Calculated based on number of publications stored in Pure and citations from Scopus
Calculated based on number of publications stored in Pure and citations from Scopus
Calculated based on number of publications stored in Pure and citations from Scopus
1997 …2025

Research activity per year

Network

Qun Jane Gu

  • University of Florida
  • University of California at Los Angeles
  • University of California at Davis
  • Department of Electrical and Computer Engineering
  • SST Communications Co.
  • Electrical Engineering Department
  • Dept. of Electrical Engineering
  • Electrical Engineering Department
  • Electrical Engineering Department
  • Department of Electrical Engineering
  • EE Department
  • Department of Electrical and Computer Engineering
  • Univ Calif Davis, University of California System, University of California Davis

External person

Ching Wen Chiang

  • National Yang Ming Chiao Tung University
  • University of California at Los Angeles
  • Industrial Technology Research Institute of Taiwan
  • International College of Semiconductor Technology

External person

Zhiwei Xu

  • Zhejiang University
  • Key Laboratory of Ocean Observation-Imaging Testbed of Zhejiang Province
  • Ministry of Education, China
  • HRL Laboratories
  • University of California at Los Angeles
  • HRL
  • Engineering Research Center of Oceanic Sensing Technology and Equipment Ministry of Education

External person

Huiyan Gao

  • Zhejiang University
  • Zhejiang Univ, Zhejiang University, Dept Physiol, Sch Med
  • Key Laboratory of Ocean Observation-Imaging Testbed of Zhejiang Province
  • Ministry of Education, China
  • Engineering Research Center of Oceanic Sensing Technology and Equipment Ministry of Education

External person

Chunyi Song

  • Zhejiang University
  • Key Laboratory of Ocean Observation-Imaging Testbed of Zhejiang Province
  • Ministry of Education, China
  • Donghai Laboratory
  • Donghai Laboratory

External person

Nayu Li

  • Zhejiang University
  • Zhejiang Univ, Zhejiang University, Dept Physiol, Sch Med
  • Donghai Laboratory
  • Key Laboratory of Ocean Observation-Imaging Testbed of Zhejiang Province
  • Ministry of Education, China
  • Donghai Laboratory
  • Donghai Laboratory

External person

Shiuh Hua Wood Chiang

  • Brigham Young University

External person

Shaogang Wang

  • Zhejiang University
  • Zhejiang Univ, Zhejiang University, Dept Physiol, Sch Med
  • Key Laboratory of Ocean Observation-Imaging Testbed of Zhejiang Province
  • Ministry of Education, China
  • Engineering Research Center of Oceanic Sensing Technology and Equipment Ministry of Education

External person

Chia Jen Liang

  • National Yang Ming Chiao Tung University
  • University of California at Los Angeles

External person

Xiaopeng Yu

  • Zhejiang University

External person

Rulin Huang

  • University of California at Los Angeles
  • Electrical Engineering Department
  • Naval Research Laboratory
  • National Yang Ming Chiao Tung University

External person

Hsiao Chun Wu

  • Louisiana State University
  • Yuan Ze University
  • LSU College of Engineering

External person

Yen Hsiang Wang

  • University of California at Los Angeles
  • Electrical Engineering Department
  • Electrical Engineering Department
  • Electrical Engineering Department

External person

Chung Tse Michael Wu

  • Rutgers - The State University of New Jersey, New Brunswick
  • Rutgers University
  • National Taiwan University
  • Rutgers University

External person

Min Li

  • Zhejiang University
  • Zhejiang Univ, Zhejiang University, Dept Physiol, Sch Med

External person

Yilei Li

  • NovuMind Inc.
  • University of California at Los Angeles
  • UCLA
  • Electrical Engineering Department
  • Department of Electrical and Computer Engineering
  • EE Department
  • Kneron Inc.
  • Taiwan Semiconductor Research Institute
  • NovuMind Inc.

External person

Elaine Y.N. Sun

  • National Tsing Hua University
  • Huawei Technologies Co., Ltd.

