Keyphrases
Microstructure
100%
Injection Molding
86%
High Aspect Ratio
70%
Stereolithography
40%
Hot Embossing
40%
Finite Element Analysis
40%
Co-extrusion
40%
Polymer multilayer Films
40%
Mold Temperature
33%
Shear Stress
33%
Viscosity
31%
Mechanical Properties
30%
Spin Coating
30%
Mold Insert
30%
Ceramic Injection Molding
26%
Interfacial Instability
26%
Poly(methyl methacrylate)
25%
Polymer Film
25%
Interior Structure
24%
Crystalline Polymer
22%
Micro Mold
22%
Silicon-based
22%
Biaxial Stretching
20%
Transverse Shrinkage
20%
Film Forming Characteristic
20%
Non-Newtonian Fluid
20%
Shrinkage Properties
20%
Flow Forming
20%
Stretching Parameter
20%
Slot Coating
20%
Polypropylene Membrane
20%
Interfacial Slip
20%
Solid Mechanics
20%
Tolerance Model
20%
Lens Fabrication
20%
Non-conductive Film
20%
Fine pitch
20%
Layer Uniformity
20%
Micro Mold Insert
20%
Rheology
20%
Bump
20%
Optical Sheet
20%
Covering Design
20%
Sub-micron Structure
20%
Isotactic Polypropylene
20%
High Shear Rate
20%
Polycarbonate Blend
20%
Materials Processing
20%
Development Products
20%
On-glass
20%
Engineering
Experimental Result
92%
Injection Moulding
72%
High Aspect Ratio
49%
Mould Insert
42%
Multilayer Film
40%
Mould Temperature
39%
Fluid Viscosity
38%
Machine Direction
30%
Extrusion Process
30%
Process Parameter
26%
Ceramic Injection Moulding
20%
Mold Wall
20%
Environmental Temperature
20%
Glass Bonding
20%
Layer Flow
20%
Lithography
20%
Micromold
20%
Deep X-Ray Lithography
20%
Amorphous Polymer
20%
Conductive
20%
High Shear Rate
20%
Polycarbonate
20%
Slot Coating
20%
Test Result
20%
Finite Element Modeling
20%
Fits and Tolerances
20%
Seed Layer
20%
Finite Element Simulation
20%
Process Condition
20%
Creep
20%
Dependent Material
20%
Polymer Material
20%
Cooling Time
20%
Cross Section
20%
Experimental Investigation
20%
Shear Flow
20%
Pressure Drop
20%
Pressure Distribution
20%
Air Flow
20%
Finite Element Analysis
20%
Superlattice
20%
Glass Substrate
20%
Newtonian Fluid
20%
Paraffin Wax
20%
Coating Property
20%
Thick Layer
20%
Injection Molded Part
20%
Photoresist
20%
High Aspect Ratio Microstructures
16%
Electroforming
14%
