Kuan-Neng Chen

Projects

Projects per year 2009 2020 2021 2022 2024

• 30 Finished

Projects per year

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• Finished

  Ultra-high Bandwidth Memory And Logic Chip Integration System Platform Realized By Ultra-thin Wafer Stacking With Bumpless Structure

  Chen, K.-N. (PI)

  1/08/23 → 31/07/24

  Project: Government Ministry › Other Government Ministry Institute

• Research and Development of Micro Electronics Division

  Chen, K.-N. (PI)

  1/01/23 → 31/12/23

  Project: Government Ministry › Other Government Ministry Institute

• Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration

  Chen, K.-N. (PI)

  1/08/22 → 31/07/23

  Project: Government Ministry › Other Government Ministry Institute

• Ultra-high Bandwidth Memory And Logic Chip Integration System Platform Realized By Ultra-thin Wafer Stacking With Bumpless Structure

  Chen, K.-N. (PI)

  1/08/22 → 31/07/23

  Project: Government Ministry › Other Government Ministry Institute

• Research and Development of Micro Electronics Division

  Chen, K.-N. (PI)

  1/01/22 → 31/12/22

  Project: Government Ministry › Other Government Ministry Institute

• Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration

  Chen, K.-N. (PI)

  1/08/21 → 31/07/22

  Project: Government Ministry › Other Government Ministry Institute

• Ultra-high Bandwidth Memory And Logic Chip Integration System Platform Realized By Ultra-thin Wafer Stacking With Bumpless Structure

  Chen, K.-N. (PI)

  1/08/21 → 31/07/22

  Project: Government Ministry › Other Government Ministry Institute

• 110年強化與東協及南亞國家合作交流計畫

  Chen, K.-N. (PI)

  1/08/21 → 31/07/22

  Project: Government Ministry › Ministry of Education(Include School)

• 新南向計畫之110年研發菁英人才專班

  Chen, K.-N. (PI)

  1/04/21 → 31/03/22

  Project: Government Ministry › Ministry of Education(Include School)

• Research and Development of Micro Electronics Division

  Chen, K.-N. (PI)

  1/01/21 → 31/12/21

  Project: Government Ministry › Other Government Ministry Institute

• Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration

  Chen, K.-N. (PI)

  1/08/20 → 31/07/21

  Project: Government Ministry › Other Government Ministry Institute

• 強化與東協及南亞國家合作交流計畫

  Chen, K.-N. (PI)

  1/05/20 → 28/02/21

  Project: Government Ministry › Ministry of Education(Include School)

• Development of 2.5D Heterogeneous Integration Platform Using Self- Assembly Technologies

  Chen, K.-N. (PI)

  1/01/20 → 31/12/20

  Project: Government Ministry › Other Government Ministry Institute

• Using 3D IC packaging technology for the integration of photonics

  Chen, K.-N. (PI)

  1/08/19 → 31/07/20

  Project: Government Ministry › Other Government Ministry Institute

• Development of 2.5D Heterogeneous Integration Platform Using Self-Assembly Technologies-

  Chen, K.-N. (PI)

  1/01/19 → 31/12/19

  Project: Government Ministry › Other Government Ministry Institute

• Using 3D IC packaging technology for the integration of photonics

  Chen, K.-N. (PI)

  1/08/18 → 31/07/19

  Project: Government Ministry › Other Government Ministry Institute

• Development of 2.5D Heterogeneous Integration Platform Using Self-Assembly Technologies

  Chen, K.-N. (PI)

  1/01/18 → 31/12/18

  Project: Government Ministry › Other Government Ministry Institute

• Using 3D IC packaging technology for the integration of photonics

  Chen, K.-N. (PI)

  1/08/17 → 31/07/18

  Project: Government Ministry › Other Government Ministry Institute

• Fabrication of Mega-Channel Ultra-High-Density uECoG Recording System Based on TSV and 3D

  Chen, K.-N. (PI)

  1/08/16 → 31/07/17

  Project: Government Ministry › Other Government Ministry Institute

• Research and Development of Heterogenous 40-nm/0.18-um Technology Integration Platform and

  Chen, K.-N. (PI)

  1/08/16 → 31/07/17

  Project: Government Ministry › Other Government Ministry Institute

• Fabrication of Mega-Channel Ultra-High-Density uECoG Recording System Based on TSV and 3D

  Chen, K.-N. (PI)

  1/08/15 → 31/07/16

  Project: Government Ministry › Other Government Ministry Institute

• Research and Development of Heterogenous 40-nm/0.18-um Technology Integration Platform and

  Chen, K.-N. (PI)

  1/08/15 → 31/07/16

  Project: Government Ministry › Other Government Ministry Institute

• Fabrication of Mega-Channel Ultra-High-Density uECoG Recording System Based on TSV and 3D

  Chen, K.-N. (PI)

  1/08/14 → 31/07/15

  Project: Government Ministry › Other Government Ministry Institute

• Research and Development of Heterogenous 40-nm/0.18-um Technology Integration Platform and

  Chen, K.-N. (PI)

  1/08/14 → 31/07/15

  Project: Government Ministry › Other Government Ministry Institute

• The Study of Stacked Memory And Functional Devices for Three-dimensional Integrated Circuits (3D IC) Applications

  Chen, K.-N. (PI)

  1/08/13 → 31/07/14

  Project: Government Ministry › Other Government Ministry Institute

• Studies of Through Silicon Via (TSV) And Other Key Technologies in Three-Dimensional Integrated

  Chen, K.-N. (PI)

  1/08/12 → 31/07/13

  Project: Government Ministry › Other Government Ministry Institute

• Studies of Through Silicon Via(TSV) and Other Key Technologies in Three-Dimensional Integrated Circuit (3D IC) with Stress Analysis and Thermal Conductivity Modeling

  Chen, K.-N. (PI)

  1/08/11 → 31/07/12

  Project: Government Ministry › Other Government Ministry Institute

• 三維積體電路(3D IC)關鍵技術之研究(2/2)

  Chen, K.-N. (PI)

  1/08/10 → 31/07/11

  Project: Government Ministry › Other Government Ministry Institute

• Studies of Three-Dimensional Integrated Circuit (3D IC) with Carbon Nanotube (CNT) and Nickel Nanowire as Through-Silicon Via (TSV)

  Chen, K.-N. (PI)

  1/08/10 → 31/07/11

  Project: Government Ministry › Other Government Ministry Institute

• 三維積體電路(3D IC)關鍵技術之研究(1/2)

  Chen, K.-N. (PI)

  1/08/09 → 31/07/10

  Project: Government Ministry › Other Government Ministry Institute