External person

Yuan Du

  • University of California at Los Angeles
  • UCLA
  • Electrical Engineering Department
  • Kneron Inc.
  • University of California at San Diego
  • Department of Electrical and Computer Engineering

External person

Zijiang Zhang

  • Zhejiang University
  • Zhejiang Univ, Zhejiang University, Dept Physiol, Sch Med

External person

Shunli Ma

  • Fudan University
  • Fudan Univ, Fudan University, Dept Phys

External person

Frank Hsiao

  • University of California at Los Angeles
  • Electrical Engineering Department
  • Electrical Engineering Department
  • Electrical Engineering Department

External person

Jia Zhou

  • University of California at Los Angeles
  • UCLA

External person

G. Virbila

  • University of California at Los Angeles
  • Electrical Engineering Department
  • UCLA
  • Electrical Engineering Department
  • HRL Laboratories

External person

Neda Khiabani

  • Rutgers - The State University of New Jersey, New Brunswick
  • Rutgers University
  • Nokia

External person

I. Ning Ku

  • University of California at Los Angeles
  • Electrical Engineering Department
  • Electrical Engineering Department

External person

Hai Yu

  • University of California at Davis
  • Univ Calif Davis, University of California System, University of California Davis

External person

Yan Zhang

  • University of California at Los Angeles
  • Electrical Engineering Department
  • EE Department

External person

Zhiwei Xu

  • SST Communications Co.
  • HRL Laboratories
  • University of California at Los Angeles
  • Department of Electrical Engineering
  • HRL Labortories
  • Electrical Engineering Department
  • Electrical Engineering Department
  • Electrical Engineering Department
  • G-Plus Inc.
  • EE Department
  • Zhejiang University
  • Electronics Department
  • Electrical Engineering Department

External person

Chien Heng Wong

  • University of California at Los Angeles
  • UCLA
  • Department of Electrical and Computer Engineering
  • Electrical Engineering Department

External person

Yixin Song

  • Brigham Young University
  • Texas Instruments

External person

Dong Wei

  • Fudan University
  • University of California at Davis
  • Fudan Univ, Fudan University, Dept Phys

External person

Zhiwei Xu

  • Zhejiang University
  • Electronics Department
  • Zhejiang Univ, Zhejiang University, Dept Physiol, Sch Med

External person

Adrian Tang

  • University of California at Los Angeles
  • Jet Propulsion Laboratory, California Institute of Technology
  • Instruments Division
  • Electrical Engineering Department
  • UCLA
  • Electrical Engineering Department
  • University of California at Davis
  • Electrical Engineering Department
  • Electrical Engineering Department
  • EE Department
  • Submillimeter Wave Advanced Technology
  • National Yang Ming Chiao Tung University

External person

Nai Chen Liu

  • National Applied Research Laboratories Taiwan
  • National Yang Ming Chiao Tung University
  • MediaTek

External person

Shea Smith

  • Brigham Young University
  • Swiss Federal Institute of Technology Lausanne

External person

Xuan Ding

  • University of California at Davis
  • Univ Calif Davis, University of California System, University of California Davis

External person

Taylor Barton

  • Brigham Young University

External person

Kailong Zhao

  • Zhejiang University

External person

Qianyi Dong

  • Zhejiang University

External person

Shengjie Wang

  • Zhejiang University

External person

Wentai Liu

  • University of California at Los Angeles
  • Department of Bioengineering

External person

Hunter Jensen

  • Brigham Young University

External person

Mau Chung Frank Chang

  • National Yang Ming Chiao Tung University
  • University of California at Los Angeles

External person

Yi Kai Lo

  • Institute of Electronics
  • National Yang Ming Chiao Tung University
  • Mstar Semiconductor Inc.
  • University of California at Los Angeles
  • Department of Bioengineering
  • Department of Electrical Engineering

External person

Jieqiong Du

  • University of California at Los Angeles
  • UCLA
  • Electrical Engineering Department

