical Design).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    1 Scopus citations
  • 2013

    I-LUTSim: An iterative look-up table based thermal simulator for 3-D ICs

    Pan, C. W., Lee, Y-M., Huang, P. Y., Yang, C. P., Lin, C. T., Lee, C. H., Chou, Y. F. & Kwai, D. M., 20 May 2013, 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013. p. 151-156 6 p. 6509588. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    3 Scopus citations

  • NUMANA: A hybrid numerical and analytical thermal simulator for 3-D ICs

    Lee, Y-M., Wu, T. H., Huang, P. Y. & Yang, C. P., 21 Oct 2013, Proceedings - Design, Automation and Test in Europe, DATE 2013. p. 1379-1384 6 p. 6513728. (Proceedings -Design, Automation and Test in Europe, DATE).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    6 Scopus citations

  • Power delivery network design for wiring and TSV resource minimization in TSV-based 3-D ICs

    Wei, S. H., Lee, Y-M., Ho, C. T., Sun, C. T. & Cheng, L. C., 15 Aug 2013, 2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013. 6533816. (2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2012

    A robust incremental power grid analyzer by macromodeling approach and Orthogonal Matching Pursuit

    Lee, Y. H., Lee, Y-M., Cheng, L. C. & Chang, Y. T., 26 Nov 2012, Proceedings of the 4th Asia Symposium on Quality Electronic Design, ASQED 2012. p. 64-70 7 p. 6320477. (Proceedings of the 4th Asia Symposium on Quality Electronic Design, ASQED 2012).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    3 Scopus citations

  • On-chip statistical hot-spot estimation using mixed-mesh statistical polynomial expression generating and skew-normal based moment matching techniques

    Huang, P. Y., Lee, Y-M. & Pan, C. W., 26 Apr 2012, ASP-DAC 2012 - 17th Asia and South Pacific Design Automation Conference. p. 603-608 6 p. 6165028. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2011

    Redundant via insertion under timing constraints

    Pan, C. W. & Lee, Y-M., 22 Jun 2011, Proceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011. p. 627-633 7 p. 5770794. (Proceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    10 Scopus citations

  • Supply voltage assignment for power reduction in 3D ICs considering thermal effect and level shifter budget

    Whi, S. H. & Lee, Y-M., 28 Jun 2011, Proceedings of 2011 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2011. p. 418-421 4 p. 5783562. (Proceedings of 2011 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2011).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    1 Scopus citations
  • 2010

    A hierarchical bin-based legalizer for standard-cell designs with minimal disturbance

    Lee, Y-M., Wu, T. Y. & Chiang, P. Y., 28 Apr 2010, 2010 15th Asia and South Pacific Design Automation Conference, ASP-DAC 2010. p. 568-573 6 p. 5419819. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    9 Scopus citations

  • Spatial correlation extraction with a limited amount of measurement data

    Whi, S. H., Su, B. S., Lee, Y-M. & Pan, C. W., 17 Sep 2010, Proceedings of the 2nd Asia Symposium on Quality Electronic Design, ASQED 2010. p. 248-254 7 p. 5548251. (Proceedings of the 2nd Asia Symposium on Quality Electronic Design, ASQED 2010).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    1 Scopus citations

  • Statistical electro-thermal analysis with high compatibility of leakage power models

    Chang, H. C., Huang, P. Y., Li, T. J. & Lee, Y-M., 1 Dec 2010, Proceedings - IEEE International SOC Conference, SOCC 2010. p. 139-144 6 p. 5784747. (Proceedings - IEEE International SOC Conference, SOCC 2010).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    3 Scopus citations
  • 2009

    A multiple supply voltage based power reduction method in 3-D ICs considering process variations and thermal effects

    Yu, S. A., Huang, P. Y. & Lee, Y-M., 20 Apr 2009, Proceedings of the ASP-DAC 2009: Asia and South Pacific Design Automation Conference 2009. p. 55-60 6 p. 4796441. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    1 Scopus citations

