Projects per year
Personal profile
Research Interests
Digital IC design, memory circuits and memory sub-system design, hardware design for AI and machine learning acceleration, 3D-IC design (Monolithic 3D-IC & TSV 3D-IC)
Education/Academic qualification
PhD, Electronics Engineering, National Yang Ming Chiao Tung University
External positions
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Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Accuracy-Aware Deep Neural Network with Computation-in-Memory and 3D-Memory Circuits
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
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教育部智慧晶片系統與應用人才培育計畫--111年度智慧晶片系統與應用跨校教學聯盟計畫-模組教材發展計畫-近記憶體運算及記憶體內運算電路設計
1/04/22 → 31/03/23
Project: Government Ministry › Ministry of Education(Include School)
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Accuracy-Aware Deep Neural Network with Computation-in-Memory and 3D-Memory Circuits
1/08/21 → 31/07/22
Project: Government Ministry › Other Government Ministry Institute
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教育部智慧晶片系統與應用人才培育計畫--110年度智慧晶片系統與應用跨校教學聯盟-模組教材發展計畫-近記憶體運算及記憶體內運算電路設計
1/07/21 → 31/03/22
Project: Government Ministry › Ministry of Education(Include School)
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Accuracy-Aware Deep Neural Network with Computation-in-Memory and 3D-Memory Circuits
1/08/20 → 31/07/21
Project: Government Ministry › Other Government Ministry Institute
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An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology
Zhang, J., Lu, W., Huang, P. T., Li, S. H., Hung, T. Y., Wu, S. H., Dai, M. J., Chung, I. S., Chen, W. C., Wang, C. H., Sheu, S. S., Chen, H. M., Chen, K. N., Lo, W. C. & Wu, C. I., 2022, 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Institute of Electrical and Electronics Engineers Inc., p. 262-263 2 p. (Digest of Technical Papers - Symposium on VLSI Technology; vol. 2022-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Bending Resistant Multibit Memristor for Flexible Precision Inference Engine Application
Pal, P., Lee, K. J., Thunder, S., De, S., Huang, P. T., Kampfe, T. & Wang, Y. H., 2022, (Accepted/In press) In: IEEE Transactions on Electron Devices. p. 1-7 7 p.Research output: Contribution to journal › Article › peer-review
3 Scopus citations -
Cognitive Bus Coding Scheme for Inter-Chip Communications of Deep Learning Accelerator Chiplet on Low-cost Si and Glass Interposer
Chang, Y. H., Singh, T. H. & Huang, P. T., 2022, Proceedings - 2022 IEEE 15th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2022. Institute of Electrical and Electronics Engineers Inc., p. 232-238 7 p. (Proceedings - 2022 IEEE 15th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Design Exploration of An Energy-Efficient Acceleration System for CNNs on Low-Cost Resource-Constraint SoC-FPGAs
Wen, S. C. & Huang, P. T., 2022, Proceeding - IEEE International Conference on Artificial Intelligence Circuits and Systems, AICAS 2022. Institute of Electrical and Electronics Engineers Inc., p. 234-237 4 p. (Proceeding - IEEE International Conference on Artificial Intelligence Circuits and Systems, AICAS 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Digi-FH-OFDM: An all-digital wideband frequency-hopped OFDM system
Bora, A. S., Singh, T. H. & Huang, P. T., Jun 2022, In: Physical Communication. 52, p. 1-11 11 p., 101660.Research output: Contribution to journal › Review article › peer-review