Projects per year
Personal profile
Research Interests
Computer-aided Design of VLSI Circuits
Experience
1995/6~1995/12 Senior Engineer, ZyXEL Communications Corp., Hsinchu, Taiwan
2001/6~2001/9 Summer Intern, Intel Corp., Austin,Texas
Education/Academic qualification
PhD, University of Wisconsin-Madison
External positions
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Dive into the research topics where Yu-Min Lee is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Thermal-Aware Chiplet Placement
1/08/21 → 31/07/22
Project: Government Ministry › Ministry of Science and Technology
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Automatic mesh generation for thermal analysis in handheld devices via machine learning techniques
1/08/20 → 30/09/21
Project: Government Ministry › Ministry of Science and Technology
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Automatic mesh generation for thermal analysis in handheld devices via machine learning techniques
1/08/19 → 30/09/20
Project: Government Ministry › Ministry of Science and Technology
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Thermal Modeling and Design for Multi-Angle Bended and Multiple Heat Pipes on Smartphones
1/08/18 → 31/07/19
Project: Government Ministry › Ministry of Science and Technology
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Heat Pipe Thermal Modeling and Design for High-End Smartphones
1/08/17 → 31/07/18
Project: Government Ministry › Ministry of Science and Technology
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DLAG-TA: Deep Learning-Based Adaptive Grid Builder for System-Level Thermal Analysis
Lo, W. S., Chiou, H. W., Hsu, S. C. & Lee, Y. M., 2021, Proceedings of the 20th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2021. IEEE Computer Society, p. 477-483 7 p. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2021-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Thermal Pad Design Flow for Automotive Electronics
Chen, G. J., Chiou, H. W., Chang, Y. T. & Lee, Y. M., 2021, 2021 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021. Institute of Electrical and Electronics Engineers Inc., (2021 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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A Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design
Huang, M. Y., Chen, H-M., Chen, K-N., Wu, S. H., Lee, Y-M. & Su, A. Y., Jun 2020, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2236-2241 6 p. 9159244. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Temperature-to-Power Mapping for Smartphones
Chiou, H. W., Lee, Y. M., Hsu, S. C., Chen, G. J., Pan, C. W. & Chen, T. Y., Jul 2020, Proceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020. IEEE Computer Society, p. 783-789 7 p. 9190487. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2020-July).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Learning based mesh generation for thermal simulation in handheld devices with variable power consumption
Lo, W. S., Chiou, H. W., Hsu, S. C., Lee, Y. M. & Cheng, L. C., May 2019, Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE Computer Society, p. 7-12 6 p. 8757347. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2019-May).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
4 Scopus citations