Calculated based on number of publications stored in Pure and citations from Scopus
Calculated based on number of publications stored in Pure and citations from Scopus
Calculated based on number of publications stored in Pure and citations from Scopus
1992 …2024

Research activity per year

Network

Han Ping D. Shieh

  • Department of Photonics and Display Institute
  • National Yang Ming Chiao Tung University
  • Department of Photonics
  • SID (Society for Information Display
  • Department of Photonics
  • Inst. of Electro-Optical Engineering
  • Department of Photonics
  • Department of Photonics
  • Department of Photonics
  • Display Institute
  • Department O Electronics Engineering
  • Department of Photonics
  • Department of Photonics and Institute of Electro-Optical Engineering
  • Dept. Photonics Inst. Electro-O.
  • Phtonics Department
  • Department of Photonics
  • Department of Photonics
  • Division of MOEMS
  • Huazhong University of Science and Technology
  • Department of Materials Science and Engineering
  • National Chiao Tung Universit
  • Department of Electro-Optical Engineering
  • Department of Photonics
  • Dept. of Electrical and Computer Engineering
  • Institute of Communications Engineering
  • Shanghai Tang University
  • IEEE
  • Shanghai Jiao Tong University
  • National Engineering Lab for TFT-LCD Materials and Technologies
  • SID
  • Shanghai Tang University

External person

Manu Garg

  • Indian Institute of Technology Delhi
  • National Yang Ming Chiao Tung University

External person

Daniel D. Stancil

  • Department of Electrical and Computer Engineering
  • Carnegie Mellon University

External person

T. E. Schlesinger

  • Department of Electrical and Computer Engineering
  • Carnegie Mellon University
  • Data Storage Systems Center
  • Electrical and Computer Engineering Faculty

External person

Pushpapraj Singh

  • Indian Institute of Technology Delhi

External person

Yi Kuen Lee

  • Dept. of Mechanical and Aerospace Engineering
  • Hong Kong University of Science and Technology
  • Dept of MAE
  • Division of BME

External person

Chi Hung Lee

  • Department of Photonics and Institute of Electro-Optical Engineering
  • National Yang Ming Chiao Tung University
  • Industrial Technology Research Institute of Taiwan
  • Department of Photonics
  • Department of Photonics
  • Department of Photanics
  • Feng Chia University
  • Department of Electrical Engineering
  • Department of Photonics
  • Institute of Electro-Optical Engineering
  • Institute of Electro-Optical Engineering

External person

Weileun Fang

  • Department of Power Mechanical Engineering
  • National Tsing Hua University
  • NEMS Inst.
  • Institute of NanoEngineering and MicroSystems
  • Department of Mechanical Engineering
  • National Yang Ming Chiao Tung University
  • Dept. of Power Mechanical Eng.

External person

Hsi Fu Shih

  • National Chung Hsing University
  • Department of Mechanical Engineering
  • Dept. of Mechanical Engineering
  • Industrial Technology Research Institute of Taiwan
  • Opto-electronics and Systems Laboratories
  • Institute of Optical Sciences
  • National Central University

External person

Wei Xu

  • Hong Kong University of Science and Technology
  • Dept. of Mechanical and Aerospace Engineering
  • Dept of MAE
  • Shenzhen University

External person

Dhairya S. Arya

  • Indian Institute of Technology Delhi

External person

Shenhui Ma

  • Xi'an Jiaotong University
  • Hong Kong University of Science and Technology
  • Dept. of Mechanical and Aerospace Engineering
  • Department of Microelectronics

External person

Wei Hung Hsu

  • Department of Electrical Engineering
  • National Yang Ming Chiao Tung University
  • Industrial Technology Research Institute of Taiwan
  • Green Energy and Environment Research Laboratories
  • Department of Electrical Engineering
  • Dept. of Electronics Engineering

External person

Sushil Kumar

  • Indian Institute of Technology Delhi

External person

Bo Gao

  • Xi'an Jiaotong University
  • Hong Kong University of Science and Technology
  • Division of Biomedical Engineering
  • Division of BME

External person

Chia Chun Hsieh

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Yuan Chieh Lee

  • National Yang Ming Chiao Tung University

External person

Mujeeb Yousuf

  • Indian Institute of Technology Delhi

External person

Fang Wei Tsai

  • National Yang Ming Chiao Tung University

External person

Yuan Chin Lee

  • Industrial Technology Research Institute of Taiwan
  • Electronics and Opto-electronics Research Laboratories
  • Institute of Photonics Technologies
  • National Tsing Hua University
  • Opto-electronics and Systems Laboratories

