Projects per year
Personal profile
Research Interests
Three-Dimensional Integrated Circuits, Heterogeneous Integration, Advanced Packaging Technologies
Experience
Education/Academic qualification
PhD, Electrical Engineering and Computer Science, Massachusetts Institute of Technology
External positions
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Dive into the research topics where Kuan-Neng Chen is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
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Projects
- 30 Finished
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Ultra-high Bandwidth Memory And Logic Chip Integration System Platform Realized By Ultra-thin Wafer Stacking With Bumpless Structure
Chen, K.-N. (PI)
1/08/23 → 31/07/24
Project: Government Ministry › Other Government Ministry Institute
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Research and Development of Micro Electronics Division
Chen, K.-N. (PI)
1/01/23 → 31/12/23
Project: Government Ministry › Other Government Ministry Institute
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Ultra-high Bandwidth Memory And Logic Chip Integration System Platform Realized By Ultra-thin Wafer Stacking With Bumpless Structure
Chen, K.-N. (PI)
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
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Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration
Chen, K.-N. (PI)
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
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Research and Development of Micro Electronics Division
Chen, K.-N. (PI)
1/01/22 → 31/12/22
Project: Government Ministry › Other Government Ministry Institute
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10-second Cu/Polymer Hybrid Bonding Using Area-Selective Metal Passivation for 3D Integration
Liu, Y. L., Chen, T. Y., Ebisawa, K., Irie, M., Chuang, Y. C., Yeh, H. W., Fujimura, S. & Chen, K. N., 2025, In: Ieee Electron Device Letters. 46, 5, p. 833-836 4 p.Research output: Contribution to journal › Article › peer-review
1 Scopus citations -
A Transfer Bonding Technology for Advanced 2.5-D Integration with Reduced Warpage and Improved Stacking Flexibility
Liu, Y. L., Hsu, C. K., Hsiao, C. C., Li, C. T., Lin, J. R. & Chen, K. N., 2025, In: Ieee Electron Device Letters. 46, 9, p. 1609-1611 3 p.Research output: Contribution to journal › Article › peer-review
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Capping Layers for Enhanced Crystallinity of Single-Crystal Germanium on Insulator in Monolithic 3D ICs
Pan, Y. M., Chen, C. L., Chung, H. T., Wang, C. Y., Lin, N. C., Yang, C. C., Shen, C. H. & Chen, K. N., 2025, Proceedings - IEEE 75th Electronic Components and Technology Conference, ECTC 2025. Institute of Electrical and Electronics Engineers Inc., p. 1795-1799 5 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Continuous single-crystal germanium films using elevated-laser-liquid-phase-epitaxy technique for monolithic 3D integration
Pan, Y. M., Chiu, H. Y., Lin, N. C., Chung, H. T., Wang, C. Y., Chen, C. L., Shih, B. J., Yang, C. C., Huang, P. T., Shen, C. H., Sung, P. J., Wu, W. F., Chen, K. N. & Hu, C., 1 Apr 2025, In: Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers. 64, 4, 04SP56.Research output: Contribution to journal › Article › peer-review
Open Access -
Fabrication Optimization and Reliability Study of Hyper RDL (HRDL) Interposer for Advanced Packaging and Heterogeneous Integration
Li, C. T., Liu, Y. L., Sun, T. H., Hsiung, C. K., Yang, Y. T., Tsai, W. T., Hsu, M. P., Huang, Y. C. & Chen, K. N., 2025, Proceedings - IEEE 75th Electronic Components and Technology Conference, ECTC 2025. Institute of Electrical and Electronics Engineers Inc., p. 1134-1139 6 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Scopus citations
Prizes
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Excellent Young Electrical Engineer Award, Chinese Institute of Electrical Engineering
Chen, K.-N. (Recipient), 2012
Prize: Honorary award
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Activities
- 1 Invited talk
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IEEE Interconnect Technology Conference (IITC)
Chen, K.-N. (Speaker)
4 Jun 2018Activity: Talk or presentation › Invited talk