Projects per year
Personal profile
Research Interests
Computer-aided Design of VLSI Circuits
Experience
1995/6~1995/12 Senior Engineer, ZyXEL Communications Corp., Hsinchu, Taiwan
2001/6~2001/9 Summer Intern, Intel Corp., Austin,Texas
Education/Academic qualification
PhD, Electrical and Computer Engineering, University of Wisconsin-Madison
External positions
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Dive into the research topics where Yu-Min Lee is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
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Projects
- 14 Finished
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Thermal-Aware Chiplet Placement
Lee, Y.-M. (PI)
1/08/21 → 31/10/22
Project: Government Ministry › Other Government Ministry Institute
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Automatic mesh generation for thermal analysis in handheld devices via machine learning techniques
Lee, Y.-M. (PI)
1/08/20 → 30/09/21
Project: Government Ministry › Other Government Ministry Institute
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Automatic mesh generation for thermal analysis in handheld devices via machine learning techniques
Lee, Y.-M. (PI)
1/08/19 → 30/09/20
Project: Government Ministry › Other Government Ministry Institute
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Thermal Modeling and Design for Multi-Angle Bended and Multiple Heat Pipes on Smartphones
Lee, Y.-M. (PI)
1/08/18 → 31/07/19
Project: Government Ministry › Other Government Ministry Institute
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Heat Pipe Thermal Modeling and Design for High-End Smartphones
Lee, Y.-M. (PI)
1/08/17 → 31/07/18
Project: Government Ministry › Other Government Ministry Institute
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SpotLight: A Hotspot-Greedy, Light-Weighted, and Automated Thermal Modeling Framework for Early Smartphone Design
Wu, C. W., Lee, Y. M., Huang, P. Y., Yang, B. J., Chen, T. Y., Huang, T. C. & Lee, Y. L., 2024, Proceedings of the 25th International Symposium on Quality Electronic Design, ISQED 2024. IEEE Computer Society, (Proceedings - International Symposium on Quality Electronic Design, ISQED).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration
Chiou, H. W., Jiang, J. H., Chang, Y. T., Lee, Y. M. & Pan, C. W., 16 Jan 2023, ASP-DAC 2023 - 28th Asia and South Pacific Design Automation Conference, Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 7-12 6 p. (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Scopus citations -
Phone-nomenon 2.0: A compact thermal model for smartphones
Lee, Y. M., Chiou, H. W., Shiau, S., Pan, C. W. & Ting, S. H., 2023, (Accepted/In press) In: IET Computers and Digital Techniques.Research output: Contribution to journal › Article › peer-review
Open Access1 Scopus citations -
An Approximated Model of Boltzmann Transport Equation for Nano-Scale Thermal Analysis
Chang, C. C., Chiou, H. W. & Lee, Y. M., 2022, Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022. IEEE Computer Society, (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2022-May).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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DLAG-TA: Deep Learning-Based Adaptive Grid Builder for System-Level Thermal Analysis
Lo, W. S., Chiou, H. W., Hsu, S. C. & Lee, Y. M., 2021, Proceedings of the 20th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2021. IEEE Computer Society, p. 477-483 7 p. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2021-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review