External person

Chia Wei Lin

  • Department of Electrical and Control Engineering
  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Chin Cheng Wu

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering
  • Chung-shan Institute of Science and Technology Taiwan
  • Department of Electrical Engineering

External person

Hsueh Liang Chou

  • Institute of Mechanical Engineering
  • National Yang Ming Chiao Tung University
  • Department of Mechanical Engineering

External person

David N. Lambeth

  • Department of Electrical and Computer Engineering
  • Carnegie Mellon University

External person

Hsiu Ting Hsu

  • NEMS Inst.
  • National Tsing Hua University
  • Institute of NanoEngineering and MicroSystems

External person

Yue Jheng Lin

  • Department of Electrical Engineering
  • National Yang Ming Chiao Tung University
  • Department of Electrical and Control Engineering

External person

Jhong Wei Wu

  • Department of Electrical and Control Engineering
  • National Yang Ming Chiao Tung University

External person

Kui Song

  • Dept. of Mechanical and Aerospace Engineering
  • Hong Kong University of Science and Technology

External person

Tzu Lin Chang

  • Department of Electrical and Control Engineering
  • National Yang Ming Chiao Tung University

External person

Chun Hsiang Liao

  • National Yang Ming Chiao Tung University

External person

Yu Chi Chuang

  • National Yang Ming Chiao Tung University

External person

Fan Chung Tseng

  • Advanced Technology Center
  • BenQ Corporation
  • Advanced Technology Center

External person

Kelvin Lee

  • Advanced Technology Center
  • BenQ Corporation
  • Advanced Technology Center

External person

Gung Ding Lin

  • Dept. of Mechanical Engineering
  • National Chung Hsing University
  • Department of Mechanical Engineering

External person

Gianmario Scotti

  • National Yang Ming Chiao Tung University

External person

Shao Feng Hung

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Department of Electrical and Control Engineering
  • Institute of Electrical Control Engineering

External person

Tsung Ping Hsu

  • Advanced Technology Center
  • BenQ Corporation
  • Advanced Technology Center

External person

Hsin Yu Huang

  • Department of Power Mechanical Engineering
  • National Tsing Hua University
  • Dept. of Power Mechanical Eng.

External person

Victor Farm Guoo Tseng

  • Department of Electrical and Control Engineering
  • National Yang Ming Chiao Tung University

External person

Wai W. Wang

  • Advanced Technology Center
  • BenQ Corporation
  • Advanced Technology Center

External person

Wei Zhi Huang

  • Department of Electrical and Control Engineering
  • National Yang Ming Chiao Tung University

External person

Xiaoyi Wang

  • Hong Kong University of Science and Technology
  • Dept. of Mechanical and Aerospace Engineering

External person

S. H. Wu

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

You Zen Chen

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Chien Hsun Huang

  • Department of Electrical and Control Engineering
  • National Yang Ming Chiao Tung University

External person

R. S. Burton

  • Motorola
  • Carnegie Mellon University

External person

Khanjan Joshi

  • Indian Institute of Technology Delhi

External person

Liang Kai Wang

  • National Yang Ming Chiao Tung University

External person

Po Chih Wu

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Ying Chien Hsu

  • Department of Electrical and Control Engineering
  • National Yang Ming Chiao Tung University

External person

Ming Hsuan Lee

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Hua Kun Tang

  • Advanced Technology Center
  • BenQ Corporation
  • Advanced Technology Center

External person

Yun Tse Chen

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

In Yao Lee

  • Advanced Technology Center
  • BenQ Corporation
  • Advanced Technology Center

External person

Hung Yi Lin

  • Touch Micro-system Technology Corporation
  • Industrial Technology Research Institute of Taiwan
  • Mechanical and Mechatronics Systems Research Labs (MMSL)

External person

Qibiao Chen

  • Department of Electrical and Computer Engineering
  • Carnegie Mellon University

External person

Tom D. Milster

  • Optical Data Storage Center
  • University of Arizona
  • Department O Electronics Engineering
  • National Yang Ming Chiao Tung University

External person

Chun Shin Lu

  • National Chung Hsing University
  • Department of Mechanical Engineering

External person

Sheng Shian Li

  • Institute of NanoEngineering and MicroSystems
  • Department of Power Mechanical Engineering
  • National Tsing Hua University
  • Institute of Nanoengineering and Microsystems

