Projects per year
Personal profile
Research Interests
Three-Dimensional Integrated Circuits, Heterogeneous Integration, Advanced Packaging Technologies
Experience
Education/Academic qualification
PhD, Electrical Engineering and Computer Science, Massachusetts Institute of Technology
External positions
Fingerprint
Dive into the research topics where Kuan-Neng Chen is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Network
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
-
Research and Development of Micro Electronics Division
1/01/23 → 31/12/23
Project: Government Ministry › Other Government Ministry Institute
-
Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
-
Ultra-high Bandwidth Memory And Logic Chip Integration System Platform Realized By Ultra-thin Wafer Stacking With Bumpless Structure
1/08/22 → 31/07/23
Project: Government Ministry › Other Government Ministry Institute
-
Ultra-high Bandwidth Memory And Logic Chip Integration System Platform Realized By Ultra-thin Wafer Stacking With Bumpless Structure
1/08/23 → 31/07/24
Project: Government Ministry › Other Government Ministry Institute
-
Research and Development of Micro Electronics Division
1/01/22 → 31/12/22
Project: Government Ministry › Other Government Ministry Institute
-
Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration
Hong, Z. J., Liu, D., Hu, H. W., Hsiung, C. K., Cho, C. I., Chen, C. H., Liu, J. H., Weng, M. W., Hsu, M. P., Hung, Y. C. & Chen, K. N., 1 Feb 2023, In: Applied Surface Science. 610, 155470.Research output: Contribution to journal › Article › peer-review
-
Scheme for Multi-Chiplet Integration with Low Thermal Budget by Asymmetric Cu-Cu Bonding with Au Passivation Bonding Structure
Hong, Z. J., Weng, M. W., Chen, C. H., Hsu, M. P., Hu, H. W., Lin, T. Y., Hung, Y. C. & Chen, K. N., 2023, (Accepted/In press) In: Ieee Electron Device Letters. p. 1 1 p.Research output: Contribution to journal › Article › peer-review
-
A hybrid bonding interconnection with a novel low-temperature bonding polymer system
Lin, Y. M., Chang, P. C., Lee, O. H., Chiu, W. L., Chang, T. C., Chang, H. H., Lee, C. H., Huang, B., Dong, M., Tsai, D., Lee, C. C. & Chen, K. N., 2022, Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022. Institute of Electrical and Electronics Engineers Inc., p. 2128-2134 7 p. (Proceedings - Electronic Components and Technology Conference; vol. 2022-May).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Scopus citations -
An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology
Zhang, J., Lu, W., Huang, P. T., Li, S. H., Hung, T. Y., Wu, S. H., Dai, M. J., Chung, I. S., Chen, W. C., Wang, C. H., Sheu, S. S., Chen, H. M., Chen, K. N., Lo, W. C. & Wu, C. I., 2022, 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022. Institute of Electrical and Electronics Engineers Inc., p. 262-263 2 p. (Digest of Technical Papers - Symposium on VLSI Technology; vol. 2022-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
-
Direct metal bonding using nanotwinned Ag films with (1 1 1) surface orientation under air atmosphere for heterogeneous integration
Chang, L. P., Wang, J. J., Hung, T. H., Chen, K. N. & Ouyang, F. Y., 1 Feb 2022, In: Applied Surface Science. 576, 151845.Research output: Contribution to journal › Article › peer-review
5 Scopus citations
Prizes
-
-
Excellent Young Electrical Engineer Award, Chinese Institute of Electrical Engineering
Chen, Kuan-Neng (Recipient), 2012
Prize: Honorary award
-
-
IEEE EPS Exceptional Technical Achievement Award
Chen, Kuan-Neng (Recipient), 2018
Prize: Honorary award
-
Activities
- 1 Invited talk
-
IEEE Interconnect Technology Conference (IITC)
Kuan-Neng Chen (Speaker)
4 Jun 2018Activity: Talk or presentation › Invited talk