Projects per year
Personal profile
Research Interests
Three-Dimensional Integrated Circuits, Heterogeneous Integration, Advanced Packaging Technologies
Experience
Education/Academic qualification
PhD, Massachusetts Institute of Technology
External positions
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Dive into the research topics where Kuan-Neng Chen is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Research and Development of Micro Electronics Division
1/01/22 → 31/12/22
Project: Government Ministry › Ministry of Science and Technology
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Ultra-high Bandwidth Memory And Logic Chip Integration System Platform Realized By Ultra-thin Wafer Stacking With Bumpless Structure
1/08/21 → 31/07/22
Project: Government Ministry › Ministry of Science and Technology
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110年強化與東協及南亞國家合作交流計畫
1/08/21 → 31/07/22
Project: Government Ministry › Ministry of Education(Include School)
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Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration
1/08/21 → 31/07/22
Project: Government Ministry › Ministry of Science and Technology
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新南向及全球先進國家優秀外國青年學子來臺蹲點計畫(TEEP@AsiaPlus)
1/10/19 → 30/06/23
Project: Government Ministry › Ministry of Education(Include School)
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Direct metal bonding using nanotwinned Ag films with (1 1 1) surface orientation under air atmosphere for heterogeneous integration
Chang, L. P., Wang, J. J., Hung, T. H., Chen, K. N. & Ouyang, F. Y., 1 Feb 2022, In: Applied Surface Science. 576, 151845.Research output: Contribution to journal › Article › peer-review
1 Scopus citations -
Study of Bondable Laser Release Material Using 355 nm Energy to Facilitate RDL-first and Die-first Fan-Out Wafer-Level Packaging (FOWLP)
Lee, C. H., Huang, B., See, J., Prenger, L., Lin, Y. M., Chiu, W. L., Lee, O. H. & Chen, K. N., 2022, (Accepted/In press) In: IEEE Transactions on Components, Packaging and Manufacturing Technology.Research output: Contribution to journal › Article › peer-review
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Advanced 2.5D Heterogeneous Integrated Platform Using Flexible Biocompatible Substrate for Biomedical Sensing System
Ku, S. Y., Chou, T. C., Tsai, Y. C., Chou, T. C., Hu, H. W., Fang, Y. R., Lin, Y. J., Huang, P-T., Chiou, J-C. & Chen, K-N., 2021, Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. Institute of Electrical and Electronics Engineers Inc., p. 1020-1025 6 p. (Proceedings - Electronic Components and Technology Conference; vol. 2021-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Asymmetric low temperature cu-polymer hybrid bonding with Au passivation layer
Weng, M. W., Mao, S. Y., Liu, D., Hu, H. W. & Chen, K. N., 19 Apr 2021, VLSI-TSA 2021 - 2021 International Symposium on VLSI Technology, Systems and Applications, Proceedings. Institute of Electrical and Electronics Engineers Inc., 9440101. (VLSI-TSA 2021 - 2021 International Symposium on VLSI Technology, Systems and Applications, Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Atomic Layer Deposition Plasma-Based Undoped-HfO2Ferroelectric FETs for Non-Volatile Memory
Luo, J. D., Lai, Y. Y., Hsiang, K. Y., Wu, C. F., Chung, H. T., Li, W. S., Liao, C. Y., Chen, P. G., Chen, K. N., Lee, M. H. & Cheng, H. C., Aug 2021, In: Ieee Electron Device Letters. 42, 8, p. 1152-1155 4 p., 9465799.Research output: Contribution to journal › Article › peer-review
2 Scopus citations
Prizes
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Excellent Young Electrical Engineer Award, Chinese Institute of Electrical Engineering
Chen, Kuan-Neng (Recipient), 2012
Prize: Honorary award
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IEEE EPS Exceptional Technical Achievement Award
Chen, Kuan-Neng (Recipient), 2018
Prize: Honorary award
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Activities
- 1 Invited talk
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IEEE Interconnect Technology Conference (IITC)
Kuan-Neng Chen (Speaker)
4 Jun 2018Activity: Talk or presentation › Invited talk