Projects per year
Personal profile
Research Interests
Computer-aided Design of VLSI Circuits
Experience
1995/6~1995/12 Senior Engineer, ZyXEL Communications Corp., Hsinchu, Taiwan
2001/6~2001/9 Summer Intern, Intel Corp., Austin,Texas
Education/Academic qualification
PhD, Electrical and Computer Engineering, University of Wisconsin-Madison
External positions
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Projects
- 14 Finished
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Thermal-Aware Chiplet Placement
1/08/21 → 31/10/22
Project: Government Ministry › Other Government Ministry Institute
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Automatic mesh generation for thermal analysis in handheld devices via machine learning techniques
1/08/20 → 30/09/21
Project: Government Ministry › Other Government Ministry Institute
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Automatic mesh generation for thermal analysis in handheld devices via machine learning techniques
1/08/19 → 30/09/20
Project: Government Ministry › Other Government Ministry Institute
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Thermal Modeling and Design for Multi-Angle Bended and Multiple Heat Pipes on Smartphones
1/08/18 → 31/07/19
Project: Government Ministry › Other Government Ministry Institute
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Heat Pipe Thermal Modeling and Design for High-End Smartphones
1/08/17 → 31/07/18
Project: Government Ministry › Other Government Ministry Institute
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Phone-nomenon 2.0: A compact thermal model for smartphones
Lee, Y. M., Chiou, H. W., Shiau, S., Pan, C. W. & Ting, S. H., 2023, (Accepted/In press) In: IET Computers and Digital Techniques.Research output: Contribution to journal › Article › peer-review
Open Access -
An Approximated Model of Boltzmann Transport Equation for Nano-Scale Thermal Analysis
Chang, C. C., Chiou, H. W. & Lee, Y. M., 2022, Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022. IEEE Computer Society, (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2022-May).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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DLAG-TA: Deep Learning-Based Adaptive Grid Builder for System-Level Thermal Analysis
Lo, W. S., Chiou, H. W., Hsu, S. C. & Lee, Y. M., 2021, Proceedings of the 20th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2021. IEEE Computer Society, p. 477-483 7 p. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2021-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Thermal Pad Design Flow for Automotive Electronics
Chen, G. J., Chiou, H. W., Chang, Y. T. & Lee, Y. M., 2021, 2021 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021. Institute of Electrical and Electronics Engineers Inc., (2021 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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A Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design
Huang, M. Y., Chen, H-M., Chen, K-N., Wu, S. H., Lee, Y-M. & Su, A. Y., Jun 2020, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2236-2241 6 p. 9159244. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review