External person

Li Du

  • University of California at Los Angeles

External person

Jiangbo Chen

  • Zhejiang University

External person

Zijiang Zhang

  • Zhejiang University
  • Key Laboratory of Ocean Observation-Imaging Testbed of Zhejiang Province
  • Ministry of Education, China

External person

Zuow Zun Chen

  • University of California at Los Angeles
  • UCLA
  • Electrical Engineering Department

External person

Boyu Hu

  • University of California at Los Angeles
  • UCLA
  • Electrical Engineering Department

External person

Liang Qiu

  • Zhejiang University

External person

Eric Swindlehurst

  • Brigham Young University

External person

Hang Lu

  • Zhejiang University
  • Engineering Research Center of Oceanic Sensing Technology and Equipment Ministry of Education

External person

Yanghyo Kim

  • Electrical Engineering Department
  • University of California at Los Angeles
  • Electrical Engineering Department
  • Jet Propulsion Laboratory, California Institute of Technology
  • Electrical Engineering Department
  • Department of Electrical Engineering
  • UCLA
  • Electrical Engineering Department
  • Submillimeter Wave Advanced Technology
  • Naval Research Laboratory
  • Department of Electrical and Computer Engineering
  • Stevens Institute of Technology

External person

Alexander Petrie

  • Brigham Young University

External person

A. R. Harish

  • Indian Institute of Technology Kanpur

External person

Ming Hsien Tsai

  • Taiwan Semiconductor Manufacturing Company

External person

Wei Shu

  • Zero-Error Systems

External person

Junyan Ren

  • Fudan University
  • Fudan Univ, Fudan University, Dept Phys

External person

Gaopeng Chen

  • Zhejiang University

External person

Ning Yi Wang

  • University of California at Los Angeles
  • Electrical Engineering Department
  • Electrical Engineering Department
  • Broadcom Corporation
  • Electrical Engineering Department

External person

Hung Chih Liu

  • Department O Electronics Engineering
  • National Yang Ming Chiao Tung University
  • Chip Advanced Tech.
  • IEEE
  • Silicon Intgd. Systems Corporation
  • Dept. of Electronics Engineering
  • Natl Tsing Hua Univ, National Tsing Hua University, High Entropy Mat Ctr
  • Institute of Electronics

External person

Jonathan Wu

  • Baton Rouge Magnet High School

External person

C. W. Chang

  • Department of Electrical and Control Engineering
  • National Yang Ming Chiao Tung University
  • Institute of Electrical Control Engineering
  • Department of Electrical Engineering
  • 5th Building
  • University of California at Los Angeles
  • Department of Bioengineering
  • Department of Electrical Engineering
  • Department of Industrial Engineering and Management
  • Department of Industrial Engineering and Management
  • Institute of Electrical and Computer Engineering
  • Department of Computer Science
  • Department of Civil Engineering
  • Institution of Electrical and Control Engineering
  • National Taiwan University
  • SBIP
  • Taiwan Semiconductor Manufacturing Company

External person

Armin Tajalli

  • University of Utah

External person

Victor R. Edgerton

  • Department of Physiological Science
  • University of California at Los Angeles

External person

Brian Kim

  • University of California at Los Angeles

External person

Parag Gad

  • University of California at Los Angeles

External person

Hsin Ting Chang

  • Dept. of Electronics Engineering
  • National Yang Ming Chiao Tung University

External person

Debapratim Dhara

  • Indian Institute of Technology Kanpur
  • National Yang Ming Chiao Tung University

External person

Kang Lun Chiu

  • Dept. of Electronics Engineering
  • National Yang Ming Chiao Tung University

External person

Payel Mondal

  • Indian Institute of Technology Kanpur

External person

Shabirahmed Badashasab Jigalur

  • National Yang Ming Chiao Tung University

External person

Costas Busch

  • Louisiana State University
  • LSU College of Engineering

External person

Yong Qu

  • Nanyang Technological University
  • Texas Instruments

External person

X. Shawn Wang

  • University of California at Los Angeles
  • UCLA
  • Electrical Engineering Department

