Calculated based on number of publications stored in Pure and citations from Scopus
Calculated based on number of publications stored in Pure and citations from Scopus
Calculated based on number of publications stored in Pure and citations from Scopus
20052024

Research activity per year

Network

Tao Yang

  • Department of Electrical Engineering
  • University of California at Los Angeles
  • Electrical Engineering Department
  • University of Electronic Science and Technology of China
  • School of Electronic Engineering
  • Broadcom Corporation
  • Electrical Engineering Department
  • Dept. of Electrical Engineering
  • School of Electronic Science and Engineering
  • National Yang Ming Chiao Tung University
  • Research Center Of Advanced Rf Chips And Systems
  • Research Center of Advanced Rf Chips and Systems
  • Nanhu Laboratory

External person

Ruimin Xu

  • University of Electronic Science and Technology of China
  • Department of Electrical Engineering
  • School of Electronic Science and Engineering

External person

Xu Zhu

  • University of Electronic Science and Technology of China
  • School of Electronic Science and Engineering
  • CAS - Institute of Electronics
  • Northern Institute of Electronic Equipment of China
  • Laboratory of Electromagnetic Space Cognition and Intelligent Control
  • Laboratory of Electromagnetic Space Cognition and Intelligent Control

External person

T. Itoh

  • University of California at Los Angeles
  • Electrical Engineering Department
  • Electrical Engineering Department
  • Electrical Engineering Department
  • Univ of Texas, Dep of Electr &
  • University of Texas at Austin
  • Electrical Engineering Department
  • Department of Electrical and Computer Engineering
  • University of California at San Diego
  • University of California

External person

Xiong Chen

  • University of Electronic Science and Technology of China

External person

Zhihua Wei

  • University of Electronic Science and Technology of China

External person

Junchen Lai

  • University of Electronic Science and Technology of China

External person

Bin Liu

  • University of Electronic Science and Technology of China

External person

Kun Li

  • University of Electronic Science and Technology of China

External person

Yong Wang

  • University of Electronic Science and Technology of China
  • Research Center of Advanced Rf Chips and Systems
  • Research Center Of Advanced Rf Chips And Systems

External person

Jianjia Hu

  • National Yang Ming Chiao Tung University
  • University of Electronic Science and Technology of China

External person

Anrong Chen

  • University of Electronic Science and Technology of China

External person

Yong Wang

  • University of Electronic Science and Technology of China

External person

Yuhang Ning

  • University of Electronic Science and Technology of China

External person

Chun Pin Chien

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Chengfei Yi

  • University of Electronic Science and Technology of China

External person

Tse Yu Chen

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Xilin Zhang

  • University of Electronic Science and Technology of China

External person

Ruimin Xu

  • University of Electronic Science and Technology of China

External person

Tiedi Zhang

  • University of Electronic Science and Technology of China

External person

Yuanan Liu

  • Beijing University of Posts and Telecommunications

External person

Ting Chen Hsu

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering
  • MediaTek

External person

Bo Yuan Zhu

  • University of Electronic Science and Technology of China

External person

Ruimin Xu

  • School of Electronic Science and Engineering
  • University of Electronic Science and Technology of China

External person

Kuan Lin Ho

  • Garmin Inc.
  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Jianbin Liu

  • University of Electronic Science and Technology of China

External person

Yi Sen Shih

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Yu De Lin

  • Department of Electrical Engineering
  • National Yang Ming Chiao Tung University
  • Department of Communication Engineering
  • Department of Communication Engineering

External person

Ming Hui Huang

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Xilin Zhang

  • University of Electronic Science and Technology of China

External person

Chun Chih Liu

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering
  • Department of Electrical Engineering

External person

Xiao Sun

  • University of Electronic Science and Technology of China

External person

Jiashuai Wang

  • University of Electronic Science and Technology of China

External person

En Deng

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Sheng Yu Hsieh

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Ping Hao Hung

  • National Yang Ming Chiao Tung University

External person

Yu Ting Lin

  • Department of Material Science and Engineering
  • National Yang Ming Chiao Tung University
  • Chung Yuan Christian University
  • Master Program in Nanotechnology
  • Department of Materials Science and Engineering
  • Institute of Imaging and Biomedical Photonics
  • Dept. of Electronic Engineering