External person

Tsung Chih Huang

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Chin Chieh Chao

  • Raydium Semiconductor Corporation

External person

H. H. Lin

  • Department of Applied Chemistry
  • National Yang Ming Chiao Tung University
  • Industrial Technology Research Institute of Taiwan
  • National Cheng Kung University
  • Institute of Biomedical Engineering
  • MIRL
  • Academia Sinica - Research Center for Applied Science
  • Department of Photonics
  • Institute of Biomedical Engineering

External person

Wei-Chen Hu

  • Natl Chiao Tung Univ, National Chiao Tung University, Dept Mat Sci & Engn

External person

Chang Shiou Wu

  • Department of Electrical and Control Engineering
  • National Yang Ming Chiao Tung University

External person

Jie Zou

  • Department of Electrical and Computer Engineering
  • Carnegie Mellon University

External person

Sushil Kumar

  • Indian Institute of Technology Delhi

External person

Parvaneh Sardarabadi

  • National Tsing Hua University

External person

Chien Yang Chen

  • MIRL
  • Industrial Technology Research Institute of Taiwan

External person

Cheng Yen Lin

  • National Yang Ming Chiao Tung University

External person

Ming Da Wu

  • Department O Electronics Engineering
  • National Yang Ming Chiao Tung University
  • Department of Electrical Engineering

External person

Christopher Y.H. Chao

  • Dept. of Mechanical and Aerospace Engineering
  • Hong Kong University of Science and Technology
  • Department of Electrical Engineering
  • National Yang Ming Chiao Tung University

External person

Kuo Yung Hung

  • Ming Chi University of Technology
  • Institute of Mechanical and Electrical Engineering

External person

Samaresh Das

  • Indian Institute of Technology Delhi

External person

Chi Ming Chang

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Fan Yi Lin

  • Department of Electrical Engineering
  • National Tsing Hua University
  • Department of Electrical Engineering

External person

Yu Shan Chu

  • Department of Electrical and Control Engineering
  • National Yang Ming Chiao Tung University

External person

Wasi Uddin

  • Indian Institute of Technology Delhi

External person

J. S. Chen

  • Department of Mechanical Engineering
  • National Chung Hsing University
  • National Chung Cheng University
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering

External person

Ko Yang Tso

  • Raydium Semiconductor Corporation

External person

Wei Yao Hsu

  • National Applied Research Laboratories Taiwan
  • Department of Mechanical Engineering
  • National Yang Ming Chiao Tung University
  • Instrument Technology Research Center

External person

Zhi Wei Zhuang

  • Department of Electrical and Control Engineering
  • National Yang Ming Chiao Tung University

External person

Chien Hung Kuo

  • Raydium Semiconductor Corporation

External person

Hsuan Wu Liu

  • Taiwan Semiconductor Manufacturing Company

External person

Liang Wei Chang

  • Department of Engineering and System Science
  • National Tsing Hua University

External person

Po Wei Liao

  • National Yang Ming Chiao Tung University

External person

Li Kang Cheng

  • National Chung Hsing University
  • Department of Mechanical Engineering

External person

F. G. Tseng

  • Department of Engineering and System Science
  • National Tsing Hua University
  • Department of Engineering
  • Division of Mechanics
  • Academia Sinica - Research Center for Applied Science

External person

Chun Wen Tsao

  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University
  • Natl Chiao Tung Univ, National Chiao Tung University, Dept Mat Sci & Engn

External person

Chung Wei Wu

  • Department of Electrical and Control Engineering
  • National Yang Ming Chiao Tung University

External person

Adrian J. Devasahayam

  • Department of Electrical and Computer Engineering
  • Carnegie Mellon University

External person

Yi Chun Chen

  • Institute of Electrical Control Engineering
  • National Yang Ming Chiao Tung University
  • Tokyo Inst Technol, Tokyo Institute of Technology, Inst Innovat Res, Midori Ku

External person

Hung Lung Hsu

  • Department of Mechanical Engineering
  • National Yang Ming Chiao Tung University

External person

Anping Zhang

  • Xi'an Jiaotong University

External person

Michael A. Seigler

  • Department of Electrical and Computer Engineering
  • Carnegie Mellon University

External person

U. Rambabu

  • Centre for Materials for Electronics Technology
  • Department O Electronics Engineering
  • National Yang Ming Chiao Tung University

External person

Wai William Wang

  • Raydium Semiconductor Corporation

External person

Wang Ling Tsai

  • National Yang Ming Chiao Tung University
  • Department of Photonics

External person

S. K. Fan

  • Mechanical Engineering
  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University
  • Department of Mechanical Engineering
  • National Taiwan University
  • Department of Mechanical Engineering
  • Institute of Nanotechnology
  • Institute of Applied Chemistry
  • Department of Applied Chemistry
  • IEEE
  • Department of Materials Science and Engineering
  • National Taiwan University of Science and Technology
  • Department of Materials Science and Engineering
  • Center of Biotechnology

External person

Ching Hung Chen

  • WinMEMS Technologies Co.