External person

K. F. Chen

  • Macronix International Co., Ltd. Taiwan
  • No.16
  • University of California at Los Angeles
  • Chang Gung University
  • Chang Gung Memorial Hospital

External person

Chewnpu Jou

  • Taiwan Semiconductor Manufacturing Company
  • TSMC

External person

Yiyan Wu

  • Communications Research Centre Canada

External person

Hsun Wei Chan

  • Department of Electronics Engineering and Institute of Electronics
  • National Yang Ming Chiao Tung University
  • Dept. of Electronics Engineering

External person

N. Chahat

  • Jet Propulsion Laboratory, California Institute of Technology

External person

Scott C.H. Huang

  • National Tsing Hua University

External person

David Del Rio

  • IK4 Research Alliance
  • University of California at Los Angeles
  • University of Navarra
  • National Yang Ming Chiao Tung University
  • CEIT
  • Ceit - Basque Research and Technology Alliance (BRTA)

External person

Imran Mehdi

  • Jet Propulsion Laboratory, California Institute of Technology
  • University of California at Los Angeles

External person

Yi Cheng Wu

  • University of California at Los Angeles
  • Electrical Engineering Department
  • Northrop Grumman
  • SST Communications Co.
  • Electrical Engineering Department
  • Electrical Engineering Department
  • Electrical Engineering Department
  • Space Systems Division, Aerospace Systems
  • Northtrop Grumman Co
  • EE Department
  • Department of Electrical Engineering

External person

Choonsup Lee

  • Jet Propulsion Laboratory, California Institute of Technology

External person

Stanislav Culaclii

  • University of California at Los Angeles

External person

Donglin Gao

  • Rutgers - The State University of New Jersey, New Brunswick
  • Rutgers University

External person

Henry Lopez

  • Dept. of Electronics Engineering
  • National Yang Ming Chiao Tung University
  • EECS International Graduate Programs

External person

Chi Hang Chan

  • State-Key Laboratory of Analog and Mixed Signal VLSI
  • University of Macau
  • Department of Electrical and Computer Engineering

External person

Junyan Ren

  • Fudan University

External person

Yan Zhao

  • University of California at Los Angeles
  • Electrical Engineering Department
  • UCLA

External person

Chun Chen Liu

  • University of California at Los Angeles
  • Electrical Engineering Department
  • Kneron Inc.
  • UCLA
  • EE Department

External person

Li Du

  • University of California at Los Angeles
  • Electrical Engineering Department
  • Kneron Inc.
  • UCLA
  • EE Department

External person

Jiabing Liu

  • Zhejiang University

External person

G. Chattopadhyay

  • Jet Propulsion Laboratory, California Institute of Technology
  • Department of Atmospheric and Oceanic Sciences
  • University of California at Los Angeles

External person

Chun Yi Liu

  • Dept. of Electronics Engineering
  • National Yang Ming Chiao Tung University
  • Department of Electrical Engineering
  • Department of Electronics Engineering and Institute of Electronics

External person

Xinhong Xie

  • Zhejiang University
  • Engineering Research Center of Oceanic Sensing Technology and Equipment Ministry of Education

External person

Wei Che Lee

  • Department of Electronics Engineering and Institute of Electronics
  • National Yang Ming Chiao Tung University
  • Dept. of Electronics Engineering

External person

Po Min Wang

  • University of California at Los Angeles

External person

Hao Wu

  • Electrical Engineering Department
  • University of California at Los Angeles

External person

S. J. Lee

  • University of California at Los Angeles
  • Electrical Engineering Department
  • UCLA

External person

Yue Li

  • Nanyang Technological University

External person

Quanyong Li

  • Zhejiang University

External person

Joseph S. Chang

  • Nanyang Technological University

External person

Huei Jiun Ju

  • University of California at Los Angeles
  • Department of Electrical Engineering

