Projects per year
Personal profile
Research Interests
Digital IC design, memory circuits and memory sub-system design, hardware design for AI and machine learning acceleration, 3D-IC design (Monolithic 3D-IC & TSV 3D-IC)
Education/Academic qualification
PhD, Electronics Engineering, National Yang Ming Chiao Tung University
External positions
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Collaborations and top research areas from the last five years
Projects
- 8 Finished
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Accuracy-Aware Deep Neural Network with Computation-in-Memory and 3D-Memory Circuits
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
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教育部智慧晶片系統與應用人才培育計畫--111年度智慧晶片系統與應用跨校教學聯盟計畫-模組教材發展計畫-近記憶體運算及記憶體內運算電路設計
1/04/22 → 31/03/23
Project: Government Ministry › Ministry of Education(Include School)
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Accuracy-Aware Deep Neural Network with Computation-in-Memory and 3D-Memory Circuits
1/08/21 → 31/07/22
Project: Government Ministry › Other Government Ministry Institute
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教育部智慧晶片系統與應用人才培育計畫--110年度智慧晶片系統與應用跨校教學聯盟-模組教材發展計畫-近記憶體運算及記憶體內運算電路設計
1/07/21 → 31/03/22
Project: Government Ministry › Ministry of Education(Include School)
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Accuracy-Aware Deep Neural Network with Computation-in-Memory and 3D-Memory Circuits
1/08/20 → 31/07/21
Project: Government Ministry › Other Government Ministry Institute
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Novel Complementary FeFET- based Lookup Table and Routing Switch Design and their Applications in Energy/Area-Efficient FPGA
Huang, Y. Y., Huang, P. T., Lee, P. Y. & Su, P., 2023, 7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023. Institute of Electrical and Electronics Engineers Inc., (7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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On-Interposer Decoupling Capacitors Placement for Interposer-based 3DIC
Chen, P. Y., Liu, C. Y., Chen, H. M. & Huang, P. T., 2023, Proceedings of the 24th International Symposium on Quality Electronic Design, ISQED 2023. IEEE Computer Society, (Proceedings - International Symposium on Quality Electronic Design, ISQED; vol. 2023-April).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Reshaping System Design in 3D Integration: Perspectives and Challenges
Chen, H. M., Ho, C. W., Wu, S. H., Lu, W., Huang, P. T., Chang, H. J. & Liu, C. N. J., 26 Mar 2023, ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design. Association for Computing Machinery, p. 71-77 7 p. (Proceedings of the International Symposium on Physical Design).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Single-Crystal Germanium by Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique for Monolithic 3D ICs
Chung, H. T., Pan, Y. M., Lin, N. C., Shih, B. J., Yang, C. C., Shen, C. H., Huang, P. T., Cheng, H. C., Chen, K. N. & Hu, C., 2023, (Accepted/In press) In: Ieee Electron Device Letters. p. 1 1 p.Research output: Contribution to journal › Article › peer-review
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An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology
Zhang, J., Lu, W., Huang, P. T., Li, S. H., Hung, T. Y., Wu, S. H., Dai, M. J., Chung, I. S., Chen, W. C., Wang, C. H., Sheu, S. S., Chen, H. M., Chen, K. N., Lo, W. C. & Wu, C. I., 2022, 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Institute of Electrical and Electronics Engineers Inc., p. 262-263 2 p. (Digest of Technical Papers - Symposium on VLSI Technology; vol. 2022-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Scopus citations