  • Post-routing redundant via insertion with wire spreading capability

    Lei, C. K., Chiang, P. Y. & Lee, Y-M., 20 Apr 2009, Proceedings of the ASP-DAC 2009: Asia and South Pacific Design Automation Conference 2009. p. 468-473 6 p. 4796524. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    7 Scopus citations

  • Stochastic thermal simulation considering spatial correlated within-die process variations

    Huang, P. Y., Wu, J. H. & Lee, Y-M., 20 Apr 2009, Proceedings of the ASP-DAC 2009: Asia and South Pacific Design Automation Conference 2009. IEEE, p. 31-36 6 p. 4796437. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    5 Scopus citations
  • 2008

    Full-chip thermal analysis for the early design stage via generalized integral transforms

    Huang, P. Y., Lin, C. K. & Lee, Y-M., 21 Aug 2008, 2008 Asia and South Pacific Design Automation Conference, ASP-DAC. p. 462-467 6 p. 4483995. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    1 Scopus citations

  • Timing-constrained yield-driven redundant via insertion

    Yan, J. T., Chen, Z. W., Chiang, B. Y. & Lee, Y-M., 30 Nov 2008, Proceedings of APCCAS 2008 - 2008 IEEE Asia Pacific Conference on Circuits and Systems. IEEE, p. 1688-1691 4 p. 4746363. (IEEE Asia-Pacific Conference on Circuits and Systems, Proceedings, APCCAS).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    4 Scopus citations
  • 2007

    An aggregation-based algebraic multigrid method for power grid analysis

    Huang, P. Y., Chou, H. Y. & Lee, Y-M., 28 Aug 2007, Proceedings - Eighth International Symposium on Quality Electronic Design, ISQED 2007. IEEE, p. 159-164 6 p. 4149028. (Proceedings - Eighth International Symposium on Quality Electronic Design, ISQED 2007).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    8 Scopus citations

  • Hierarchical power delivery network analysis using Markov chains

    Huang, P. Y., Lin, C. K. & Lee, Y-M., 1 Dec 2007, Proceedings - 20th Anniversary IEEE International SOC Conference. p. 283-286 4 p. 4545475. (Proceedings - 20th Anniversary IEEE International SOC Conference).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2006

    Simultaneous area minimization and decaps insertion for power delivery network using adjoint sensitivity analysis with IEKS method

    Huang, P. Y., Lee, Y-M., Tsai, J. L. & Chen, C. C. P., Sep 2006, ISCAS 2006: 2006 IEEE International Symposium on Circuits and Systems, Proceedings. p. 1291-1294 4 p. 1692829. (Proceedings - IEEE International Symposium on Circuits and Systems).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2003

    A hierarchical analysis methodology for chip-level power delivery with realizable model reduction

    Lee, Y-M. & Chung-Ping Chen, C., 1 Jan 2003, Proceedings of the ASP-DAC 2003 Asia and South Pacific Design Automation Conference. Institute of Electrical and Electronics Engineers Inc., p. 614-618 5 p. 1195098. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC; vol. 2003-January).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2002

    HiPRIME: Hierarchical and passivity reserved interconnect macromodeling engine for RLKC power delivery

    Cao, Y., Lee, Y-M., Chen, T. H. & Chen, C. C. P., Jun 2002, Proceedings 2002 Design Automation Conference (IEEE Cat. No.02CH37324). IEEE, p. 379-384 6 p. (Proceedings-Design Automation Conference).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    1 Scopus citations
  • 2001

    Optimal spacing and capacitance padding for general clock structures

    Lee, Y-M., Lai, H. Y. & Chen, C. C. P., 1 Jan 2001, Proceedings of the ASP-DAC 2001: Asia and South Pacific Design Automation Conference 2001. Institute of Electrical and Electronics Engineers Inc., p. 115-119 5 p. 913290. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC; vol. 2001-January).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review