External person

Chi Yung

  • National Tsing Hua University

External person

Jonathan A. Massachi

  • University of California at Los Angeles

External person

Mandy Tang

  • University of California at Los Angeles

External person

Fu Kuo Hsueh

  • National Nano Device Laboratories Taiwan
  • National Applied Research Laboratories Taiwan
  • Department of Electrophysics
  • National Yang Ming Chiao Tung University
  • Taiwan Semiconductor Manufacturing Company
  • Department of Electrophysics
  • Hsinchu
  • National Nano Device Laboratories (NDL
  • Department of Electrophysics
  • Department of Electrical Engineering
  • Department of Electrophysics
  • Scientific
  • Taiwan Semiconductor Research Institute
  • Taiwan Semicond Res Inst
  • Taiwan Semiconductor Research Institute

External person

Nancy Fulda

  • Brigham Young University

External person

Ngoc Giang Doan

  • National Yang Ming Chiao Tung University

External person

Chang Ting Wu

  • Dept. of Electronics Engineering
  • National Yang Ming Chiao Tung University
  • Department of Electronics Engineering and Institute of Electronics

External person

Hao Wu

  • University of California at Los Angeles
  • Electrical Engineering Department
  • Electrical Engineering Department
  • Broadcom Corporation
  • Electrical Engineering Department

External person

Jaewook Shin

  • University of California at Los Angeles

External person

Fan Ta Chen

  • Department of Electrical Engineering
  • National Tsing Hua University
  • Department of Electrical Engineering
  • National Yang Ming Chiao Tung University
  • Natl Chiao Tung Univ, National Yang Ming Chiao Tung University, Inst Elect, Dept Elect Engn

External person

Seyed Arash Mirhaj

  • University of California at Los Angeles

External person

Te Son Kuo

  • National Taiwan University
  • Veterans General Hospital-Taipei

External person

Mike Pham

  • University of California at Los Angeles
  • Electrical Engineering Department

External person

Huang Scott

  • Department of Electrical Engineering
  • National Tsing Hua University

External person

Yiwei Liu

  • Zhejiang University

External person

Meng Yuan Huang

  • Dept. of Electrical Engineering
  • National Central University

External person

Chih Lung Lin

  • National Taiwan University

External person

Min Li

  • Zhejiang University

External person

Scott C.H. Huang

  • National Tsing Hua University

External person

Yuexiaozhou Yuan

  • Zhejiang University

External person

Zhonglan Qian

  • Zhejiang University

External person

Scott C.H. Huang

  • National Tsing Hua University

External person

Jingying Zhou

  • Zhejiang University

External person

Chao Jen Tien

  • National Yang Ming Chiao Tung University

External person

Chih Hao Huang

  • Department of Computer Science
  • City University of Hong Kong
  • National Tsing Hua University

External person

Chunyi Song

  • Zhejiang University

External person

Yu Chi Shih

  • National Yang Ming Chiao Tung University

External person

Pei Yun Tsai

  • Dept. of Electrical Engineering
  • National Central University

External person

Derek Yang

  • University of California at Los Angeles
  • Electrical Engineering Department

External person

Nien Hsiang Chang

  • TSRI National Applied Research Laboratories

External person

Xiaopeng Yu

  • Zhejiang University
  • Zhejiang Univ, Zhejiang University, Dept Physiol, Sch Med

External person

Chang Ling Tsai

  • National Yang Ming Chiao Tung University

External person

Minji Zhu

  • University of California at Los Angeles

External person

Tsai Hua Lee

  • Dept. of Electronics Engineering
  • National Yang Ming Chiao Tung University

External person

Jenny Yi Chun Liu

  • University of California at Los Angeles
  • Electrical Engineering Department
  • Electrical Engineering Department
  • Department of Electrical Engineering
  • National Tsing Hua University
  • Department of Electrical Engineering
  • Electrical Engineering Department
  • Department of Electrical Engineering
  • Electrical Engineering Department
  • High Speed Electronics Lab

External person

Wei Ting Wu

  • National Yang Ming Chiao Tung University

External person

C. Chien

  • SST Communications Co.
  • University of California at Los Angeles
  • G-Plus Inc.
  • CreoNex Systems
  • CreoNex Systems Inc.
  • Department of Electrical Engineering