External person

Ziqi Pu

  • University of Electronic Science and Technology of China

External person

Wen Yuan Chang

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Liqiong Liao

  • University of Electronic Science and Technology of China

External person

Hung Ti Hsu

  • National Yang Ming Chiao Tung University

External person

Tao Yang

  • University of Electronic Science and Technology of China

External person

Kun Li

  • University of Electronic Science and Technology of China

External person

Bo Yan

  • University of Electronic Science and Technology of China

External person

Yufei Cheng

  • University of Electronic Science and Technology of China

External person

Yu Wen Chi

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Xiaojing Hu

  • University of Electronic Science and Technology of China

External person

Yu Ting Yan

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Luyu Xu

  • University of Electronic Science and Technology of China

External person

Chiao Yun Hsiao

  • National Yang Ming Chiao Tung University

External person

Junzhi Zhang

  • Southeast University, Nanjing

External person

Ziqi Pu

  • University of Electronic Science and Technology of China

External person

Ching Hsiang Wang

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering
  • Ind Technol Res Inst, Industrial Technology Research Institute - Taiwan, Biomed Technol & Device Res Labs

External person

Tao Yang

  • University of Electronic Science and Technology of China

External person

Mohammed Reza M. Hashemi

  • Electrical Engineering Department
  • University of California at Los Angeles

External person

Jincheng Li

  • Research Center Of Advanced Rf Chips And Systems
  • University of Electronic Science and Technology of China

External person

Hung Yin Hsieh

  • National Yang Ming Chiao Tung University

External person

Tiantian Zeng

  • University of Electronic Science and Technology of China

External person

Chia Ling Huang

  • National Yang Ming Chiao Tung University

External person

Yu Heng Cheng

  • National Yang Ming Chiao Tung University

External person

Mi Tian

  • University of Electronic Science and Technology of China

External person

Yaru Hou

  • University of Electronic Science and Technology of China

External person

Yu De Lin

  • Department of Electrical Engineering
  • National Yang Ming Chiao Tung University
  • Antenna Laboratory
  • IEEE
  • Department of Communication Engineering
  • Department of Communication Engineering

External person

Shuxuan Liu

  • University of Electronic Science and Technology of China

External person

Yi Chieh Chou

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Syu Sheng Wu

  • Department of Communication Engineering
  • National Yang Ming Chiao Tung University

External person

Xiang Li

  • CAS - Institute of Electronics

External person

Chi Hsien Pao

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering
  • Institute of Communications Engineering

External person

Shaojuan Chen

  • University of Electronic Science and Technology of China

External person

Ting Tsan Lin

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Ching K. Liao

  • Department of Communication Engineering
  • National Yang Ming Chiao Tung University
  • Gemtek Technology Company Ltd.
  • Gemtek Technology Company Ltd.
  • Department of Communication Engineering

External person

Po Wei Huang

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering
  • Institute of Electrical Control Engineering
  • Institute of Electrical and Computer Engineering
  • Natl Chaio Tung Univ, National Chiao Tung University, Inst Elect & Control Engn

External person

Jie Wen

  • Chengdu Spaceon Electronics Co., Ltd.
  • Chengdu Spaceon Electronics Co. Ltd.

External person

Weigan Lin

  • University of Electronic Science and Technology of China
  • Department of Electrical Engineering

External person

Qun Li

  • University of Electronic Science and Technology of China

External person

Tsung Ying Tsai

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Wei Sun

  • University of Electronic Science and Technology of China

External person

Shu An Shang

  • National Yang Ming Chiao Tung University

External person

Ziyuan Chen

  • University of Electronic Science and Technology of China

External person

Xu Zhu

  • School of Electronic Science and Engineering
  • University of Electronic Science and Technology of China

External person

Liang Qi

  • Laboratory of Electromagnetic Space Cognition and Intelligent Control

External person

Yu Ting Yan

  • National Yang Ming Chiao Tung University

External person

Tao Yang

  • University of Electronic Science and Technology of China

External person

Cheng Jung Lee

  • Rayspan Corporation

External person

Xiang Li

  • CAS - Institute of Electronics

External person

Kevin M. Leong

  • University of California at Los Angeles
  • Electrical Engineering Department

External person

Yu Wen Chi

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Jianxin Li

  • University of Electronic Science and Technology of China

External person

Hong Min Lin

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Shuo Ching Hung

  • National Yang Ming Chiao Tung University

External person

Zhuohao Liu

  • University of Electronic Science and Technology of China

External person

Po Hua Wang

  • National Yang Ming Chiao Tung University

External person

Rang Lee

  • National Yang Ming Chiao Tung University

External person

Ching Kai Chiou

  • National Yang Ming Chiao Tung University
  • Dept. of Electrical and Computer Engineering

External person

Huaizong Shao

  • University of Electronic Science and Technology of China

External person

Ke Huang

  • University of Electronic Science and Technology of China

External person

Yi Ming Chen

  • Department of Electrical Engineering
  • National Yang Ming Chiao Tung University
  • Dept. of Electronics Engineering
  • Department of Electronics Engineering and Institute of Electronics

External person

Xiling Zhang

  • University of Electronic Science and Technology of China

External person

Hung Tse Shih

  • National Yang Ming Chiao Tung University

External person

Benjamin S. Williams

  • University of California at Los Angeles
  • Electrical Engineering Department

External person