Projects per year
Personal profile
Research Interests
Signal Processing Circuits/Systems design for 5G-beyond/mmWave communications, Deep Learning/Intelligent Edge Computing, Biomedical applications
Experience
2019 – Present Associate Professor, International College of Semiconductor Technology, NCTU, Hsinchu, Taiwan
2016 – 2019 Assistant Professor, International College of Semiconductor Technology, NCTU, Hsinchu, Taiwan
2009 – 2016 Research Staff Member / Project Technical Lead, HRL Laboratories (formerly Hughes Research Laboratory), Malibu, USA
2014 – 2016 Visiting Scholar, Biomimetic Research Laboratory, University of California, Los Angeles, USA
2007 – 2014 Research Assistant / Project Engineering Lead, High Speed Electronics Laboratory, University of California, Los Angeles, USA
2004 – 2007 System Engineer, WIONICS Research, Realtek Group, Irvine, USA
Education/Academic qualification
PhD, University of California, Los Angeles
External positions
Fingerprint
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Network
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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毫米波超寬頻混合式波束成型接收機系統
1/08/21 → 31/07/22
Project: Government Ministry › Ministry of Science and Technology
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High-Performance Artificial Intelligence Based Digital Predistortion System for Millimeter-Wave Power Amplifiers and Next-Generation Computing Platforms
1/05/20 → 31/07/21
Project: Government Ministry › Ministry of Science and Technology
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High-Performance Artificial Intelligence Based Digital Predistortion System for Millimeter-Wave Power Amplifiers and Next-Generation Computing Platforms
1/05/19 → 31/07/20
Project: Government Ministry › Ministry of Science and Technology
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A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies
Chiang, C. W., Wu, C. T. M., Liu, N. C., Liang, C. J. & Kuan, Y. C., 2022, (Accepted/In press) In: IEEE Transactions on Components, Packaging and Manufacturing Technology.Research output: Contribution to journal › Article › peer-review
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A 0.6-V VDD, 3.8-dB Minimum Noise Figure, 19.5-62.5-GHz Low Noise Amplifier in 28-nm Bulk CMOS
Liang, C. J., Chiang, C. W., Zhou, J., Tien, C. J., Huang, R., Wen, K-A., Chang, M. C. F. & Kuan, Y. C., 7 Jun 2021, 2021 IEEE MTT-S International Microwave Symposium, IMS 2021. Institute of Electrical and Electronics Engineers Inc., p. 768-771 4 p. (IEEE MTT-S International Microwave Symposium Digest; vol. 2021-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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A 0.6-V VDD W-Band Neutralized Differential Low Noise Amplifier in 28-nm Bulk CMOS
Liang, C. J., Chiang, C. W., Zhou, J., Huang, R., Wen, K-A., Chang, M. C. F. & Kuan, Y. C., May 2021, In: IEEE Microwave and Wireless Components Letters. 31, 5, p. 481 - 484 4 p.Research output: Contribution to journal › Article › peer-review
2 Scopus citations -
A 12-W 96.1%-Efficiency eFuse-Based Ultrafast Battery Charger Supporting Wireless and USB Power Inputs
Qu, Y., Shu, W., Kuan, Y. C., Chiang, S. H. W., Li, Y., Zheng, Z. & Chang, J. S., Apr 2021, 2021 IEEE Custom Integrated Circuits Conference, CICC 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 9431525. (Proceedings of the Custom Integrated Circuits Conference; vol. 2021-April).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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A 3-D Pillar-Based Electromagnetic Interference Shield for W-Band Antenna on Silicon Using Wire Bonding Technology
Chiang, C. W., Huang, R., Liang, C. J., Wu, C. T. M. & Kuan, Y. C., Nov 2021, (E-pub ahead of print) In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11, 12, p. 2238-2241 4 p.Research output: Contribution to journal › Article › peer-review
Prizes
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IEEE Circuits and Systems Society (CASS) Darlington Best Paper Award
Kuan, Yen-Cheng (Recipient), 2021
Prize
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