External person

Kyle Rogers

  • Brigham Young University

External person

Zhiwei Xu

  • Zhejiang University

External person

P. Y. Chen

  • Department of Mechanical Engineering
  • National Nano Device Laboratories Taiwan
  • National Yang Ming Chiao Tung University
  • Department of Mechanical Engineering
  • National Nano Devices Laboratories
  • University of Illinois at Chicago

External person

T. Reck

  • Jet Propulsion Laboratory, California Institute of Technology
  • University of California at Los Angeles
  • Submillimeter Wave Advanced Technology
  • Virginia Diodes

External person

Yong Qu

  • Texas Instruments

External person

Maw Huei Lee

  • National Taiwan University

External person

Xiaokang Qi

  • Zhejiang University

External person

Zhiwei Xu

  • Zhejiang University

External person

Huan Neng Chen

  • Taiwan Semiconductor Manufacturing Company
  • University of California at Los Angeles

External person

Michael Crouse

  • Harvard University

External person

Roc Berenguer

  • University of Navarra
  • IK4 Research Alliance
  • Electronic Engineering Department
  • Communications Integrated Circuit Design Group (COMMIC)
  • CEIT

External person

Zixian Zheng

  • Nanyang Technological University

External person

Botao Yang

  • Zhejiang University

External person

Lei Qiu

  • Tongji University

External person

H. T. Kung

  • Division of Engineering and Applied Sciences
  • Harvard University
  • Division of Engineering and Applied Sciences
  • School of Engineering and Applied Sciences

External person

Shih Yu Chang

  • San Jose State University

External person

Shuoyang Yuan

  • Zhejiang University

External person

Izhak Rubin

  • University of California at Los Angeles
  • Department of Electrical Engineering

External person

Jordan T. Yorgason

  • Brigham Young University

External person

Yu Hsiu Wu

  • University of California at Los Angeles
  • Electrical Engineering Department

External person

Han Chang Wu

  • National Taiwan University
  • Veterans General Hospital-Taipei

External person

Yan Zhao

  • University of California at Los Angeles

External person

Chung Tse Michael Wu

  • Rutgers - The State University of New Jersey, New Brunswick

External person

Long Kong

  • University of California at Los Angeles

External person

Yu Hsiu Wu

  • University of California at Los Angeles

External person

Karl F. Warnick

  • Brigham Young University

External person

Junjie Su

  • Kneron Inc.

External person

Zhihao Lv

  • Zhejiang University

External person

Joseph S. Chang

  • Nanyang Technological University

External person

Parker Allred

  • Brigham Young University

External person

Hang Lu

  • Zhejiang University

External person

Mau Chung Frank Chang

  • University of California at Los Angeles

External person

Sandeep D'Souza

  • University of California at Los Angeles
  • Semtech Corporation

External person

Zheng Chun Huang

  • National Yang Ming Chiao Tung University
  • Institute of Electronics

External person

Na Yan

  • University of California at Los Angeles

External person

Chia Jen Liang

  • National Yang Ming Chiao Tung University

External person

David Murphy

  • University of California at Los Angeles
  • Broadcom Corporation

External person

Xuanyu He

  • Zhejiang University

External person

Shih Yu Chang

  • San Jose State University

External person

Shaogang Wang

  • Zhejiang University

External person

Marcus Comiter

  • Harvard University

External person

Pei Yun Tsai

  • National Yang Ming Chiao Tung University

External person

Chung Tse Michael Wu

  • Rutgers University

External person

Sun Elaine

  • Department of Electrical Engineering
  • National Tsing Hua University

External person

Yu Hao

  • Brigham Young University

External person

Nien Hsiang Chang

  • National Chip Implementation Center (CIC)
  • National Applied Research Laboratories Taiwan

External person

Ryan Watson

  • Brigham Young University

External person

Xin Jin

  • Broadcom Corporation
  • Yunnan Univ, Yunnan University, Sch Software

External person