Projects per year
Personal profile
Research Interests
Three-Dimensional Integrated Circuits, Heterogeneous Integration, Advanced Packaging Technologies
Experience
Education/Academic qualification
PhD, Massachusetts Institute of Technology
External positions
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Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration
1/08/21 → 31/07/22
Project: Government Ministry › Ministry of Science and Technology
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Research and Development of Micro Electronics Division
1/01/21 → 31/12/21
Project: Government Ministry › Ministry of Science and Technology
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新南向及全球先進國家優秀外國青年學子來臺蹲點計畫(TEEP@AsiaPlus)
1/10/19 → 30/06/22
Project: Government Ministry › Ministry of Education(Include School)
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Research and Development of Micro Electronics Division
1/01/23 → 31/12/23
Project: Government Ministry › Ministry of Science and Technology
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Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration
1/08/22 → 31/07/23
Project: Government Ministry › Ministry of Science and Technology
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Asymmetric low temperature cu-polymer hybrid bonding with Au passivation layer
Weng, M. W., Mao, S. Y., Liu, D., Hu, H. W. & Chen, K. N., 19 Apr 2021, VLSI-TSA 2021 - 2021 International Symposium on VLSI Technology, Systems and Applications, Proceedings. Institute of Electrical and Electronics Engineers Inc., 9440101. (VLSI-TSA 2021 - 2021 International Symposium on VLSI Technology, Systems and Applications, Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Effect of Crystallinity on the Electrical Characteristics of Poly-Si Tunneling FETs via Green Nanosecond Laser Crystallization
Chung, H-T., Chen, C-T., Li, Y-S., Liu, Y-W., Liao, C-Y., Huang, W-H., Shieh, J-M., Luo, J-D., Li, W-S., Chuang, K-C., Chen, K-N. & Cheng, H-C., Feb 2021, In: Ieee Electron Device Letters. 42, 2, p. 164-167 4 p., 9314229.Research output: Contribution to journal › Article › peer-review
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Electrical and Reliability Investigation of Cu-to-Cu Bonding with Silver Passivation Layer in 3D Integration
Chou, T. C., Huang, S. Y., Chen, P. J., Hu, H. W., Liu, D., Chang, C. W., Ni, T. H., Chen, C. J., Lin, Y. M., Chang, T. C. & Chen, K-N., Jan 2021, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11, 1, p. 36-42 7 p.Research output: Contribution to journal › Article › peer-review
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Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through-Silicon Via
Tsai, Y. C., Lee, C. H., Chang, H. C., Liu, J. H., Hu, H. W., Ito, H., Kim, Y. S., Ohba, T. & Chen, K. N., 2021, (Accepted/In press) In: IEEE Transactions on Electron Devices.Research output: Contribution to journal › Article › peer-review
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Ferroelectric Undoped HfOx Capacitor With Symmetric Synaptic for Neural Network Accelerator
Luo, J-D., Lai, Y-Y., Hsiang, K-Y., Wu, C-F., Yeh, Y-T., Chung, H-T., Li, Y-S., Chuang, K-C., Li, W-S., Liao, C-Y., Chen, P-G., Chen, K-N., Lee, M-H. & Cheng, H-C., Mar 2021, In: IEEE Transactions on Electron Devices. 68, 3, p. 1374-1377 4 p.Research output: Contribution to journal › Article › peer-review
Prizes
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Excellent Young Electrical Engineer Award, Chinese Institute of Electrical Engineering
Chen, Kuan-Neng (Recipient), 2012
Prize: Honorary award
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IEEE EPS Exceptional Technical Achievement Award
Chen, Kuan-Neng (Recipient), 2018
Prize: Honorary award
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Activities
- 1 Invited talk
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IEEE Interconnect Technology Conference (IITC)
Kuan-Neng Chen (Speaker)
4 Jun 2018Activity: Talk or presentation › Invited talk