Keyphrases
3D Integration
94%
Low Temperature
74%
Hybrid Bonding
52%
Cu-Cu Bonding
49%
Through Silicon via
46%
3D IC
46%
Wafer Level
41%
Three-dimensional Integration
35%
Bonding Technology
33%
Heterogeneous Integration
31%
Wafer Bonding
27%
Electrical Performance
27%
Bonding Structure
25%
Wafer
25%
Integrated Application
25%
Cu-Sn
24%
Bonding Quality
24%
Integration Scheme
23%
Passivation Layer
23%
Bonding Process
22%
Bonding Temperature
22%
Neural Sensing
20%
Passivation
17%
Low-temperature Bonding
17%
Microsystems
16%
Microbump
15%
Fine pitch
14%
Fan-out
14%
Ultrathin
13%
Electrical Reliability
13%
Copper Wafer
13%
In(III)
13%
Fin Field-effect Transistor (FinFET)
12%
Buffer Layer
12%
Advanced Packaging
12%
Electrical Characteristics
12%
Bonding Interface
12%
Redistribution Layer
12%
Cu TSV
11%
Polyimide
11%
Reliability Test
10%
Oxides
10%
Low Thermal Budget
10%
Thermo-compression Bonding
10%
3D Heterogeneous Integration
9%
Chip-level
9%
Sensing Applications
9%
Interposer
9%
Wafer-level Packaging
9%
Back-end-of-line
9%
Engineering
Low-Temperature
100%
Bonding Technology
45%
Interconnects
45%
Wafer Bonding
38%
Electrical Performance
38%
Three Dimensional Integrated Circuits
35%
Passivation
30%
Bonding Temperature
24%
Direct Bonding
23%
Passivation Layer
23%
Interposer
22%
Bonding Process
21%
Silicon Dioxide
19%
Dielectrics
19%
Technology Integration
18%
Bonding Structure
18%
Microsystem
18%
Reliability Analysis
15%
Copper Wafer
12%
Level Packaging
12%
Bonding Strength
12%
Thin Films
11%
Silicon Layer
11%
Interlayer
10%
Electrical Measurement
9%
Sensing Application
9%
Integrated Circuit
9%
Bonded Structure
9%
Microelectromechanical System
8%
Buffer Layer
8%
Metal Layer
8%
Joints (Structural Components)
7%
Silicon Substrate
7%
Flexible Substrate
7%
Manufacturability
7%
Polymer Material
7%
Reliability Assessment
7%
Process Flow
7%
Bonding Material
7%
Chemical Mechanical Polishing
7%
Integration Platform
7%
Bond Strength
6%
Cu Surface
6%
Eutectic Bonding
6%
Fits and Tolerances
6%
Realization
6%
Coefficient of Thermal Expansion
5%
Thermal Compression Bonding
5%
Bonding Mechanism
5%
Pretreatment
5%