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Personal profile

Research Interests

Computer-aided Design of VLSI Circuits

Experience

1995/6~1995/12 Senior Engineer, ZyXEL Communications Corp., Hsinchu, Taiwan

2001/6~2001/9 Summer Intern, Intel Corp., Austin,Texas

Education/Academic qualification

PhD, University of Wisconsin-Madison

External positions

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  • DLAG-TA: Deep Learning-Based Adaptive Grid Builder for System-Level Thermal Analysis

    Lo, W. S., Chiou, H. W., Hsu, S. C. & Lee, Y. M., 2021, Proceedings of the 20th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2021. IEEE Computer Society, p. 477-483 7 p. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2021-June).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • Thermal Pad Design Flow for Automotive Electronics

    Chen, G. J., Chiou, H. W., Chang, Y. T. & Lee, Y. M., 2021, 2021 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021. Institute of Electrical and Electronics Engineers Inc., (2021 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • A Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design

    Huang, M. Y., Chen, H-M., Chen, K-N., Wu, S. H., Lee, Y-M. & Su, A. Y., Jun 2020, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2236-2241 6 p. 9159244. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • Temperature-to-Power Mapping for Smartphones

    Chiou, H. W., Lee, Y. M., Hsu, S. C., Chen, G. J., Pan, C. W. & Chen, T. Y., Jul 2020, Proceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020. IEEE Computer Society, p. 783-789 7 p. 9190487. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2020-July).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • Learning based mesh generation for thermal simulation in handheld devices with variable power consumption

    Lo, W. S., Chiou, H. W., Hsu, S. C., Lee, Y. M. & Cheng, L. C., May 2019, Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE Computer Society, p. 7-12 6 p. 8757347. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2019-May).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    4 Scopus citations