Projects per year
Personal profile
Research Interests
Wafer bonding
Patterned sapphire wafer
III-V epitaxial technology
Optoelectronic semiconductor components
Education/Academic qualification
PhD, Materials Science and Engineering, Stanford University
External positions
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Dive into the research topics where Yew-Chung Sermon Wu is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Projects
- 19 Finished
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製作氮化鎵／鑽石單晶基板好用在高頻與高功率氮化鎵元件
Wu, Y.-C. S. (PI)
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
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Improving The Brightness of GaN LED And UVC AlN LED By AlN Buffer And Modified Patterned Sapphire Substrates
Wu, Y.-C. S. (PI)
1/08/19 → 28/02/21
Project: Government Ministry › Other Government Ministry Institute
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Fabrication of High Brightness LED Through Laser Lift-off GaN Epilayer Grown on Patterned Sapphire Substrate
Wu, Y.-C. S. (PI)
1/08/18 → 31/12/19
Project: Government Ministry › Other Government Ministry Institute
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Diamond Compoite Substrate for Device Thermoangement
Wu, Y.-C. S. (PI)
1/08/17 → 31/10/18
Project: Government Ministry › Other Government Ministry Institute
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Fabrication of High Brightness LED Through Laser Lift-off GaN Epilayer Grown on Patterned Sapphire Substrate
Wu, Y.-C. S. (PI)
1/08/17 → 31/12/18
Project: Government Ministry › Other Government Ministry Institute
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Broadband Photo/Gas Dual Sensors Enabled by ZnO Nanorod/Graphene Hybrid Structures
Chen, C. S., Li, M. H., Lin, S. H., Chiu, Y. S., Chen, H., Wang, D. Y., Tai, H. H., Lai, C. S., Wu, Y. S. & Han, J., 15 Mar 2024, In: IEEE Sensors Journal. 24, 6, p. 7482-7489 8 p.Research output: Contribution to journal › Article › peer-review
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Effect of Compressive Stress on Copper Bonding Quality and Bonding Mechanisms in Advanced Packaging
Lu, T. F., Lee, P. Y. & Wu, Y. C. S., May 2024, In: Materials. 17, 10, 2236.Research output: Contribution to journal › Article › peer-review
Open Access1 Scopus citations -
Effect of Cu Film Thickness on Cu Bonding Quality and Bonding Mechanism
Lu, T. F., Hsu, K. N., Hsu, C. C., Hsu, C. Y. & Wu, Y. C. S., May 2024, In: Materials. 17, 9, 2150.Research output: Contribution to journal › Article › peer-review
Open Access2 Scopus citations -
Eliminating Cu–Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper
Lu, T. F., Cheng, Y. F., Wang, P. W., Yen, Y. T. & Wu, Y. C. S., Jul 2024, In: Materials. 17, 14, 3467.Research output: Contribution to journal › Article › peer-review
Open Access1 Scopus citations -
Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces
Lu, T. F., Yen, Y. T., Wang, P. W., Cheng, Y. F., Chen, C. H. & Wu, Y. C. S., May 2024, In: Nanomaterials. 14, 10, 861.Research output: Contribution to journal › Article › peer-review
Open Access3 Scopus citations