Research output per year
Research output per year
Personal profile
Education/Academic qualification
PhD, Computer Science and Information Engineering, National Taiwan University
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Dive into the research topics where Yu-Lun Liu is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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10-second Cu/Polymer Hybrid Bonding Using Area-Selective Metal Passivation for 3D Integration
Liu, Y. L., Chen, T. Y., Ebisawa, K., Irie, M., Chuang, Y. C., Yeh, H. W., Fujimura, S. & Chen, K. N., 2025, In: IEEE Electron Device Letters. 46, 5, p. 833-836 4 p.Research output: Contribution to journal › Article › peer-review
3 Scopus citations -
3D Gaussian Splatting with Grouped Uncertainty for Unconstrained Images
Hou, H. Y., Hsu, C. C., Huang, Y. C., Shen, M. Y., Sun, W. F., Sun, C., Chang, C. C., Liu, Y. L. & Lee, C. Y., 2025, 2025 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2025 - Proceedings. Rao, B. D., Trancoso, I., Sharma, G. & Mehta, N. B. (eds.). Institute of Electrical and Electronics Engineers Inc., (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Scopus citations -
Advanced CMP Optimization for Enhanced Cu/Polymer Hybrid Bonding in 3D IC
Chen, T. Y., Liu, Y. L. & Chen, K. N., 2025, 2025 IEEE International Interconnect Technology Conference, IITC 2025. Institute of Electrical and Electronics Engineers Inc., (2025 IEEE International Interconnect Technology Conference, IITC 2025).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
2 Scopus citations -
An Innovative dual fan-out module 3D packaging architecture for large-size, low-warpage, high-density multi-chip heterogeneous integration
Hsu, C. K., Hsiao, C. C., Wang, C. Y., Liu, Y. L., Yu, C. F., Wang, C. H., Lo, F. H., Lo, W. C. & Chen, K. N., 2025, Proceedings - 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Energy-Efficient AI: From Cloud to Edge, IMPACT 2025. IEEE Computer Society, p. 439-442 4 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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A Transfer Bonding Technology for Advanced 2.5-D Integration with Reduced Warpage and Improved Stacking Flexibility
Liu, Y. L., Hsu, C. K., Hsiao, C. C., Li, C. T., Lin, J. R. & Chen, K. N., 2025, In: IEEE Electron Device Letters. 46, 9, p. 1609-1611 3 p.Research output: Contribution to journal › Article › peer-review
1 Scopus citations