Personal profile
Research Interests
Computer-aided Design of VLSI Circuits
Experience
1995/6~1995/12 Senior Engineer, ZyXEL Communications Corp., Hsinchu, Taiwan
2001/6~2001/9 Summer Intern, Intel Corp., Austin,Texas
Education/Academic qualification
PhD, Electrical and Computer Engineering, University of Wisconsin-Madison
External positions
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Collaborations and top research areas from the last five years
Projects
- 14 Finished
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Thermal-Aware Chiplet Placement
Lee, Y.-M. (PI)
1/08/21 → 31/10/22
Project: Government Ministry › Other Government Ministry Institute
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Automatic mesh generation for thermal analysis in handheld devices via machine learning techniques
Lee, Y.-M. (PI)
1/08/20 → 30/09/21
Project: Government Ministry › Other Government Ministry Institute
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Automatic mesh generation for thermal analysis in handheld devices via machine learning techniques
Lee, Y.-M. (PI)
1/08/19 → 30/09/20
Project: Government Ministry › Other Government Ministry Institute
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Thermal Modeling and Design for Multi-Angle Bended and Multiple Heat Pipes on Smartphones
Lee, Y.-M. (PI)
1/08/18 → 31/07/19
Project: Government Ministry › Other Government Ministry Institute
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Heat Pipe Thermal Modeling and Design for High-End Smartphones
Lee, Y.-M. (PI)
1/08/17 → 31/07/18
Project: Government Ministry › Other Government Ministry Institute
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Thermal-Aware Chiplet Placement for 2.5D ICs with Sequence Pair Based Tree
Lee, Y. M., Chiou, H. W. & Jiang, J. H., 10 May 2026, In: ACM Transactions on Design Automation of Electronic Systems. 31, 3, 42.Research output: Contribution to journal › Article › peer-review
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MErBAG: Mesh Error Based Adaptive Grid Generation in System-Level Thermal Analysis
Lee, Y. M., Hsu, S. C., Tsai, B. Y. & Lu, Z. L., 2025, Proceedings of the 26th International Symposium on Quality Electronic Design, ISQED 2025. IEEE Computer Society, (Proceedings - International Symposium on Quality Electronic Design, ISQED).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Thermal Model Extraction at Chip Boundaries for Thermal Simulation of Chip in a System
Lin, K. X., Lee, Y. M. & Tsai, B. Y., 2025, Proceedings of the 26th International Symposium on Quality Electronic Design, ISQED 2025. IEEE Computer Society, (Proceedings - International Symposium on Quality Electronic Design, ISQED).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Therunet-SP: 2.5D IC Thermal Simulation Using U-Net Convolution and Scaling Procedure
Lee, Y. M., Huang, S. P. & Lin, Y. H., 2025, Proceedings of the 26th International Symposium on Quality Electronic Design, ISQED 2025. IEEE Computer Society, (Proceedings - International Symposium on Quality Electronic Design, ISQED).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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SpotLight: A Hotspot-Greedy, Light-Weighted, and Automated Thermal Modeling Framework for Early Smartphone Design
Wu, C. W., Lee, Y. M., Huang, P. Y., Yang, B. J., Chen, T. Y., Huang, T. C. & Lee, Y. L., 2024, Proceedings of the 25th International Symposium on Quality Electronic Design, ISQED 2024. IEEE Computer Society, (Proceedings - International Symposium on Quality Electronic Design, ISQED).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review