Keyphrases
3D Integration
100%
Low Temperature
69%
Cu-Cu Bonding
49%
Through Silicon via
49%
Hybrid Bonding
48%
Wafer Level
44%
3D IC
43%
Three-dimensional Integration
36%
Bonding Technology
34%
Heterogeneous Integration
31%
Wafer Bonding
29%
Electrical Performance
28%
Integrated Application
26%
Cu-Sn
25%
Integration Scheme
24%
Bonding Structure
24%
Bonding Temperature
24%
Wafer
23%
Bonding Process
23%
Bonding Quality
22%
Neural Sensing
21%
Passivation Layer
17%
Microsystems
17%
Low-temperature Bonding
17%
Passivation
16%
Microbump
16%
Fan-out
14%
Ultrathin
14%
Electrical Reliability
14%
Fine pitch
14%
Copper Wafer
13%
In(III)
13%
Buffer Layer
13%
Electrical Characteristics
12%
Bonding Interface
12%
Cu TSV
11%
Polyimide
11%
Reliability Test
11%
Redistribution Layer
11%
Oxides
11%
Chip-level
10%
Thermo-compression Bonding
10%
3D Heterogeneous Integration
10%
Sensing Applications
10%
Wafer-level Packaging
9%
Back-end-of-line
9%
Interposer
9%
Bonding Material
9%
Debonding
9%
Low Thermal Budget
9%
Engineering
Low-Temperature
94%
Interconnects
47%
Bonding Technology
45%
Wafer Bonding
41%
Electrical Performance
38%
Three Dimensional Integrated Circuits
32%
Passivation
31%
Bonding Temperature
26%
Direct Bonding
25%
Interposer
22%
Bonding Process
22%
Passivation Layer
21%
Microsystem
18%
Bonding Structure
18%
Transmissions
18%
Technology Integration
16%
Reliability Analysis
16%
Copper Wafer
13%
Dielectrics
13%
Level Packaging
13%
Bonding Strength
12%
Thin Films
11%
Electrical Measurement
10%
Sensing Application
10%
Bonded Structure
9%
Microelectromechanical System
8%
Buffer Layer
8%
Metal Layer
8%
Silicon Layer
8%
Joints (Structural Components)
8%
Silicon Substrate
8%
Manufacturability
7%
Energy Engineering
7%
Reliability Assessment
7%
Bonding Material
7%
Integration Platform
7%
Bond Strength
7%
Cu Surface
7%
Eutectic Bonding
6%
Realization
6%
Fits and Tolerances
6%
Process Flow
6%
Integrated Circuit
6%
Humidity Test
5%
Microstructure
5%
Thermocompression Bonding
5%
Adhesion Layer
5%
Thermal Stress
5%
Nodes
5%
Process Development
5%