External person

Wen Ching Lai

  • WinMEMS Technologies Co.

External person

Chia Chi Chien

  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University

External person

C. W.Arex Wang

  • Advanced Technology Center
  • AU Optronics Taiwan

External person

Yen Chieh Lee

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

An Yi Chen

  • National Yang Ming Chiao Tung University
  • Natl Chiao Tung Univ, National Chiao Tung University, Dept Appl Chem
  • Natl Chiao Tung Univ, National Chiao Tung University, Dept Mat Sci & Engn

External person

Keh La Lin

  • Raydium Semiconductor Corporation

External person

Bo Ting Chen

  • IEEE
  • Department of Electrical Engineering
  • National Yang Ming Chiao Tung University
  • Department O Electronics Engineering
  • Dept. of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Institute of Electronics
  • Department of Electronics Eng.
  • Department of Computer Science

External person

T. E. Schelsinger

  • Carnegie Mellon University

External person

Masato Sone

  • Precision and Intelligence Laboratory
  • Tokyo Institute of Technology
  • Japan Science and Technology Agency
  • Precision and Intelligence Laboratory
  • Institute of Innovative Research
  • Tokyo Inst Technol, Tokyo Institute of Technology, Inst Innovat Res, Midori Ku
  • Sumitomo Chemical Next-Generation Eco-Friendly Devices Collaborative Research Cluster
  • Institute of Science Tokyo

External person

Wei De Wang

  • National Yang Ming Chiao Tung University

External person

Chiung Ting Kuo

  • Department of Electrical and Control Engineering
  • National Yang Ming Chiao Tung University

External person

Sheng Yi Hsiao

  • Department of Mechanical Engineering
  • National Yang Ming Chiao Tung University

External person

Zhuonan Miao

  • Dept. of Mechanical and Aerospace Engineering
  • Hong Kong University of Science and Technology

External person

Ping Yen Hsieh

  • Department of Materials Science and Engineering
  • National Yang Ming Chiao Tung University
  • Department of Materials Science and Engineering
  • National Tsing Hua University
  • Natl Chiao Tung Univ, National Chiao Tung University, Dept Mat Sci & Engn

External person

Long Yi Lin

  • National Yang Ming Chiao Tung University
  • Institute of Electrical and Computer Engineering

External person

Cheng Hsien Liu

  • National Tsing Hua University
  • Department of Power Mechanical Engineering
  • Dept. of Power Mechanical Eng.
  • Microsystems and Control Laboratory
  • Mechanical Engineering Department
  • National Yang Ming Chiao Tung University
  • Institute of Nanoengineering and Microsystems

External person

Kun Xu

  • Hong Kong University of Science and Technology

External person

Yung Chih Chen

  • National Chung Hsing University
  • Graduate Institute of Precision Engineering

External person

Sinter Tsai

  • Topray Technology Corporation

External person

Fred S.C. Wang

  • Raydium Semiconductor Corporation

External person

Yeh En Chien

  • Department O Electronics Engineering
  • National Yang Ming Chiao Tung University

External person

Ming Hong Hsu

  • Department O Electronics Engineering
  • National Yang Ming Chiao Tung University

External person

Ming Huang Li

  • Institute of Nanoengineering and Microsystems
  • National Tsing Hua University

External person

Fu Jen Ko

  • AU Optronics Taiwan
  • Department O Electronics Engineering
  • National Yang Ming Chiao Tung University
  • Wintek Corporation

External person

Chih Chun Lee

  • Department of Mechanical Engineering
  • National Yang Ming Chiao Tung University

External person

Yi Wen Lu

  • Department of Electrical Engineering
  • National Yang Ming Chiao Tung University
  • Department of Electronics Engineering and Institute of Electronics
  • Dept. of Electronics Engineering
  • Department of Materials Science and Engineering

