Projects per year
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Active
Research and Development of Micro Electronics Division
1/01/23 → 31/12/23
Project: Government Ministry › Other Government Ministry Institute
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Ultra-high Bandwidth Memory And Logic Chip Integration System Platform Realized By Ultra-thin Wafer Stacking With Bumpless Structure
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
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Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute