Projects per year
Personal profile
Research Interests
Three-Dimensional Integrated Circuits, Heterogeneous Integration, Advanced Packaging Technologies
Experience
Education/Academic qualification
PhD, Electrical Engineering and Computer Science, Massachusetts Institute of Technology
External positions
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Dive into the research topics where Kuan-Neng Chen is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Projects
- 30 Finished
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Ultra-high Bandwidth Memory And Logic Chip Integration System Platform Realized By Ultra-thin Wafer Stacking With Bumpless Structure
Chen, K.-N. (PI)
1/08/23 → 31/07/24
Project: Government Ministry › Other Government Ministry Institute
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Research and Development of Micro Electronics Division
Chen, K.-N. (PI)
1/01/23 → 31/12/23
Project: Government Ministry › Other Government Ministry Institute
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Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration
Chen, K.-N. (PI)
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
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Ultra-high Bandwidth Memory And Logic Chip Integration System Platform Realized By Ultra-thin Wafer Stacking With Bumpless Structure
Chen, K.-N. (PI)
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
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Research and Development of Micro Electronics Division
Chen, K.-N. (PI)
1/01/22 → 31/12/22
Project: Government Ministry › Other Government Ministry Institute
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Mechanisms of room-temperature SiCN pre-bonding and low-temperature post-annealing of SiCN/nanocrystalline-nanotwinned Cu hybrid joints
He, P. S., Chen, H. Y., Chiang, Y. W., Kao, C. C., Huang, B. C., Song, G., Zhang, P., Chiu, W. L., Hsu, M. P., Chen, K. N., Lee, C. C., Liu, Y. L., Chen, K. Y. & Chen, C., 1 Aug 2026, In: Applied Surface Science. 736, 166787.Research output: Contribution to journal › Article › peer-review
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Tuning interlayer water content for optimized stability and mechanistic insights in bilayered V2O5∙nH2O cathode material for Zinc (Magnesium)-ion batteries: A DFT and AIMD study
Nguyen, N. P., Khong, N. Y. T., Liu, C. H., Van Man, T., Kuo, L. Y., Chen, K. N. & Pham, N. N. T., Mar 2026, In: Applied Surface Science Advances. 32, 100948.Research output: Contribution to journal › Article › peer-review
Open Access -
10-second Cu/Polymer Hybrid Bonding Using Area-Selective Metal Passivation for 3D Integration
Liu, Y. L., Chen, T. Y., Ebisawa, K., Irie, M., Chuang, Y. C., Yeh, H. W., Fujimura, S. & Chen, K. N., 2025, In: IEEE Electron Device Letters. 46, 5, p. 833-836 4 p.Research output: Contribution to journal › Article › peer-review
3 Scopus citations -
Achieving low-temperature Cu–Cu bonding platform via area-selective metal films with superior surface roughness for advanced packaging
Hsu, M. P., Chen, C. Y., Chang, H. C. & Chen, K. N., 1 May 2025, In: Journal of Materials Research and Technology. 36, p. 7748-7754 7 p.Research output: Contribution to journal › Article › peer-review
Open Access8 Scopus citations -
Advanced CMP Optimization for Enhanced Cu/Polymer Hybrid Bonding in 3D IC
Chen, T. Y., Liu, Y. L. & Chen, K. N., 2025, 2025 IEEE International Interconnect Technology Conference, IITC 2025. Institute of Electrical and Electronics Engineers Inc., (2025 IEEE International Interconnect Technology Conference, IITC 2025).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
2 Scopus citations
Prizes
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Excellent Young Electrical Engineer Award, Chinese Institute of Electrical Engineering
Chen, K.-N. (Recipient), 2012
Prize: Honorary award
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Activities
- 1 Invited talk
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IEEE Interconnect Technology Conference (IITC)
Chen, K.-N. (Speaker)
4 Jun 2018Activity: Talk or presentation › Invited talk