External person

Tso Fu Mark Chang

  • Precision and Intelligence Laboratory
  • Tokyo Institute of Technology
  • Japan Science and Technology Agency
  • Precision and Intelligence Laboratory
  • Institute of Innovative Research
  • Tokyo Inst Technol, Tokyo Institute of Technology, Inst Innovat Res, Midori Ku
  • Sumitomo Chemical Next-Generation Eco-Friendly Devices Collaborative Research Cluster
  • Institute of Science Tokyo

External person

Alan Yu

  • Raydium Semiconductor Corporation

External person

Wei Xu

  • Shenzhen University

External person

Venkatraman Gopalan

  • Department of Materials Science and Engineering
  • Pennsylvania State University
  • Department of Materials Science and Engineering
  • Cornell University
  • Center for Material Science
  • Department of Electrical and Computer Engineering
  • Los Alamos National Laboratory
  • Carnegie Mellon University

External person

C. H. Pan

  • Department of Electrical and Control Engineering
  • National Yang Ming Chiao Tung University

External person

Y. T. Sun

  • Department of Mechanical Engineering
  • National Yang Ming Chiao Tung University

External person

Yu Hsin Lin

  • National Applied Research Laboratories Taiwan
  • Department of Mechanical Engineering
  • National Yang Ming Chiao Tung University
  • OLED Division
  • AU Optronics Taiwan
  • Inst. of Electro-Optical Engineering
  • Department of Mechanical Engineering
  • Department of Photonics
  • Instrument Technology Research Center
  • IEEE
  • Institute of Physics
  • New Display Process Research Division
  • National Science Council Taiwan
  • Prec. Instrument Development Center
  • National Cheng Kung University
  • Department of Mechanical Engineering
  • Department of Photonics

External person

Sushil Kumar

  • Indian Institute of Technology Delhi

External person

Jiun Hung Pan

  • Department of Electrical and Control Engineering
  • National Yang Ming Chiao Tung University

External person

C. Y. Lee

  • Raydium Semiconductor Corporation

External person

Sumit Sharma

  • Indian Institute of Technology Delhi

External person

Cheng An Chen

  • Department of Electrical Engineering
  • National Yang Ming Chiao Tung University

External person

Hsuan Ping Lee

  • Department of Mechanical Engineering
  • National Taiwan University

External person

Yung Wei Lin

  • Department of Electronics Engineering and Institute of Electronics
  • National Yang Ming Chiao Tung University
  • Department of Electrical and Control Engineering
  • Biomedical Engineering Research and Development Center
  • China Medical University Taichung
  • Faraday Technology Corporation
  • Department of Electrical Engineering
  • Department O Electronics Engineering
  • School of Medicine

External person

Sue Yuan Fan

  • National Yang Ming Chiao Tung University

External person

M. J. Kawas

  • Department of Electrical and Computer Engineering
  • Carnegie Mellon University

External person

Smart Yang

  • Topray Technology Corporation

External person

K. C. Hou

  • 5th Building
  • National Yang Ming Chiao Tung University
  • Department of Electrical and Control Engineering
  • Department of Electrical Engineering
  • Institute of Electrical Control Engineering
  • Institution of Electrical and Control Engineering
  • Department of Electrical Engineering

External person

Chih Hsiang Lai

  • WinMEMS Technologies Co.

External person

Meng Chyi Wu

  • Department of Electrical Engineering
  • National Tsing Hua University
  • Department of Electrical Engineering
  • Opto-Electronics & Systems Laboratory, ITRI
  • Institute of Electronic Engineering
  • Department of Power Mechanical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electronics

External person

Jinn Chou Yoo

  • Industrial Technology Research Institute of Taiwan
  • Opto-electronics and Systems Laboratories

External person

Yu Ru Chang

  • Department of Mechanical Engineering
  • National Yang Ming Chiao Tung University

External person

Chun Hao Chang

  • WinMEMS Technologies Co.

External person

Chang Hong Liou

  • Institute of Electrical Control Engineering
  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

M. L. Reed

  • Electrical and Computer Engineering Faculty
  • Carnegie Mellon University

External person

Po Chien Chou

  • Department of Mechanical Engineering
  • National Yang Ming Chiao Tung University
  • Department of Mechanical Engineering
  • Mechanical Engineering
  • Mechanical Engineering Department
  • Department of Mechanical Engineering
  • Department of Communication Engineering
  • Academia Sinica - Institute of Astronomy and Astrophysics

External person

Yan Ting Wu

  • National Yang Ming Chiao Tung University

External person

Chun Po Chang

  • WinMEMS Technologies Co.

External person